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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    124-93-322-41-002000

    124-93-322-41-002000

    CONN IC DIP SOCKET 22POS GOLD

    Mill-Max Manufacturing Corp.

    2,722
    RFQ
    124-93-322-41-002000

    Datasheet

    124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    124-93-422-41-002000

    124-93-422-41-002000

    CONN IC DIP SOCKET 22POS GOLD

    Mill-Max Manufacturing Corp.

    3,757
    RFQ
    124-93-422-41-002000

    Datasheet

    124 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    124-43-322-41-002000

    124-43-322-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,619
    RFQ
    124-43-322-41-002000

    Datasheet

    124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    124-43-422-41-002000

    124-43-422-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,827
    RFQ
    124-43-422-41-002000

    Datasheet

    124 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-93-428-41-001000

    123-93-428-41-001000

    CONN IC DIP SOCKET 28POS GOLD

    Mill-Max Manufacturing Corp.

    4,276
    RFQ
    123-93-428-41-001000

    Datasheet

    123 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    40-6501-21

    40-6501-21

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    4,898
    RFQ
    40-6501-21

    Datasheet

    501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    116-41-652-41-006000

    116-41-652-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,662
    RFQ
    116-41-652-41-006000

    Datasheet

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-652-41-006000

    116-91-652-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,616
    RFQ
    116-91-652-41-006000

    Datasheet

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    714-93-132-31-007000

    714-93-132-31-007000

    SOCKET CARRIER SIP 32POS

    Mill-Max Manufacturing Corp.

    4,095
    RFQ
    714-93-132-31-007000

    Datasheet

    714 Tube Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-13-636-41-001000

    110-13-636-41-001000

    CONN IC DIP SOCKET 36POS GOLD

    Mill-Max Manufacturing Corp.

    4,625
    RFQ
    110-13-636-41-001000

    Datasheet

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICO-322-BGG

    ICO-322-BGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,841
    RFQ
    ICO-322-BGG

    Datasheet

    ICO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    116-47-432-41-001000

    116-47-432-41-001000

    STANDRD SOLDRTL

    Mill-Max Manufacturing Corp.

    4,332
    RFQ
    116-47-432-41-001000

    Datasheet

    116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-47-632-41-001000

    116-47-632-41-001000

    STANDRD SOLDRTL

    Mill-Max Manufacturing Corp.

    2,134
    RFQ
    116-47-632-41-001000

    Datasheet

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    23-0503-31

    23-0503-31

    CONN SOCKET SIP 23POS GOLD

    Aries Electronics

    4,677
    RFQ
    23-0503-31

    Datasheet

    0503 Bulk Active SIP 23 (1 x 23) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    111-41-952-41-001000

    111-41-952-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,981
    RFQ
    111-41-952-41-001000

    Datasheet

    111 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-91-952-41-001000

    111-91-952-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,877
    RFQ
    111-91-952-41-001000

    Datasheet

    111 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    21-0511-11

    21-0511-11

    CONN SOCKET SIP 21POS GOLD

    Aries Electronics

    4,439
    RFQ
    21-0511-11

    Datasheet

    511 Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    115-41-950-41-001000

    115-41-950-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,564
    RFQ
    115-41-950-41-001000

    Datasheet

    115 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-91-950-41-001000

    115-91-950-41-001000

    SKT IC OPEN LOWPRO

    Mill-Max Manufacturing Corp.

    3,503
    RFQ
    115-91-950-41-001000

    Datasheet

    115 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    316-93-132-41-003000

    316-93-132-41-003000

    SOCKET ELEVATED SIP 32POS

    Mill-Max Manufacturing Corp.

    4,824
    RFQ
    316-93-132-41-003000

    Datasheet

    316 Tube Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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