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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    517-87-325-18-111111

    517-87-325-18-111111

    CONN SOCKET PGA 325POS GOLD

    Preci-Dip

    		 4,950
    RFQ
    		517-87-325-18-111111

    Datasheet

         		517 Bulk Active PGA 325 (18 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    111-93-642-41-001000

    111-93-642-41-001000

    CONN IC DIP SOCKET 42POS GOLD

    Mill-Max Manufacturing Corp.

    		 3,688
    RFQ
    		111-93-642-41-001000

    Datasheet

         		111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-43-642-41-001000

    111-43-642-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,594
    RFQ
    		111-43-642-41-001000

    Datasheet

         		111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    27-0501-31

    27-0501-31

    CONN SOCKET SIP 27POS GOLD

    Aries Electronics

    		 3,902
    RFQ
    		27-0501-31

    Datasheet

         		501 Bulk Active SIP 27 (1 x 27) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    36-0501-20

    36-0501-20

    CONN SOCKET SIP 36POS TIN

    Aries Electronics

    		 3,731
    RFQ
    		36-0501-20

    Datasheet

         		501 Bulk Active SIP 36 (1 x 36) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    123-93-424-41-001000

    123-93-424-41-001000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    		 4,949
    RFQ
    		123-93-424-41-001000

    Datasheet

         		123 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    26-7590-10

    26-7590-10

    CONN SOCKET SIP 26POS TIN

    Aries Electronics

    		 2,549
    RFQ
    		26-7590-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 26 (1 x 26) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    26-7650-10

    26-7650-10

    CONN SOCKET SIP 26POS TIN

    Aries Electronics

    		 4,903
    RFQ
    		26-7650-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 26 (1 x 26) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    APH-0934-T-H

    APH-0934-T-H

    APH-0934-T-H

    Samtec Inc.

    		 2,865
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1434-T-H

    APH-1434-T-H

    APH-1434-T-H

    Samtec Inc.

    		 3,617
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0634-T-H

    APH-0634-T-H

    APH-0634-T-H

    Samtec Inc.

    		 4,490
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1334-T-H

    APH-1334-T-H

    APH-1334-T-H

    Samtec Inc.

    		 3,597
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0334-T-H

    APH-0334-T-H

    APH-0334-T-H

    Samtec Inc.

    		 2,516
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1634-T-H

    APH-1634-T-H

    APH-1634-T-H

    Samtec Inc.

    		 2,789
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0834-T-H

    APH-0834-T-H

    APH-0834-T-H

    Samtec Inc.

    		 4,399
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0734-T-H

    APH-0734-T-H

    APH-0734-T-H

    Samtec Inc.

    		 2,626
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0234-T-H

    APH-0234-T-H

    APH-0234-T-H

    Samtec Inc.

    		 3,934
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    116-93-432-41-006000

    116-93-432-41-006000

    CONN IC DIP SOCKET 32POS GOLD

    Mill-Max Manufacturing Corp.

    		 3,789
    RFQ
    		116-93-432-41-006000

    Datasheet

         		116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-632-41-006000

    116-93-632-41-006000

    CONN IC DIP SOCKET 32POS GOLD

    Mill-Max Manufacturing Corp.

    		 2,145
    RFQ
    		116-93-632-41-006000

    Datasheet

         		116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-432-41-006000

    116-43-432-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,359
    RFQ
    		116-43-432-41-006000

    Datasheet

         		116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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