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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    175-PGM16010-10

    175-PGM16010-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    		 3,862
    RFQ
    		175-PGM16010-10

    Datasheet

         		PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    110-93-320-61-801000

    110-93-320-61-801000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,432
    RFQ

    -

    		 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APO-632-T-T

    APO-632-T-T

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    		 2,571
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    124-41-636-41-002000

    124-41-636-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,561
    RFQ
    		124-41-636-41-002000

    Datasheet

         		124 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    124-91-636-41-002000

    124-91-636-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,090
    RFQ
    		124-91-636-41-002000

    Datasheet

         		124 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    24-0511-11

    24-0511-11

    CONN SOCKET SIP 24POS GOLD

    Aries Electronics

    		 3,771
    RFQ
    		24-0511-11

    Datasheet

         		511 Bulk Active SIP 24 (1 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    612-41-640-41-004000

    612-41-640-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    		 4,583
    RFQ
    		612-41-640-41-004000

    Datasheet

         		612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-91-640-41-004000

    612-91-640-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    		 3,602
    RFQ
    		612-91-640-41-004000

    Datasheet

         		612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-41-652-41-001000

    126-41-652-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,262
    RFQ
    		126-41-652-41-001000

    Datasheet

         		126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-91-652-41-001000

    126-91-652-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,505
    RFQ
    		126-91-652-41-001000

    Datasheet

         		126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APA-628-G-P

    APA-628-G-P

    ADAPTER PLUG

    Samtec Inc.

    		 4,737
    RFQ
    		APA-628-G-P

    Datasheet

         		APA Tube Active - 28 (2 x 14) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    110-99-432-61-001000

    110-99-432-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,170
    RFQ

    -

    		 110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-91-652-41-001000

    123-91-652-41-001000

    SOCKET IC OPEN 3 LVL .600 52POS

    Mill-Max Manufacturing Corp.

    		 3,643
    RFQ

    -

    		 123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-41-652-41-001000

    123-41-652-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,704
    RFQ
    		123-41-652-41-001000

    Datasheet

         		123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    121-11-642-41-001000

    121-11-642-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,587
    RFQ
    		121-11-642-41-001000

    Datasheet

         		121 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    26-3503-21

    26-3503-21

    CONN IC DIP SOCKET 26POS GOLD

    Aries Electronics

    		 2,828
    RFQ
    		26-3503-21

    Datasheet

         		503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    26-3503-31

    26-3503-31

    CONN IC DIP SOCKET 26POS GOLD

    Aries Electronics

    		 4,379
    RFQ
    		26-3503-31

    Datasheet

         		503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    116-43-210-61-007000

    116-43-210-61-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,409
    RFQ

    -

    		 116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-210-61-007000

    116-93-210-61-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,909
    RFQ

    -

    		 116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    1-1437504-0

    1-1437504-0

    CONN TRANSIST TO-5 4POS GOLD

    TE Connectivity AMP Connectors

    		 2,320
    RFQ
    		1-1437504-0

    Datasheet

         		8060 Bulk Obsolete Transistor, TO-5 4 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
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