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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    517-87-403-19-111111

    517-87-403-19-111111

    CONN SOCKET PGA 403POS GOLD

    Preci-Dip

    3,455
    RFQ
    517-87-403-19-111111

    Datasheet

    517 Bulk Active PGA 403 (19 x 19) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    546-83-148-15-063135

    546-83-148-15-063135

    CONN SOCKET PGA 148POS GOLD

    Preci-Dip

    4,964
    RFQ
    546-83-148-15-063135

    Datasheet

    546 Bulk Active PGA 148 (15 x 15) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    546-83-148-15-063136

    546-83-148-15-063136

    CONN SOCKET PGA 148POS GOLD

    Preci-Dip

    3,451
    RFQ
    546-83-148-15-063136

    Datasheet

    546 Bulk Active PGA 148 (15 x 15) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-41-652-41-008000

    116-41-652-41-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,365
    RFQ
    116-41-652-41-008000

    Datasheet

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-652-41-008000

    116-91-652-41-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,472
    RFQ
    116-91-652-41-008000

    Datasheet

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0308-G-3

    HLS-0308-G-3

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,263
    RFQ
    HLS-0308-G-3

    Datasheet

    HLS Tube Active SIP 24 (3 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    40-6570-10

    40-6570-10

    CONN IC DIP SOCKET ZIF 40POS TIN

    Aries Electronics

    2,898
    RFQ
    40-6570-10

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    116-43-306-61-008000

    116-43-306-61-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,705
    RFQ

    -

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    415-93-272-41-003000

    415-93-272-41-003000

    SOCKET DUAL INLINE LOW PRO 72POS

    Mill-Max Manufacturing Corp.

    2,830
    RFQ
    415-93-272-41-003000

    Datasheet

    415 Tube Active DIP, 0.1" (2.54mm) Row Spacing 72 (2 x 36) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-91-318-61-001000

    110-91-318-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,038
    RFQ

    -

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-1202-G-12

    HLS-1202-G-12

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,696
    RFQ
    HLS-1202-G-12

    Datasheet

    HLS Bulk Active SIP 24 (12 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    24-6556-21

    24-6556-21

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    4,369
    RFQ
    24-6556-21

    Datasheet

    6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    24-6556-31

    24-6556-31

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    2,752
    RFQ
    24-6556-31

    Datasheet

    6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    110-13-310-61-001000

    110-13-310-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,659
    RFQ

    -

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-41-642-41-002000

    126-41-642-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,036
    RFQ
    126-41-642-41-002000

    Datasheet

    126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-91-642-41-002000

    126-91-642-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,201
    RFQ
    126-91-642-41-002000

    Datasheet

    126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-652-41-003000

    116-93-652-41-003000

    CONN IC DIP SOCKET 52POS GOLD

    Mill-Max Manufacturing Corp.

    3,897
    RFQ
    116-93-652-41-003000

    Datasheet

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-652-41-003000

    116-43-652-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,883
    RFQ
    116-43-652-41-003000

    Datasheet

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICO-648-NGG

    ICO-648-NGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,721
    RFQ
    ICO-648-NGG

    Datasheet

    ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    HLS-0813-TT-2

    HLS-0813-TT-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,955
    RFQ
    HLS-0813-TT-2

    Datasheet

    HLS Bulk Active SIP 104 (8 x 13) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
    Total 19086 Record«Prev1... 726727728729730731732733...955Next»
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