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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
126-41-648-41-001000CONN IC SKT DBL |
3,463 |
|
Datasheet |
126 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
126-91-648-41-001000CONN IC SKT DBL |
3,648 |
|
Datasheet |
126 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
110-93-964-41-105000CONN IC DIP SOCKET 64POS GOLD |
2,851 |
|
Datasheet |
110 | Tube | Active | DIP, 0.9" (22.86mm) Row Spacing | 64 (2 x 32) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
110-43-964-41-105000CONN IC SKT DBL |
4,313 |
|
Datasheet |
110 | Tube | Active | DIP, 0.9" (22.86mm) Row Spacing | 64 (2 x 32) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
123-93-628-41-801000CONN IC DIP SOCKET 28POS GOLD |
2,007 |
|
Datasheet |
123 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame, Decoupling Capacitor | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
110-99-420-61-001000CONN IC SKT DBL |
4,102 |
|
- |
110 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 20 (2 x 10) | Tin-Lead | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
HLS-0320-G-2.100" SCREW MACHINE SOCKET ARRAY |
3,487 |
|
Datasheet |
HLS | Tube | Active | SIP | 60 (3 x 20) | Gold | 30.0µin (0.76µm) | - | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 140°C | Gold | Thermoplastic | 10.0µin (0.25µm) | - |
|
|
116-43-306-61-003000CONN IC SKT DBL |
3,127 |
|
- |
116 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
116-93-306-61-003000CONN IC SKT DBL |
3,175 |
|
- |
116 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
114-93-952-41-117000CONN IC DIP SOCKET 52POS GOLD |
4,493 |
|
Datasheet |
114 | Tube | Active | DIP, 0.9" (22.86mm) Row Spacing | 52 (2 x 26) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
114-43-952-41-117000CONN IC SKT DBL |
4,942 |
|
Datasheet |
114 | Tube | Active | DIP, 0.9" (22.86mm) Row Spacing | 52 (2 x 26) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
122-13-316-41-801000CONN IC DIP SOCKET 16POS GOLD |
3,226 |
|
Datasheet |
122 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame, Decoupling Capacitor | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 10.0µin (0.25µm) | Brass Alloy |
|
|
126-93-640-41-001000CONN IC DIP SOCKET 40POS GOLD |
2,308 |
|
Datasheet |
126 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
126-43-640-41-001000CONN IC SKT DBL |
2,861 |
|
Datasheet |
126 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
550-80-169-17-101101PGA SOLDER TAIL |
2,383 |
|
Datasheet |
550 | Bulk | Active | PGA | 169 (17 x 17) | Tin | - | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
123-91-648-41-001000SOCKET IC OPEN 3 LVL .600 48POS |
4,332 |
|
- |
123 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
123-41-648-41-001000CONN IC SKT DBL |
3,508 |
|
Datasheet |
123 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
28-3551-11CONN IC DIP SOCKET ZIF 28POS GLD |
2,544 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Gold | Polyphenylene Sulfide (PPS), Glass Filled | - | Beryllium Copper |
|
|
28-3552-11CONN IC DIP SOCKET ZIF 28POS GLD |
3,200 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Gold | Polyphenylene Sulfide (PPS), Glass Filled | - | Beryllium Copper |
|
|
42-3571-10CONN IC DIP SOCKET ZIF 42POS TIN |
3,366 |
|
Datasheet |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 42 (2 x 21) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyphenylene Sulfide (PPS), Glass Filled | 200.0µin (5.08µm) | Beryllium Copper |
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