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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    546-83-149-15-063136

    546-83-149-15-063136

    CONN SOCKET PGA 149POS GOLD

    Preci-Dip

    		 3,501
    RFQ
    		546-83-149-15-063136

    Datasheet

         		546 Bulk Active PGA 149 (15 x 15) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    APA-320-G-Q

    APA-320-G-Q

    ADAPTER PLUG

    Samtec Inc.

    		 3,060
    RFQ
    		APA-320-G-Q

    Datasheet

         		APA Tube Active - 20 (2 x 10) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    614-41-650-31-007000

    614-41-650-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 2,794
    RFQ
    		614-41-650-31-007000

    Datasheet

         		614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-650-31-007000

    614-91-650-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 2,793
    RFQ
    		614-91-650-31-007000

    Datasheet

         		614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    8058-1G19

    8058-1G19

    CONN TRANSIST TO-5 8POS GOLD

    TE Connectivity AMP Connectors

    		 3,583
    RFQ
    		8058-1G19

    Datasheet

         		8058 Bulk Obsolete Transistor, TO-5 8 (Round) - Gold - Beryllium Copper Panel Mount - Solder Cup - Gold - Brass Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
    126-93-642-41-001000

    126-93-642-41-001000

    CONN IC DIP SOCKET 42POS GOLD

    Mill-Max Manufacturing Corp.

    		 4,534
    RFQ
    		126-93-642-41-001000

    Datasheet

         		126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-43-642-41-001000

    126-43-642-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,919
    RFQ
    		126-43-642-41-001000

    Datasheet

         		126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-91-420-61-001000

    110-91-420-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,994
    RFQ

    -

    		 110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APA-632-G-N

    APA-632-G-N

    ADAPTER PLUG

    Samtec Inc.

    		 3,214
    RFQ
    		APA-632-G-N

    Datasheet

         		APA Tube Active - 32 (2 x 16) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    110-93-308-61-605000

    110-93-308-61-605000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,089
    RFQ

    -

    		 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    50-9503-20

    50-9503-20

    CONN IC DIP SOCKET 50POS GOLD

    Aries Electronics

    		 4,803
    RFQ
    		50-9503-20

    Datasheet

         		503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    50-9503-30

    50-9503-30

    CONN IC DIP SOCKET 50POS GOLD

    Aries Electronics

    		 3,745
    RFQ
    		50-9503-30

    Datasheet

         		503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    126-41-650-41-001000

    126-41-650-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,319
    RFQ
    		126-41-650-41-001000

    Datasheet

         		126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-91-650-41-001000

    126-91-650-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,361
    RFQ
    		126-91-650-41-001000

    Datasheet

         		126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-93-642-41-001000

    123-93-642-41-001000

    CONN IC DIP SOCKET 42POS GOLD

    Mill-Max Manufacturing Corp.

    		 3,845
    RFQ
    		123-93-642-41-001000

    Datasheet

         		123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-43-642-41-001000

    123-43-642-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,143
    RFQ
    		123-43-642-41-001000

    Datasheet

         		123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-93-640-41-001000

    614-93-640-41-001000

    SOCKET CARRIER LOWPRO .600 40POS

    Mill-Max Manufacturing Corp.

    		 4,181
    RFQ
    		614-93-640-41-001000

    Datasheet

         		614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-640-41-001000

    614-43-640-41-001000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 3,475
    RFQ
    		614-43-640-41-001000

    Datasheet

         		614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-950-41-006000

    116-93-950-41-006000

    CONN IC DIP SOCKET 50POS GOLD

    Mill-Max Manufacturing Corp.

    		 2,832
    RFQ
    		116-93-950-41-006000

    Datasheet

         		116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-950-41-006000

    116-43-950-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,735
    RFQ
    		116-43-950-41-006000

    Datasheet

         		116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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