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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    116-93-636-61-003000

    116-93-636-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,042
    RFQ

    -

    		 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-43-328-61-801000

    110-43-328-61-801000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,663
    RFQ

    -

    		 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    39-0508-21

    39-0508-21

    CONN SOCKET SIP 39POS GOLD

    Aries Electronics

    		 4,186
    RFQ
    		39-0508-21

    Datasheet

         		508 Bulk Active SIP 39 (1 x 39) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    39-0508-31

    39-0508-31

    CONN SOCKET SIP 39POS GOLD

    Aries Electronics

    		 4,940
    RFQ
    		39-0508-31

    Datasheet

         		508 Bulk Active SIP 39 (1 x 39) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    50-9508-20

    50-9508-20

    CONN IC DIP SOCKET 50POS GOLD

    Aries Electronics

    		 4,141
    RFQ
    		50-9508-20

    Datasheet

         		508 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    50-9508-30

    50-9508-30

    CONN IC DIP SOCKET 50POS GOLD

    Aries Electronics

    		 3,888
    RFQ
    		50-9508-30

    Datasheet

         		508 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    116-43-422-61-003000

    116-43-422-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,014
    RFQ

    -

    		 116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-322-61-003000

    116-93-322-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,409
    RFQ

    -

    		 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APA-628-G-B

    APA-628-G-B

    ADAPTER PLUG

    Samtec Inc.

    		 4,005
    RFQ
    		APA-628-G-B

    Datasheet

         		APA Bulk Active - 28 (2 x 14) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    APO-628-G-B

    APO-628-G-B

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    		 4,795
    RFQ
    		APO-628-G-B

    Datasheet

         		APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    126-93-950-41-003000

    126-93-950-41-003000

    CONN IC DIP SOCKET 50POS GOLD

    Mill-Max Manufacturing Corp.

    		 3,959
    RFQ
    		126-93-950-41-003000

    Datasheet

         		126 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-43-950-41-003000

    126-43-950-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,408
    RFQ
    		126-43-950-41-003000

    Datasheet

         		126 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    36-3553-11

    36-3553-11

    CONN IC DIP SOCKET ZIF 36POS GLD

    Aries Electronics

    		 3,167
    RFQ
    		36-3553-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-6551-11

    36-6551-11

    CONN IC DIP SOCKET ZIF 36POS GLD

    Aries Electronics

    		 3,610
    RFQ
    		36-6551-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-6552-11

    36-6552-11

    CONN IC DIP SOCKET ZIF 36POS GLD

    Aries Electronics

    		 3,547
    RFQ
    		36-6552-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-6553-11

    36-6553-11

    CONN IC DIP SOCKET ZIF 36POS

    Aries Electronics

    		 4,908
    RFQ
    		36-6553-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-3552-11

    36-3552-11

    CONN IC DIP SOCKET ZIF 36POS GLD

    Aries Electronics

    		 2,894
    RFQ
    		36-3552-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-3554-11

    36-3554-11

    CONN IC DIP SOCKET ZIF 36POS GLD

    Aries Electronics

    		 3,748
    RFQ
    		36-3554-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-6554-11

    36-6554-11

    CONN IC DIP SOCKET ZIF 36POS GLD

    Aries Electronics

    		 2,056
    RFQ
    		36-6554-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    122-13-632-41-801000

    122-13-632-41-801000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,041
    RFQ
    		122-13-632-41-801000

    Datasheet

         		122 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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