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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    116-91-950-41-007000

    116-91-950-41-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,239
    RFQ
    		116-91-950-41-007000

    Datasheet

         		116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    HLS-0220-G-12

    HLS-0220-G-12

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 3,501
    RFQ
    		HLS-0220-G-12

    Datasheet

         		HLS Tube Active SIP 40 (2 x 20) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
    110-93-064-01-505000

    110-93-064-01-505000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,785
    RFQ
    		110-93-064-01-505000

    Datasheet

         		110 Tube Active - 64 (2 x 32) Gold 30.0µin (0.76µm) - - - 0.100" (2.54mm) - 0.100" (2.54mm) - Tin-Lead - 200.0µin (5.08µm) -
    44-6556-11

    44-6556-11

    CONN IC DIP SOCKET 44POS GOLD

    Aries Electronics

    		 4,424
    RFQ
    		44-6556-11

    Datasheet

         		6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 44 (2 x 22) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled 10.0µin (0.25µm) Brass
    605-93-648-11-480000

    605-93-648-11-480000

    SOCKET CARRIER LOWPRO .600 48POS

    Mill-Max Manufacturing Corp.

    		 2,765
    RFQ
    		605-93-648-11-480000

    Datasheet

         		605 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    605-43-648-11-480000

    605-43-648-11-480000

    SKT CARRIER LOWPRO

    Mill-Max Manufacturing Corp.

    		 4,555
    RFQ
    		605-43-648-11-480000

    Datasheet

         		605 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    110-13-210-61-001000

    110-13-210-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,478
    RFQ

    -

    		 110 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
    123-13-320-41-801000

    123-13-320-41-801000

    CONN IC DIP SOCKET 20POS GOLD

    Mill-Max Manufacturing Corp.

    		 4,724
    RFQ
    		123-13-320-41-801000

    Datasheet

         		123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
    24-6508-211

    24-6508-211

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    		 2,186
    RFQ
    		24-6508-211

    Datasheet

         		508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    24-6508-311

    24-6508-311

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    		 3,760
    RFQ
    		24-6508-311

    Datasheet

         		508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    116-43-210-61-003000

    116-43-210-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,240
    RFQ

    -

    		 116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    116-93-210-61-003000

    116-93-210-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,920
    RFQ

    -

    		 116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    28-6503-31

    28-6503-31

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    		 3,879
    RFQ
    		28-6503-31

    Datasheet

         		503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    APA-422-G-M

    APA-422-G-M

    ADAPTER PLUG

    Samtec Inc.

    		 2,633
    RFQ
    		APA-422-G-M

    Datasheet

         		APA Bulk Active - 22 (2 x 11) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 20.0µin (0.51µm) Phosphor Bronze
    APH-1836-T-T

    APH-1836-T-T

    APH-1836-T-T

    Samtec Inc.

    		 2,533
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1436-T-T

    APH-1436-T-T

    APH-1436-T-T

    Samtec Inc.

    		 2,764
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1636-T-T

    APH-1636-T-T

    APH-1636-T-T

    Samtec Inc.

    		 4,223
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0836-T-T

    APH-0836-T-T

    APH-0836-T-T

    Samtec Inc.

    		 4,820
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1736-T-T

    APH-1736-T-T

    APH-1736-T-T

    Samtec Inc.

    		 3,430
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    116-93-636-41-001000

    116-93-636-41-001000

    CONN IC DIP SOCKET 36POS GOLD

    Mill-Max Manufacturing Corp.

    		 3,692
    RFQ
    		116-93-636-41-001000

    Datasheet

         		116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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