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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    APH-0718-G-H

    APH-0718-G-H

    APH-0718-G-H

    Samtec Inc.

    2,762
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0322-G-R

    APH-0322-G-R

    APH-0322-G-R

    Samtec Inc.

    2,803
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1722-G-R

    APH-1722-G-R

    APH-1722-G-R

    Samtec Inc.

    3,730
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0422-G-R

    APH-0422-G-R

    APH-0422-G-R

    Samtec Inc.

    2,238
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0722-G-R

    APH-0722-G-R

    APH-0722-G-R

    Samtec Inc.

    4,003
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0818-G-H

    APH-0818-G-H

    APH-0818-G-H

    Samtec Inc.

    2,300
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1622-G-R

    APH-1622-G-R

    APH-1622-G-R

    Samtec Inc.

    3,491
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    117-93-316-61-005000

    117-93-316-61-005000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,555
    RFQ

    -

    117 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    37-0511-11

    37-0511-11

    CONN SOCKET SIP 37POS GOLD

    Aries Electronics

    3,301
    RFQ
    37-0511-11

    Datasheet

    511 Bulk Active SIP 37 (1 x 37) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    APA-640-G-N

    APA-640-G-N

    ADAPTER PLUG

    Samtec Inc.

    3,843
    RFQ
    APA-640-G-N

    Datasheet

    APA Tube Active - 40 (2 x 20) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    126-93-952-41-002000

    126-93-952-41-002000

    CONN IC DIP SOCKET 52POS GOLD

    Mill-Max Manufacturing Corp.

    4,310
    RFQ
    126-93-952-41-002000

    Datasheet

    126 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-43-952-41-002000

    126-43-952-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,020
    RFQ
    126-43-952-41-002000

    Datasheet

    126 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-11-652-41-001000

    612-11-652-41-001000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    4,172
    RFQ
    612-11-652-41-001000

    Datasheet

    612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) - - Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    416-93-264-41-007000

    416-93-264-41-007000

    SOCKET DUAL INLINE ELEVATD 64POS

    Mill-Max Manufacturing Corp.

    3,796
    RFQ
    416-93-264-41-007000

    Datasheet

    416 Tube Active DIP, 0.1" (2.54mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - - Closed Frame - - - - - - -
    110-43-648-61-105000

    110-43-648-61-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,468
    RFQ

    -

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-93-648-61-105000

    110-93-648-61-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,947
    RFQ

    -

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-93-650-41-003000

    126-93-650-41-003000

    CONN IC DIP SOCKET 50POS GOLD

    Mill-Max Manufacturing Corp.

    2,335
    RFQ
    126-93-650-41-003000

    Datasheet

    126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-43-650-41-003000

    126-43-650-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,834
    RFQ
    126-43-650-41-003000

    Datasheet

    126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    122-13-648-41-001000

    122-13-648-41-001000

    CONN IC DIP SOCKET 48POS GOLD

    Mill-Max Manufacturing Corp.

    4,163
    RFQ
    122-13-648-41-001000

    Datasheet

    122 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-43-650-61-001000

    111-43-650-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,314
    RFQ

    -

    111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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