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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    111-43-628-61-001000

    111-43-628-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,889
    RFQ

    -

    111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    111-93-328-61-001000

    111-93-328-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,747
    RFQ

    -

    111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    111-93-428-61-001000

    111-93-428-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,070
    RFQ

    -

    111 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    111-93-628-61-001000

    111-93-628-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,108
    RFQ

    -

    111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    36-6503-21

    36-6503-21

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    3,331
    RFQ
    36-6503-21

    Datasheet

    503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    116-43-640-61-006000

    116-43-640-61-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,332
    RFQ

    -

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    612-11-952-41-001000

    612-11-952-41-001000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    2,669
    RFQ
    612-11-952-41-001000

    Datasheet

    612 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) - - Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
    APH-0524-G-T

    APH-0524-G-T

    APH-0524-G-T

    Samtec Inc.

    4,350
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1124-G-T

    APH-1124-G-T

    APH-1124-G-T

    Samtec Inc.

    2,741
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1624-G-T

    APH-1624-G-T

    APH-1624-G-T

    Samtec Inc.

    4,655
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0724-G-T

    APH-0724-G-T

    APH-0724-G-T

    Samtec Inc.

    4,048
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1824-G-T

    APH-1824-G-T

    APH-1824-G-T

    Samtec Inc.

    4,279
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1324-G-T

    APH-1324-G-T

    APH-1324-G-T

    Samtec Inc.

    4,250
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0824-G-T

    APH-0824-G-T

    APH-0824-G-T

    Samtec Inc.

    3,410
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0224-G-T

    APH-0224-G-T

    APH-0224-G-T

    Samtec Inc.

    2,302
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1724-G-T

    APH-1724-G-T

    APH-1724-G-T

    Samtec Inc.

    2,280
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    323-93-164-41-001000

    323-93-164-41-001000

    SOCKET 3 LEVEL WRAPOST SIP 64POS

    Mill-Max Manufacturing Corp.

    2,494
    RFQ
    323-93-164-41-001000

    Datasheet

    323 Tube Active SIP 64 (1 x 64) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    28-C300-31

    28-C300-31

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    3,630
    RFQ
    28-C300-31

    Datasheet

    EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    121-11-952-41-001000

    121-11-952-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,668
    RFQ
    121-11-952-41-001000

    Datasheet

    121 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
    510-93-132-14-071001

    510-93-132-14-071001

    PGA SOCK 132PIN 14X14 SOLDER TL

    Mill-Max Manufacturing Corp.

    3,453
    RFQ

    -

    510 Tube Active PGA 132 (14 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
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