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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    115-43-328-61-003000

    115-43-328-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,942
    RFQ

    -

    		 115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    115-93-328-61-001000

    115-93-328-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,268
    RFQ

    -

    		 115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    ICO-648-MGG

    ICO-648-MGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    		 4,510
    RFQ
    		ICO-648-MGG

    Datasheet

         		ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
    121-PGM13012-10

    121-PGM13012-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    		 4,748
    RFQ
    		121-PGM13012-10

    Datasheet

         		PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    315-13-132-41-001000

    315-13-132-41-001000

    SOCKET LOW PROFILE SIP 32POS

    Mill-Max Manufacturing Corp.

    		 2,208
    RFQ

    -

    		 315 Tube Active SIP 32 (1 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
    30-7360-10

    30-7360-10

    CONN SOCKET SIP 30POS TIN

    Aries Electronics

    		 3,800
    RFQ
    		30-7360-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 30 (1 x 30) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    30-7365-10

    30-7365-10

    CONN SOCKET SIP 30POS TIN

    Aries Electronics

    		 4,372
    RFQ
    		30-7365-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 30 (1 x 30) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    30-7374-10

    30-7374-10

    CONN SOCKET SIP 30POS TIN

    Aries Electronics

    		 2,461
    RFQ
    		30-7374-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 30 (1 x 30) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    30-7375-10

    30-7375-10

    CONN SOCKET SIP 30POS TIN

    Aries Electronics

    		 3,190
    RFQ
    		30-7375-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 30 (1 x 30) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    30-7400-10

    30-7400-10

    CONN SOCKET SIP 30POS TIN

    Aries Electronics

    		 3,565
    RFQ
    		30-7400-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 30 (1 x 30) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    30-7430-10

    30-7430-10

    CONN SOCKET SIP 30POS TIN

    Aries Electronics

    		 3,256
    RFQ
    		30-7430-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 30 (1 x 30) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    30-7435-10

    30-7435-10

    CONN SOCKET SIP 30POS TIN

    Aries Electronics

    		 3,585
    RFQ
    		30-7435-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 30 (1 x 30) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    30-7437-10

    30-7437-10

    CONN SOCKET SIP 30POS TIN

    Aries Electronics

    		 3,157
    RFQ
    		30-7437-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 30 (1 x 30) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    30-7472-10

    30-7472-10

    CONN SOCKET SIP 30POS TIN

    Aries Electronics

    		 3,031
    RFQ
    		30-7472-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 30 (1 x 30) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    30-7920-10

    30-7920-10

    CONN SOCKET SIP 30POS TIN

    Aries Electronics

    		 3,685
    RFQ
    		30-7920-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 30 (1 x 30) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    30-7970-10

    30-7970-10

    CONN SOCKET SIP 30POS TIN

    Aries Electronics

    		 4,330
    RFQ
    		30-7970-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 30 (1 x 30) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    126-93-210-41-003000

    126-93-210-41-003000

    CONN IC DIP SOCKET 10POS GOLD

    Mill-Max Manufacturing Corp.

    		 2,594
    RFQ
    		126-93-210-41-003000

    Datasheet

         		126 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    126-43-210-41-003000

    126-43-210-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,983
    RFQ
    		126-43-210-41-003000

    Datasheet

         		126 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    612-13-318-41-001000

    612-13-318-41-001000

    SOCKET CARRIER SLDRTL .300 18POS

    Mill-Max Manufacturing Corp.

    		 4,133
    RFQ
    		612-13-318-41-001000

    Datasheet

         		612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
    116-93-432-41-007000

    116-93-432-41-007000

    CONN IC DIP SOCKET 32POS GOLD

    Mill-Max Manufacturing Corp.

    		 3,716
    RFQ
    		116-93-432-41-007000

    Datasheet

         		116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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