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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    116-91-950-41-007000

    116-91-950-41-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,239
    RFQ
    		116-91-950-41-007000

    Datasheet

         		116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0220-G-12

    HLS-0220-G-12

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 3,501
    RFQ
    		HLS-0220-G-12

    Datasheet

         		HLS Tube Active SIP 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    110-93-064-01-505000

    110-93-064-01-505000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,785
    RFQ
    		110-93-064-01-505000

    Datasheet

         		110 Tube Active - 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - - - - 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) - - -
    44-6556-11

    44-6556-11

    CONN IC DIP SOCKET 44POS GOLD

    Aries Electronics

    		 4,424
    RFQ
    		44-6556-11

    Datasheet

         		6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    605-93-648-11-480000

    605-93-648-11-480000

    SOCKET CARRIER LOWPRO .600 48POS

    Mill-Max Manufacturing Corp.

    		 2,765
    RFQ
    		605-93-648-11-480000

    Datasheet

         		605 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-43-648-11-480000

    605-43-648-11-480000

    SKT CARRIER LOWPRO

    Mill-Max Manufacturing Corp.

    		 4,555
    RFQ
    		605-43-648-11-480000

    Datasheet

         		605 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-13-210-61-001000

    110-13-210-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,478
    RFQ

    -

    		 110 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-13-320-41-801000

    123-13-320-41-801000

    CONN IC DIP SOCKET 20POS GOLD

    Mill-Max Manufacturing Corp.

    		 4,724
    RFQ
    		123-13-320-41-801000

    Datasheet

         		123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    24-6508-211

    24-6508-211

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    		 2,186
    RFQ
    		24-6508-211

    Datasheet

         		508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    24-6508-311

    24-6508-311

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    		 3,760
    RFQ
    		24-6508-311

    Datasheet

         		508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    116-43-210-61-003000

    116-43-210-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,240
    RFQ

    -

    		 116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-210-61-003000

    116-93-210-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,920
    RFQ

    -

    		 116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    28-6503-31

    28-6503-31

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    		 3,879
    RFQ
    		28-6503-31

    Datasheet

         		503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    APA-422-G-M

    APA-422-G-M

    ADAPTER PLUG

    Samtec Inc.

    		 2,633
    RFQ
    		APA-422-G-M

    Datasheet

         		APA Bulk Active - 22 (2 x 11) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    APH-1836-T-T

    APH-1836-T-T

    APH-1836-T-T

    Samtec Inc.

    		 2,533
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1436-T-T

    APH-1436-T-T

    APH-1436-T-T

    Samtec Inc.

    		 2,764
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1636-T-T

    APH-1636-T-T

    APH-1636-T-T

    Samtec Inc.

    		 4,223
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0836-T-T

    APH-0836-T-T

    APH-0836-T-T

    Samtec Inc.

    		 4,820
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1736-T-T

    APH-1736-T-T

    APH-1736-T-T

    Samtec Inc.

    		 3,430
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    116-93-636-41-001000

    116-93-636-41-001000

    CONN IC DIP SOCKET 36POS GOLD

    Mill-Max Manufacturing Corp.

    		 3,692
    RFQ
    		116-93-636-41-001000

    Datasheet

         		116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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