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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    APH-0718-G-H

    APH-0718-G-H

    APH-0718-G-H

    Samtec Inc.

    2,762
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0322-G-R

    APH-0322-G-R

    APH-0322-G-R

    Samtec Inc.

    2,803
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1722-G-R

    APH-1722-G-R

    APH-1722-G-R

    Samtec Inc.

    3,730
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0422-G-R

    APH-0422-G-R

    APH-0422-G-R

    Samtec Inc.

    2,238
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0722-G-R

    APH-0722-G-R

    APH-0722-G-R

    Samtec Inc.

    4,003
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0818-G-H

    APH-0818-G-H

    APH-0818-G-H

    Samtec Inc.

    2,300
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1622-G-R

    APH-1622-G-R

    APH-1622-G-R

    Samtec Inc.

    3,491
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    117-93-316-61-005000

    117-93-316-61-005000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,555
    RFQ

    -

    117 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    37-0511-11

    37-0511-11

    CONN SOCKET SIP 37POS GOLD

    Aries Electronics

    3,301
    RFQ
    37-0511-11

    Datasheet

    511 Bulk Active SIP 37 (1 x 37) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    APA-640-G-N

    APA-640-G-N

    ADAPTER PLUG

    Samtec Inc.

    3,843
    RFQ
    APA-640-G-N

    Datasheet

    APA Tube Active - 40 (2 x 20) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 20.0µin (0.51µm) Phosphor Bronze
    126-93-952-41-002000

    126-93-952-41-002000

    CONN IC DIP SOCKET 52POS GOLD

    Mill-Max Manufacturing Corp.

    4,310
    RFQ
    126-93-952-41-002000

    Datasheet

    126 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    126-43-952-41-002000

    126-43-952-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,020
    RFQ
    126-43-952-41-002000

    Datasheet

    126 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    612-11-652-41-001000

    612-11-652-41-001000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    4,172
    RFQ
    612-11-652-41-001000

    Datasheet

    612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) - - Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
    416-93-264-41-007000

    416-93-264-41-007000

    SOCKET DUAL INLINE ELEVATD 64POS

    Mill-Max Manufacturing Corp.

    3,796
    RFQ
    416-93-264-41-007000

    Datasheet

    416 Tube Active DIP, 0.1" (2.54mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) - - Closed Frame 0.100" (2.54mm) - - - - - - -
    110-43-648-61-105000

    110-43-648-61-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,468
    RFQ

    -

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    110-93-648-61-105000

    110-93-648-61-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,947
    RFQ

    -

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    126-93-650-41-003000

    126-93-650-41-003000

    CONN IC DIP SOCKET 50POS GOLD

    Mill-Max Manufacturing Corp.

    2,335
    RFQ
    126-93-650-41-003000

    Datasheet

    126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    126-43-650-41-003000

    126-43-650-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,834
    RFQ
    126-43-650-41-003000

    Datasheet

    126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    122-13-648-41-001000

    122-13-648-41-001000

    CONN IC DIP SOCKET 48POS GOLD

    Mill-Max Manufacturing Corp.

    4,163
    RFQ
    122-13-648-41-001000

    Datasheet

    122 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
    111-43-650-61-001000

    111-43-650-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,314
    RFQ

    -

    111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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