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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    110-93-628-61-105000

    110-93-628-61-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,115
    RFQ

    -

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    32-3503-21

    32-3503-21

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    3,095
    RFQ
    32-3503-21

    Datasheet

    503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    32-3503-31

    32-3503-31

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    4,130
    RFQ
    32-3503-31

    Datasheet

    503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    35-0508-21

    35-0508-21

    CONN SOCKET SIP 35POS GOLD

    Aries Electronics

    3,365
    RFQ
    35-0508-21

    Datasheet

    508 Bulk Active SIP 35 (1 x 35) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    35-0508-31

    35-0508-31

    CONN SOCKET SIP 35POS GOLD

    Aries Electronics

    2,437
    RFQ
    35-0508-31

    Datasheet

    508 Bulk Active SIP 35 (1 x 35) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    126-93-648-41-002000

    126-93-648-41-002000

    CONN IC DIP SOCKET 48POS GOLD

    Mill-Max Manufacturing Corp.

    3,090
    RFQ
    126-93-648-41-002000

    Datasheet

    126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-43-648-41-002000

    126-43-648-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,139
    RFQ
    126-43-648-41-002000

    Datasheet

    126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-13-636-41-001000

    612-13-636-41-001000

    SOCKET CARRIER SLDRTL .600 36POS

    Mill-Max Manufacturing Corp.

    4,424
    RFQ
    612-13-636-41-001000

    Datasheet

    612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    510-93-084-12-051001

    510-93-084-12-051001

    CONN SOCKET PGA 84POS GOLD

    Mill-Max Manufacturing Corp.

    4,700
    RFQ
    510-93-084-12-051001

    Datasheet

    510 Tube Active PGA 84 (12 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0508-G-31

    HLS-0508-G-31

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,229
    RFQ
    HLS-0508-G-31

    Datasheet

    HLS Bulk Active SIP 40 (5 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    24-3508-312

    24-3508-312

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    4,047
    RFQ
    24-3508-312

    Datasheet

    508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    612-41-950-41-004000

    612-41-950-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    2,546
    RFQ
    612-41-950-41-004000

    Datasheet

    612 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-91-950-41-004000

    612-91-950-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    4,593
    RFQ
    612-91-950-41-004000

    Datasheet

    612 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-11-640-41-001000

    123-11-640-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,321
    RFQ
    123-11-640-41-001000

    Datasheet

    123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-13-964-41-001000

    210-13-964-41-001000

    CONN IC DIP SOCKET 64POS GOLD

    Mill-Max Manufacturing Corp.

    2,829
    RFQ
    210-13-964-41-001000

    Datasheet

    210 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-650-41-001000

    116-93-650-41-001000

    CONN IC DIP SOCKET 50POS GOLD

    Mill-Max Manufacturing Corp.

    2,183
    RFQ
    116-93-650-41-001000

    Datasheet

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-650-41-001000

    116-43-650-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,429
    RFQ
    116-43-650-41-001000

    Datasheet

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-93-636-61-003000

    115-93-636-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,595
    RFQ

    -

    115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    546-83-178-18-111135

    546-83-178-18-111135

    CONN SOCKET PGA 178POS GOLD

    Preci-Dip

    3,688
    RFQ
    546-83-178-18-111135

    Datasheet

    546 Bulk Active PGA 178 (18 x 18) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-93-952-41-001000

    614-93-952-41-001000

    SOCKET CARRIER LOWPRO .900 52POS

    Mill-Max Manufacturing Corp.

    2,656
    RFQ
    614-93-952-41-001000

    Datasheet

    614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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