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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    126-41-648-41-001000

    126-41-648-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,463
    RFQ
    		126-41-648-41-001000

    Datasheet

         		126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-91-648-41-001000

    126-91-648-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,648
    RFQ
    		126-91-648-41-001000

    Datasheet

         		126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-93-964-41-105000

    110-93-964-41-105000

    CONN IC DIP SOCKET 64POS GOLD

    Mill-Max Manufacturing Corp.

    		 2,851
    RFQ
    		110-93-964-41-105000

    Datasheet

         		110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-43-964-41-105000

    110-43-964-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,313
    RFQ
    		110-43-964-41-105000

    Datasheet

         		110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-93-628-41-801000

    123-93-628-41-801000

    CONN IC DIP SOCKET 28POS GOLD

    Mill-Max Manufacturing Corp.

    		 2,007
    RFQ
    		123-93-628-41-801000

    Datasheet

         		123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-99-420-61-001000

    110-99-420-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,102
    RFQ

    -

    		 110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0320-G-2

    HLS-0320-G-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 3,487
    RFQ
    		HLS-0320-G-2

    Datasheet

         		HLS Tube Active SIP 60 (3 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    116-43-306-61-003000

    116-43-306-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,127
    RFQ

    -

    		 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-306-61-003000

    116-93-306-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,175
    RFQ

    -

    		 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    114-93-952-41-117000

    114-93-952-41-117000

    CONN IC DIP SOCKET 52POS GOLD

    Mill-Max Manufacturing Corp.

    		 4,493
    RFQ
    		114-93-952-41-117000

    Datasheet

         		114 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    114-43-952-41-117000

    114-43-952-41-117000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,942
    RFQ
    		114-43-952-41-117000

    Datasheet

         		114 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    122-13-316-41-801000

    122-13-316-41-801000

    CONN IC DIP SOCKET 16POS GOLD

    Mill-Max Manufacturing Corp.

    		 3,226
    RFQ
    		122-13-316-41-801000

    Datasheet

         		122 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-93-640-41-001000

    126-93-640-41-001000

    CONN IC DIP SOCKET 40POS GOLD

    Mill-Max Manufacturing Corp.

    		 2,308
    RFQ
    		126-93-640-41-001000

    Datasheet

         		126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-43-640-41-001000

    126-43-640-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,861
    RFQ
    		126-43-640-41-001000

    Datasheet

         		126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    550-80-169-17-101101

    550-80-169-17-101101

    PGA SOLDER TAIL

    Preci-Dip

    		 2,383
    RFQ
    		550-80-169-17-101101

    Datasheet

         		550 Bulk Active PGA 169 (17 x 17) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    123-91-648-41-001000

    123-91-648-41-001000

    SOCKET IC OPEN 3 LVL .600 48POS

    Mill-Max Manufacturing Corp.

    		 4,332
    RFQ

    -

    		 123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-41-648-41-001000

    123-41-648-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,508
    RFQ
    		123-41-648-41-001000

    Datasheet

         		123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    28-3551-11

    28-3551-11

    CONN IC DIP SOCKET ZIF 28POS GLD

    Aries Electronics

    		 2,544
    RFQ
    		28-3551-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    28-3552-11

    28-3552-11

    CONN IC DIP SOCKET ZIF 28POS GLD

    Aries Electronics

    		 3,200
    RFQ
    		28-3552-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    42-3571-10

    42-3571-10

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    		 3,366
    RFQ
    		42-3571-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
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