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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    APO-422-G-B

    APO-422-G-B

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    		 4,718
    RFQ
    		APO-422-G-B

    Datasheet

         		APO Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    116-43-328-61-001000

    116-43-328-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,698
    RFQ

    -

    		 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    116-43-628-61-001000

    116-43-628-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,334
    RFQ

    -

    		 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    116-93-428-61-001000

    116-93-428-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,579
    RFQ

    -

    		 116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    116-93-628-61-001000

    116-93-628-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,891
    RFQ

    -

    		 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    123-11-650-41-001000

    123-11-650-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,717
    RFQ
    		123-11-650-41-001000

    Datasheet

         		123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
    510-41-064-10-051001

    510-41-064-10-051001

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    		 2,915
    RFQ
    		510-41-064-10-051001

    Datasheet

         		510 Bulk Active PGA 64 (10 x 10) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
    117-43-648-61-005000

    117-43-648-61-005000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,425
    RFQ

    -

    		 117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    115-43-640-61-003000

    115-43-640-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,376
    RFQ

    -

    		 115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    123-13-632-41-801000

    123-13-632-41-801000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,609
    RFQ
    		123-13-632-41-801000

    Datasheet

         		123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
    116-47-964-41-001000

    116-47-964-41-001000

    STANDRD SOLDRTL

    Mill-Max Manufacturing Corp.

    		 3,917
    RFQ
    		116-47-964-41-001000

    Datasheet

         		116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    116-43-420-61-008000

    116-43-420-61-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,756
    RFQ

    -

    		 116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    116-93-320-61-008000

    116-93-320-61-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,029
    RFQ

    -

    		 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    104-11-964-41-780000

    104-11-964-41-780000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,880
    RFQ
    		104-11-964-41-780000

    Datasheet

         		104 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
    110-43-642-61-001000

    110-43-642-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,311
    RFQ

    -

    		 110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    110-93-642-61-001000

    110-93-642-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,917
    RFQ

    -

    		 110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    126-41-964-41-002000

    126-41-964-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,652
    RFQ
    		126-41-964-41-002000

    Datasheet

         		126 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    126-91-964-41-002000

    126-91-964-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,509
    RFQ
    		126-91-964-41-002000

    Datasheet

         		126 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    28-3508-311

    28-3508-311

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    		 2,589
    RFQ
    		28-3508-311

    Datasheet

         		508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    7100265149

    7100265149

    3MTEXTOOLRECEPTACLES FOR DIP SOC

    3M

    		 3,418
    RFQ

    -

    		 - Bulk Active - - - - - - - - - - - - - - -
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