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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    612-93-322-41-004000

    612-93-322-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    		 3,690
    RFQ
    		612-93-322-41-004000

    Datasheet

         		612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-93-422-41-004000

    612-93-422-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    		 4,234
    RFQ
    		612-93-422-41-004000

    Datasheet

         		612 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    30-6823-90

    30-6823-90

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    		 2,096
    RFQ
    		30-6823-90

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    110-13-314-61-001000

    110-13-314-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,780
    RFQ

    -

    		 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-41-314-61-001000

    110-41-314-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,612
    RFQ

    -

    		 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-91-314-61-001000

    110-91-314-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,720
    RFQ

    -

    		 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-99-314-61-001000

    110-99-314-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,763
    RFQ

    -

    		 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-43-314-61-003000

    115-43-314-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,653
    RFQ

    -

    		 115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APO-318-G-B

    APO-318-G-B

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    		 3,975
    RFQ
    		APO-318-G-B

    Datasheet

         		APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    612-13-320-41-001000

    612-13-320-41-001000

    SOCKET CARRIER SLDRTL .300 20POS

    Mill-Max Manufacturing Corp.

    		 3,918
    RFQ
    		612-13-320-41-001000

    Datasheet

         		612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-13-420-41-001000

    612-13-420-41-001000

    SOCKET CARRIER SLDRTL .400 20POS

    Mill-Max Manufacturing Corp.

    		 2,663
    RFQ
    		612-13-420-41-001000

    Datasheet

         		612 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    114-47-952-41-117000

    114-47-952-41-117000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    		 2,562
    RFQ
    		114-47-952-41-117000

    Datasheet

         		114 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    546-87-168-17-101135

    546-87-168-17-101135

    CONN SOCKET PGA 168POS GOLD

    Preci-Dip

    		 2,823
    RFQ
    		546-87-168-17-101135

    Datasheet

         		546 Bulk Active PGA 168 (17 x 17) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    546-87-168-17-101136

    546-87-168-17-101136

    CONN SOCKET PGA 168POS GOLD

    Preci-Dip

    		 4,427
    RFQ
    		546-87-168-17-101136

    Datasheet

         		546 Bulk Active PGA 168 (17 x 17) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    26-1508-21

    26-1508-21

    CONN IC DIP SOCKET 26POS GOLD

    Aries Electronics

    		 2,667
    RFQ
    		26-1508-21

    Datasheet

         		508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    26-1508-31

    26-1508-31

    CONN IC DIP SOCKET 26POS GOLD

    Aries Electronics

    		 4,054
    RFQ
    		26-1508-31

    Datasheet

         		508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    612-41-328-41-003000

    612-41-328-41-003000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    		 4,270
    RFQ
    		612-41-328-41-003000

    Datasheet

         		612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-41-428-41-003000

    612-41-428-41-003000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    		 4,187
    RFQ
    		612-41-428-41-003000

    Datasheet

         		612 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-41-628-41-003000

    612-41-628-41-003000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    		 3,123
    RFQ
    		612-41-628-41-003000

    Datasheet

         		612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-91-328-41-003000

    612-91-328-41-003000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    		 4,056
    RFQ
    		612-91-328-41-003000

    Datasheet

         		612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 663664665666667668669670...955Next»
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