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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    APH-1610-G-R

    APH-1610-G-R

    APH-1610-G-R

    Samtec Inc.

    		 3,676
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1410-G-R

    APH-1410-G-R

    APH-1410-G-R

    Samtec Inc.

    		 4,388
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1710-G-R

    APH-1710-G-R

    APH-1710-G-R

    Samtec Inc.

    		 2,911
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    28-6823-90

    28-6823-90

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    		 2,393
    RFQ
    		28-6823-90

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    30-0501-30

    30-0501-30

    CONN SOCKET SIP 30POS TIN

    Aries Electronics

    		 4,233
    RFQ
    		30-0501-30

    Datasheet

         		501 Bulk Active SIP 30 (1 x 30) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    32-6508-302

    32-6508-302

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    		 2,983
    RFQ
    		32-6508-302

    Datasheet

         		508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    614-83-100-10-000112

    614-83-100-10-000112

    CONN SOCKET PGA 100POS GOLD

    Preci-Dip

    		 3,217
    RFQ
    		614-83-100-10-000112

    Datasheet

         		614 Bulk Active PGA 100 (10 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    26-6621-30

    26-6621-30

    CONN IC DIP SOCKET 26POS TIN

    Aries Electronics

    		 2,136
    RFQ
    		26-6621-30

    Datasheet

         		6621 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    126-41-328-41-001000

    126-41-328-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,032
    RFQ
    		126-41-328-41-001000

    Datasheet

         		126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-41-428-41-001000

    126-41-428-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,754
    RFQ
    		126-41-428-41-001000

    Datasheet

         		126 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-41-628-41-001000

    126-41-628-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,669
    RFQ
    		126-41-628-41-001000

    Datasheet

         		126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-91-328-41-001000

    126-91-328-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,082
    RFQ
    		126-91-328-41-001000

    Datasheet

         		126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-91-428-41-001000

    126-91-428-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,408
    RFQ
    		126-91-428-41-001000

    Datasheet

         		126 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-91-628-41-001000

    126-91-628-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,791
    RFQ
    		126-91-628-41-001000

    Datasheet

         		126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-41-652-41-105000

    110-41-652-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,733
    RFQ
    		110-41-652-41-105000

    Datasheet

         		110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-41-952-41-105000

    110-41-952-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,288
    RFQ
    		110-41-952-41-105000

    Datasheet

         		110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-91-652-41-105000

    110-91-652-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,241
    RFQ
    		110-91-652-41-105000

    Datasheet

         		110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-91-952-41-105000

    110-91-952-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,342
    RFQ
    		110-91-952-41-105000

    Datasheet

         		110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    550-10-084-13-081101

    550-10-084-13-081101

    PGA SOLDER TAIL

    Preci-Dip

    		 2,989
    RFQ
    		550-10-084-13-081101

    Datasheet

         		550 Bulk Active PGA 84 (13 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    124-93-316-41-002000

    124-93-316-41-002000

    CONN IC DIP SOCKET 16POS GOLD

    Mill-Max Manufacturing Corp.

    		 2,918
    RFQ
    		124-93-316-41-002000

    Datasheet

         		124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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