Hello! now KATY Electronic Technology Co., LTD+8618924632110（Bella)
KATY Electronic Technology Co., LTDMy Inquiry KATY Electronic Technology Co., LTDMy Account
    Login or REGISTER
    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD
    All Categories
    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    110-47-328-41-105000

    110-47-328-41-105000

    CONN IC DIP SOCKET 28POS GOLD

    Mill-Max Manufacturing Corp.

    		 8
    RFQ
    		110-47-328-41-105000

    Datasheet

         		110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-43-320-41-003000

    115-43-320-41-003000

    CONN IC DIP SOCKET 20POS GOLD

    Mill-Max Manufacturing Corp.

    		 10
    RFQ
    		115-43-320-41-003000

    Datasheet

         		115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-93-624-41-001000

    115-93-624-41-001000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    		 16
    RFQ
    		115-93-624-41-001000

    Datasheet

         		115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    AR 28-HZW/TN

    AR 28-HZW/TN

    CONN IC DIP SOCKET 28POS GOLD

    Assmann WSW Components

    		 2,222
    RFQ
    		AR 28-HZW/TN

    Datasheet

         		- Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    115-93-628-41-001000

    115-93-628-41-001000

    CONN IC DIP SOCKET 28POS GOLD

    Mill-Max Manufacturing Corp.

    		 2,055
    RFQ
    		115-93-628-41-001000

    Datasheet

         		115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-87-628-31-012101

    614-87-628-31-012101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    		 2
    RFQ
    		614-87-628-31-012101

    Datasheet

         		614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    22-4518-11

    22-4518-11

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    		 1
    RFQ
    		22-4518-11

    Datasheet

         		518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    614-43-318-31-012000

    614-43-318-31-012000

    CONN IC DIP SOCKET 18POS GOLD

    Mill-Max Manufacturing Corp.

    		 16
    RFQ
    		614-43-318-31-012000

    Datasheet

         		614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-43-320-41-001000

    123-43-320-41-001000

    CONN IC DIP SOCKET 20POS GOLD

    Mill-Max Manufacturing Corp.

    		 1
    RFQ
    		123-43-320-41-001000

    Datasheet

         		123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    299-43-308-10-001000

    299-43-308-10-001000

    CONN IC DIP SOCKET 8POS GOLD

    Mill-Max Manufacturing Corp.

    		 19
    RFQ
    		299-43-308-10-001000

    Datasheet

         		299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-93-316-41-801000

    110-93-316-41-801000

    CONN IC DIP SOCKET 16POS GOLD

    Mill-Max Manufacturing Corp.

    		 18
    RFQ
    		110-93-316-41-801000

    Datasheet

         		110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    24-C182-10

    24-C182-10

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    		 14
    RFQ
    		24-C182-10

    Datasheet

         		EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    D01-9933246

    D01-9933246

    CONN SOCKET SIP 32POS TIN

    Harwin Inc.

    		 4,610
    RFQ
    		D01-9933246

    Datasheet

         		D01-993 Bulk Active SIP 32 (1 x 32) 0.100" (2.54mm) Tin - Brass Through Hole - Solder Cup 0.100" (2.54mm) Tin - Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    AR 40-HZW/TN

    AR 40-HZW/TN

    CONN IC DIP SOCKET 40POS GOLD

    Assmann WSW Components

    		 1
    RFQ
    		AR 40-HZW/TN

    Datasheet

         		- Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    123-47-640-41-001000

    123-47-640-41-001000

    CONN IC DIP SOCKET 40POS GOLD

    Mill-Max Manufacturing Corp.

    		 10
    RFQ
    		123-47-640-41-001000

    Datasheet

         		123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-13-316-41-801000

    110-13-316-41-801000

    CONN IC DIP SOCKET 16POS GOLD

    Mill-Max Manufacturing Corp.

    		 11
    RFQ
    		110-13-316-41-801000

    Datasheet

         		110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-93-324-41-801000

    110-93-324-41-801000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    		 23
    RFQ
    		110-93-324-41-801000

    Datasheet

         		110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-93-316-41-801000

    123-93-316-41-801000

    CONN IC DIP SOCKET 16POS GOLD

    Mill-Max Manufacturing Corp.

    		 22
    RFQ
    		123-93-316-41-801000

    Datasheet

         		123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    D8864-42

    D8864-42

    CONN IC DIP SOCKET 64POS GOLD

    Harwin Inc.

    		 20
    RFQ
    		D8864-42

    Datasheet

         		D8864 Tube Active DIP, 0.75" (19.05mm) Row Spacing 64 (2 x 32) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    123-43-328-41-001000

    123-43-328-41-001000

    CONN IC DIP SOCKET 28POS GOLD

    Mill-Max Manufacturing Corp.

    		 1
    RFQ
    		123-43-328-41-001000

    Datasheet

         		123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 7576777879808182...955Next»
    Fast Shipping
    Fast Shipping Fast and convenient door to door delivery.
    Paypment Security
    Paypment Security More than 5 different secure payment methods.
    Strictly Quality Control
    Strictly Quality Control 365 days After-Sales Service and Warranty
    Simple And Professional
    Simple And Professional One-stop Electronics Procurement Solutions.
    Your email
    Your message
    KATY Electronic Technology Co., LTD

    HOME

     KATY Electronic Technology Co., LTD

    PRODUCT

     KATY Electronic Technology Co., LTD

    PHONE

     KATY Electronic Technology Co., LTD

    USER
    KATY Electronic Technology Co., LTD
    [email protected]