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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    116-43-310-61-007000

    116-43-310-61-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,432
    RFQ

    -

    		 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-310-61-007000

    116-93-310-61-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,893
    RFQ

    -

    		 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    37-0501-21

    37-0501-21

    CONN SOCKET SIP 37POS GOLD

    Aries Electronics

    		 4,168
    RFQ
    		37-0501-21

    Datasheet

         		501 Bulk Active SIP 37 (1 x 37) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    37-0501-31

    37-0501-31

    CONN SOCKET SIP 37POS GOLD

    Aries Electronics

    		 4,160
    RFQ
    		37-0501-31

    Datasheet

         		501 Bulk Active SIP 37 (1 x 37) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    40-81000-610C

    40-81000-610C

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    		 3,298
    RFQ
    		40-81000-610C

    Datasheet

         		8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    40-8300-310C

    40-8300-310C

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    		 2,011
    RFQ
    		40-8300-310C

    Datasheet

         		8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    40-8350-610C

    40-8350-610C

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    		 4,163
    RFQ
    		40-8350-610C

    Datasheet

         		8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    40-8600-610C

    40-8600-610C

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    		 3,780
    RFQ
    		40-8600-610C

    Datasheet

         		8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    40-8620-610C

    40-8620-610C

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    		 4,410
    RFQ
    		40-8620-610C

    Datasheet

         		8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    40-8785-310C

    40-8785-310C

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    		 2,708
    RFQ
    		40-8785-310C

    Datasheet

         		8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    40-8785-610C

    40-8785-610C

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    		 4,313
    RFQ
    		40-8785-610C

    Datasheet

         		8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    40-8800-610C

    40-8800-610C

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    		 2,438
    RFQ
    		40-8800-610C

    Datasheet

         		8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    40-8810-610C

    40-8810-610C

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    		 3,254
    RFQ
    		40-8810-610C

    Datasheet

         		8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    123-11-636-41-001000

    123-11-636-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,957
    RFQ
    		123-11-636-41-001000

    Datasheet

         		123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    517-83-304-14-051111

    517-83-304-14-051111

    CONN SOCKET PGA 304POS GOLD

    Preci-Dip

    		 2,022
    RFQ
    		517-83-304-14-051111

    Datasheet

         		517 Bulk Active PGA 304 (14 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    714-93-164-31-007000

    714-93-164-31-007000

    CONN SOCKET SIP 64POS GOLD

    Mill-Max Manufacturing Corp.

    		 2,241
    RFQ
    		714-93-164-31-007000

    Datasheet

         		714 Tube Active SIP 64 (1 x 64) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APO-320-G-R

    APO-320-G-R

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    		 3,140
    RFQ
    		APO-320-G-R

    Datasheet

         		APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    APH-1416-G-H

    APH-1416-G-H

    APH-1416-G-H

    Samtec Inc.

    		 3,975
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1916-G-H

    APH-1916-G-H

    APH-1916-G-H

    Samtec Inc.

    		 2,453
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0416-G-H

    APH-0416-G-H

    APH-0416-G-H

    Samtec Inc.

    		 4,341
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
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