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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    346-43-161-41-013000

    346-43-161-41-013000

    CONN SOCKET SIP 61POS GOLD

    Mill-Max Manufacturing Corp.

    		 2,057
    RFQ
    		346-43-161-41-013000

    Datasheet

         		346 Bulk Active SIP 61 (1 x 61) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    104-13-316-41-780000

    104-13-316-41-780000

    CONN IC DIP SOCKET 16POS GOLD

    Mill-Max Manufacturing Corp.

    		 3,567
    RFQ
    		104-13-316-41-780000

    Datasheet

         		104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
    HLS-0313-G-22

    HLS-0313-G-22

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 3,665
    RFQ
    		HLS-0313-G-22

    Datasheet

         		HLS Tube Active SIP 39 (3 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    HLS-0312-G-11

    HLS-0312-G-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 2,620
    RFQ
    		HLS-0312-G-11

    Datasheet

         		HLS Tube Active SIP 36 (3 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    510-83-280-19-081101

    510-83-280-19-081101

    CONN SOCKET PGA 280POS GOLD

    Preci-Dip

    		 3,109
    RFQ
    		510-83-280-19-081101

    Datasheet

         		510 Bulk Active PGA 280 (19 x 19) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    24-3571-10

    24-3571-10

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    		 2,684
    RFQ
    		24-3571-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    24-3572-10

    24-3572-10

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    		 2,093
    RFQ
    		24-3572-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    24-3573-10

    24-3573-10

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    		 3,415
    RFQ
    		24-3573-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    24-3574-10

    24-3574-10

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    		 2,794
    RFQ
    		24-3574-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    24-6571-10

    24-6571-10

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    		 4,728
    RFQ
    		24-6571-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    24-6572-10

    24-6572-10

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    		 4,256
    RFQ
    		24-6572-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    24-6573-10

    24-6573-10

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    		 2,093
    RFQ
    		24-6573-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    546-87-149-15-063135

    546-87-149-15-063135

    CONN SOCKET PGA 149POS GOLD

    Preci-Dip

    		 4,702
    RFQ
    		546-87-149-15-063135

    Datasheet

         		546 Bulk Active PGA 149 (15 x 15) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    546-87-149-15-063136

    546-87-149-15-063136

    CONN SOCKET PGA 149POS GOLD

    Preci-Dip

    		 3,229
    RFQ
    		546-87-149-15-063136

    Datasheet

         		546 Bulk Active PGA 149 (15 x 15) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    32-3574-10

    32-3574-10

    CONN IC DIP SOCKET ZIF 32POS

    Aries Electronics

    		 3,041
    RFQ
    		32-3574-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    605-93-322-11-480000

    605-93-322-11-480000

    SOCKET CARRIER LOWPRO .300 22POS

    Mill-Max Manufacturing Corp.

    		 3,515
    RFQ
    		605-93-322-11-480000

    Datasheet

         		605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-93-422-11-480000

    605-93-422-11-480000

    SOCKET CARRIER LOWPRO .400 22POS

    Mill-Max Manufacturing Corp.

    		 3,455
    RFQ
    		605-93-422-11-480000

    Datasheet

         		605 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-43-322-11-480000

    605-43-322-11-480000

    SKT CARRIER LOWPRO

    Mill-Max Manufacturing Corp.

    		 4,727
    RFQ
    		605-43-322-11-480000

    Datasheet

         		605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-43-422-11-480000

    605-43-422-11-480000

    SKT CARRIER LOWPRO

    Mill-Max Manufacturing Corp.

    		 2,270
    RFQ
    		605-43-422-11-480000

    Datasheet

         		605 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICO-640-ZMGG

    ICO-640-ZMGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    		 4,173
    RFQ
    		ICO-640-ZMGG

    Datasheet

         		ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
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