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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    299-43-612-10-002000

    299-43-612-10-002000

    CONN IC DIP SOCKET 12POS GOLD

    Mill-Max Manufacturing Corp.

    		 15
    RFQ
    		299-43-612-10-002000

    Datasheet

         		299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    299-93-320-11-001000

    299-93-320-11-001000

    CONN IC DIP SOCKET 20POS GOLD

    Mill-Max Manufacturing Corp.

    		 24
    RFQ
    		299-93-320-11-001000

    Datasheet

         		299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    317-43-108-41-005000

    317-43-108-41-005000

    CONN SOCKET 8POS .070 STR GOLD

    Mill-Max Manufacturing Corp.

    		 2,883
    RFQ
    		317-43-108-41-005000

    Datasheet

         		317 Tube Active SIP 8 (1 x 8) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    24-6574-10

    24-6574-10

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    		 4,586
    RFQ
    		24-6574-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    80-PGM15059-10

    80-PGM15059-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    		 3,280
    RFQ
    		80-PGM15059-10

    Datasheet

         		PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-6574-10

    28-6574-10

    CONN IC DIP SOCKET ZIF 28POS TIN

    Aries Electronics

    		 3,645
    RFQ
    		28-6574-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-6574-10

    40-6574-10

    CONN IC DIP SOCKET ZIF 40POS TIN

    Aries Electronics

    		 3,382
    RFQ
    		40-6574-10

    Datasheet

         		57 Tube Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    AR 32-HZL-TT

    AR 32-HZL-TT

    CONN IC DIP SOCKET 32POS TIN

    Assmann WSW Components

    		 3,976
    RFQ
    		AR 32-HZL-TT

    Datasheet

         		- Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    110-83-308-41-105101

    110-83-308-41-105101

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    		 4,732
    RFQ
    		110-83-308-41-105101

    Datasheet

         		110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    XR2A-4011-N

    XR2A-4011-N

    CONN IC DIP SOCKET 40POS GOLD

    Omron Electronics Inc-EMC Div

    		 8
    RFQ
    		XR2A-4011-N

    Datasheet

         		XR2 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    110-44-304-41-001000

    110-44-304-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 22
    RFQ
    		110-44-304-41-001000

    Datasheet

         		110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-99-306-41-001000

    110-99-306-41-001000

    CONN IC DIP SOCKET 6POS TIN-LEAD

    Mill-Max Manufacturing Corp.

    		 4
    RFQ
    		110-99-306-41-001000

    Datasheet

         		110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-93-306-41-001000

    110-93-306-41-001000

    CONN IC DIP SOCKET 6POS GOLD

    Mill-Max Manufacturing Corp.

    		 3,734
    RFQ
    		110-93-306-41-001000

    Datasheet

         		110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-13-308-41-001000

    210-13-308-41-001000

    CONN IC DIP SOCKET 8POS GOLD

    Mill-Max Manufacturing Corp.

    		 4
    RFQ
    		210-13-308-41-001000

    Datasheet

         		210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    AW 127-02/Z-T

    AW 127-02/Z-T

    SOCKET 2 CONTACTS SINGLE ROW

    Assmann WSW Components

    		 2,472
    RFQ
    		AW 127-02/Z-T

    Datasheet

         		- - Active - - - - - - - - - - - - - - -
    390261-2

    390261-2

    CONN IC DIP SOCKET 8POS TIN-LEAD

    TE Connectivity AMP Connectors

    		 2,159
    RFQ
    		390261-2

    Datasheet

         		- Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin-Lead - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead - Phosphor Bronze - -40°C ~ 105°C
    ICO-163-S8A-T

    ICO-163-S8A-T

    CONN IC DIP SOCKET 16POS TIN

    3M

    		 4,381
    RFQ
    		ICO-163-S8A-T

    Datasheet

         		ICO Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polyester, Glass Filled -65°C ~ 105°C
    ICO-143-S8A-T

    ICO-143-S8A-T

    CONN IC DIP SOCKET 14POS TIN

    3M

    		 4,427
    RFQ
    		ICO-143-S8A-T

    Datasheet

         		ICO Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polyester, Glass Filled -65°C ~ 105°C
    ICO-143-S8-T

    ICO-143-S8-T

    CONN IC DIP SOCKET 14POS TIN

    3M

    		 3,991
    RFQ
    		ICO-143-S8-T

    Datasheet

         		ICO Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polyester, Glass Filled -65°C ~ 105°C
    390261-4

    390261-4

    CONN IC DIP SOCKET 16POS TINLEAD

    TE Connectivity AMP Connectors

    		 4,672
    RFQ
    		390261-4

    Datasheet

         		- Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin-Lead - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead - Phosphor Bronze - -40°C ~ 105°C
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