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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    123-11-432-41-001000

    123-11-432-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,348
    RFQ
    		123-11-432-41-001000

    Datasheet

         		123 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-11-632-41-001000

    123-11-632-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,671
    RFQ
    		123-11-632-41-001000

    Datasheet

         		123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-43-316-61-001000

    115-43-316-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,308
    RFQ

    -

    		 115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    32-1508-21

    32-1508-21

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    		 3,531
    RFQ
    		32-1508-21

    Datasheet

         		508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    32-1508-31

    32-1508-31

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    		 2,727
    RFQ
    		32-1508-31

    Datasheet

         		508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    24-3508-212

    24-3508-212

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    		 4,045
    RFQ
    		24-3508-212

    Datasheet

         		508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    48-6556-11

    48-6556-11

    CONN IC DIP SOCKET 48POS GOLD

    Aries Electronics

    		 4,040
    RFQ
    		48-6556-11

    Datasheet

         		6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    612-93-642-41-001000

    612-93-642-41-001000

    SOCKET CARRIER SLDRTL .600 42POS

    Mill-Max Manufacturing Corp.

    		 3,068
    RFQ
    		612-93-642-41-001000

    Datasheet

         		612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-43-642-41-001000

    612-43-642-41-001000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    		 4,219
    RFQ
    		612-43-642-41-001000

    Datasheet

         		612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-44-642-61-001000

    110-44-642-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,890
    RFQ

    -

    		 110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-99-642-61-001000

    110-99-642-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,795
    RFQ

    -

    		 110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-43-424-61-001000

    110-43-424-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,304
    RFQ

    -

    		 110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    517-87-428-19-101111

    517-87-428-19-101111

    CONN SOCKET PGA 428POS GOLD

    Preci-Dip

    		 2,134
    RFQ
    		517-87-428-19-101111

    Datasheet

         		517 Bulk Active PGA 428 (19 x 19) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-93-012-05-001001

    510-93-012-05-001001

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    		 4,760
    RFQ
    		510-93-012-05-001001

    Datasheet

         		510 Tube Active PGA 12 (5 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    24-6508-212

    24-6508-212

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    		 3,394
    RFQ
    		24-6508-212

    Datasheet

         		508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    24-6508-312

    24-6508-312

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    		 3,692
    RFQ
    		24-6508-312

    Datasheet

         		508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    605-93-652-11-480000

    605-93-652-11-480000

    SOCKET CARRIER LOWPRO .600 52POS

    Mill-Max Manufacturing Corp.

    		 3,280
    RFQ
    		605-93-652-11-480000

    Datasheet

         		605 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-43-652-11-480000

    605-43-652-11-480000

    SKT CARRIER LOWPRO

    Mill-Max Manufacturing Corp.

    		 3,321
    RFQ
    		605-43-652-11-480000

    Datasheet

         		605 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-13-322-41-801000

    123-13-322-41-801000

    CONN IC DIP SOCKET 22POS GOLD

    Mill-Max Manufacturing Corp.

    		 4,768
    RFQ
    		123-13-322-41-801000

    Datasheet

         		123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-41-648-41-003000

    612-41-648-41-003000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    		 2,874
    RFQ
    		612-41-648-41-003000

    Datasheet

         		612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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