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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    126-43-640-41-002000

    126-43-640-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,884
    RFQ
    		126-43-640-41-002000

    Datasheet

         		126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    156-PGM16012-10

    156-PGM16012-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    		 4,234
    RFQ
    		156-PGM16012-10

    Datasheet

         		PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    614-93-650-31-007000

    614-93-650-31-007000

    SOCKET CARRIER LOWPRO .600 50POS

    Mill-Max Manufacturing Corp.

    		 4,518
    RFQ
    		614-93-650-31-007000

    Datasheet

         		614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    614-43-650-31-007000

    614-43-650-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 4,886
    RFQ
    		614-43-650-31-007000

    Datasheet

         		614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    115-44-424-61-003000

    115-44-424-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,875
    RFQ

    -

    		 115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    110-91-432-61-001000

    110-91-432-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,718
    RFQ

    -

    		 110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    110-43-318-61-605000

    110-43-318-61-605000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,966
    RFQ

    -

    		 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    510-91-114-13-062001

    510-91-114-13-062001

    SOCKET SOLDERTAIL 114-PGA

    Mill-Max Manufacturing Corp.

    		 2,673
    RFQ

    -

    		 510 Tube Active PGA 114 (13 x 13) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
    48-3570-10

    48-3570-10

    CONN IC DIP SOCKET ZIF 48POS TIN

    Aries Electronics

    		 2,470
    RFQ
    		48-3570-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
    48-3571-10

    48-3571-10

    CONN IC DIP SOCKET ZIF 48POS TIN

    Aries Electronics

    		 2,330
    RFQ
    		48-3571-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
    48-3572-10

    48-3572-10

    CONN IC DIP SOCKET ZIF 48POS TIN

    Aries Electronics

    		 2,240
    RFQ
    		48-3572-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
    48-3573-10

    48-3573-10

    CONN IC DIP SOCKET ZIF 48POS TIN

    Aries Electronics

    		 2,210
    RFQ
    		48-3573-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
    48-3575-10

    48-3575-10

    CONN IC DIP SOCKET ZIF 48POS TIN

    Aries Electronics

    		 2,332
    RFQ
    		48-3575-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
    48-6571-10

    48-6571-10

    CONN IC DIP SOCKET ZIF 48POS TIN

    Aries Electronics

    		 3,030
    RFQ
    		48-6571-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
    48-6572-10

    48-6572-10

    CONN IC DIP SOCKET ZIF 48POS GLD

    Aries Electronics

    		 3,153
    RFQ
    		48-6572-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled 10.0µin (0.25µm) Beryllium Copper
    48-6573-10

    48-6573-10

    CONN IC DIP SOCKET ZIF 48POS GLD

    Aries Electronics

    		 4,674
    RFQ
    		48-6573-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled 10.0µin (0.25µm) Beryllium Copper
    48-6575-10

    48-6575-10

    CONN IC DIP SOCKET ZIF 48POS GLD

    Aries Electronics

    		 2,910
    RFQ
    		48-6575-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled 10.0µin (0.25µm) Beryllium Copper
    32-0508-21

    32-0508-21

    CONN SOCKET SIP 32POS GOLD

    Aries Electronics

    		 4,531
    RFQ
    		32-0508-21

    Datasheet

         		508 Bulk Active SIP 32 (1 x 32) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 125°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
    32-0508-31

    32-0508-31

    CONN SOCKET SIP 32POS GOLD

    Aries Electronics

    		 2,923
    RFQ
    		32-0508-31

    Datasheet

         		508 Bulk Active SIP 32 (1 x 32) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 125°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
    APO-640-G-A

    APO-640-G-A

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    		 2,023
    RFQ
    		APO-640-G-A

    Datasheet

         		APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 10.0µin (0.25µm) Phosphor Bronze
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