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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    116-43-310-61-007000

    116-43-310-61-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,432
    RFQ

    -

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    116-93-310-61-007000

    116-93-310-61-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,893
    RFQ

    -

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    37-0501-21

    37-0501-21

    CONN SOCKET SIP 37POS GOLD

    Aries Electronics

    4,168
    RFQ
    37-0501-21

    Datasheet

    501 Bulk Active SIP 37 (1 x 37) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    37-0501-31

    37-0501-31

    CONN SOCKET SIP 37POS GOLD

    Aries Electronics

    4,160
    RFQ
    37-0501-31

    Datasheet

    501 Bulk Active SIP 37 (1 x 37) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    40-81000-610C

    40-81000-610C

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    3,298
    RFQ
    40-81000-610C

    Datasheet

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    40-8300-310C

    40-8300-310C

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    2,011
    RFQ
    40-8300-310C

    Datasheet

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    40-8350-610C

    40-8350-610C

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    4,163
    RFQ
    40-8350-610C

    Datasheet

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    40-8600-610C

    40-8600-610C

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    3,780
    RFQ
    40-8600-610C

    Datasheet

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    40-8620-610C

    40-8620-610C

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    4,410
    RFQ
    40-8620-610C

    Datasheet

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    40-8785-310C

    40-8785-310C

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    2,708
    RFQ
    40-8785-310C

    Datasheet

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    40-8785-610C

    40-8785-610C

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    4,313
    RFQ
    40-8785-610C

    Datasheet

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    40-8800-610C

    40-8800-610C

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    2,438
    RFQ
    40-8800-610C

    Datasheet

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    40-8810-610C

    40-8810-610C

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    3,254
    RFQ
    40-8810-610C

    Datasheet

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    123-11-636-41-001000

    123-11-636-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,957
    RFQ
    123-11-636-41-001000

    Datasheet

    123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
    517-83-304-14-051111

    517-83-304-14-051111

    CONN SOCKET PGA 304POS GOLD

    Preci-Dip

    2,022
    RFQ
    517-83-304-14-051111

    Datasheet

    517 Bulk Active PGA 304 (14 x 14) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    714-93-164-31-007000

    714-93-164-31-007000

    CONN SOCKET SIP 64POS GOLD

    Mill-Max Manufacturing Corp.

    2,241
    RFQ
    714-93-164-31-007000

    Datasheet

    714 Tube Active SIP 64 (1 x 64) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    APO-320-G-R

    APO-320-G-R

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,140
    RFQ
    APO-320-G-R

    Datasheet

    APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    APH-1416-G-H

    APH-1416-G-H

    APH-1416-G-H

    Samtec Inc.

    3,975
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1916-G-H

    APH-1916-G-H

    APH-1916-G-H

    Samtec Inc.

    2,453
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0416-G-H

    APH-0416-G-H

    APH-0416-G-H

    Samtec Inc.

    4,341
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
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