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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    110-41-424-61-001000

    110-41-424-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,778
    RFQ

    -

    		 110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-41-624-61-001000

    110-41-624-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,961
    RFQ

    -

    		 110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-308-61-007000

    116-43-308-61-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,472
    RFQ

    -

    		 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-41-964-11-480000

    605-41-964-11-480000

    SKT CARRIER LOWPRO

    Mill-Max Manufacturing Corp.

    		 3,474
    RFQ
    		605-41-964-11-480000

    Datasheet

         		605 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-91-964-11-480000

    605-91-964-11-480000

    SKT CARRIER LOWPRO

    Mill-Max Manufacturing Corp.

    		 4,958
    RFQ
    		605-91-964-11-480000

    Datasheet

         		605 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    714-43-242-31-018000

    714-43-242-31-018000

    CONN IC DIP SOCKET 42POS GOLD

    Mill-Max Manufacturing Corp.

    		 3,365
    RFQ
    		714-43-242-31-018000

    Datasheet

         		714 Bulk Active DIP, 0.1" (2.54mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    546-87-224-18-091135

    546-87-224-18-091135

    CONN SOCKET PGA 224POS GOLD

    Preci-Dip

    		 2,954
    RFQ
    		546-87-224-18-091135

    Datasheet

         		546 Bulk Active PGA 224 (18 x 18) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    546-87-224-18-091136

    546-87-224-18-091136

    CONN SOCKET PGA 224POS GOLD

    Preci-Dip

    		 2,672
    RFQ
    		546-87-224-18-091136

    Datasheet

         		546 Bulk Active PGA 224 (18 x 18) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    32-3552-11

    32-3552-11

    CONN IC DIP SOCKET ZIF 32POS GLD

    Aries Electronics

    		 2,500
    RFQ
    		32-3552-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    32-6503-21

    32-6503-21

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    		 2,485
    RFQ
    		32-6503-21

    Datasheet

         		503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    32-6503-31

    32-6503-31

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    		 2,923
    RFQ
    		32-6503-31

    Datasheet

         		503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    510-11-068-11-061001

    510-11-068-11-061001

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    		 2,162
    RFQ
    		510-11-068-11-061001

    Datasheet

         		510 Tube Active PGA 68 (11 x 11) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    517-87-463-19-101111

    517-87-463-19-101111

    CONN SOCKET PGA 463POS GOLD

    Preci-Dip

    		 3,042
    RFQ
    		517-87-463-19-101111

    Datasheet

         		517 Bulk Active PGA 463 (19 x 19) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-93-100-10-000001

    510-93-100-10-000001

    SOCKET SOLDERTAIL 100-PGA

    Mill-Max Manufacturing Corp.

    		 3,722
    RFQ
    		510-93-100-10-000001

    Datasheet

         		510 Tube Active PGA 100 (10 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    510-93-100-13-062001

    510-93-100-13-062001

    SOCKET SOLDERTAIL 100-PGA

    Mill-Max Manufacturing Corp.

    		 4,484
    RFQ

    -

    		 510 Tube Active PGA 100 (13 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-43-636-61-001000

    110-43-636-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,251
    RFQ

    -

    		 110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-93-636-61-001000

    110-93-636-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,807
    RFQ

    -

    		 110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-87-179-15-041112

    614-87-179-15-041112

    CONN SOCKET PGA 179POS GOLD

    Preci-Dip

    		 4,282
    RFQ
    		614-87-179-15-041112

    Datasheet

         		614 Bulk Active PGA 179 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-87-179-18-111112

    614-87-179-18-111112

    CONN SOCKET PGA 179POS GOLD

    Preci-Dip

    		 4,989
    RFQ
    		614-87-179-18-111112

    Datasheet

         		614 Bulk Active PGA 179 (18 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-87-179-18-112112

    614-87-179-18-112112

    CONN SOCKET PGA 179POS GOLD

    Preci-Dip

    		 4,098
    RFQ
    		614-87-179-18-112112

    Datasheet

         		614 Bulk Active PGA 179 (18 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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