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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    126-93-964-41-001000

    126-93-964-41-001000

    CONN IC DIP SOCKET 64POS GOLD

    Mill-Max Manufacturing Corp.

    		 3,519
    RFQ
    		126-93-964-41-001000

    Datasheet

         		126 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-43-964-41-001000

    126-43-964-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,268
    RFQ
    		126-43-964-41-001000

    Datasheet

         		126 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-13-636-61-001000

    110-13-636-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,789
    RFQ

    -

    		 110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-640-61-006000

    116-93-640-61-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,134
    RFQ

    -

    		 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    321-13-164-41-001000

    321-13-164-41-001000

    CONN SOCKET SIP 64POS GOLD

    Mill-Max Manufacturing Corp.

    		 2,308
    RFQ
    		321-13-164-41-001000

    Datasheet

         		321 Tube Active SIP 64 (1 x 64) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    510-43-145-15-081001

    510-43-145-15-081001

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    		 3,137
    RFQ
    		510-43-145-15-081001

    Datasheet

         		510 Tube Active PGA 145 (15 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-648-61-008000

    116-43-648-61-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,763
    RFQ

    -

    		 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    514-87-419-19-001154

    514-87-419-19-001154

    CONN SOCKET PGA 419POS GOLD

    Preci-Dip

    		 4,401
    RFQ
    		514-87-419-19-001154

    Datasheet

         		514 Bulk Active PGA 419 (19 x 19) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    514-83-192M16-001148

    514-83-192M16-001148

    CONN SOCKET BGA 192POS GOLD

    Preci-Dip

    		 2,717
    RFQ
    		514-83-192M16-001148

    Datasheet

         		514 Bulk Active BGA 192 (16 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    712-13-264-41-001000

    712-13-264-41-001000

    SOCKET CARRIER DUAL INLINE 64POS

    Mill-Max Manufacturing Corp.

    		 4,382
    RFQ
    		712-13-264-41-001000

    Datasheet

         		712 Tube Active DIP, 0.1" (2.54mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    514-83-223-18-091117

    514-83-223-18-091117

    CONN SOCKET PGA 223POS GOLD

    Preci-Dip

    		 2,756
    RFQ
    		514-83-223-18-091117

    Datasheet

         		514 Bulk Active PGA 223 (18 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    111-43-964-61-001000

    111-43-964-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,637
    RFQ

    -

    		 111 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    714-43-254-31-018000

    714-43-254-31-018000

    CONN IC DIP SOCKET 54POS GOLD

    Mill-Max Manufacturing Corp.

    		 3,914
    RFQ
    		714-43-254-31-018000

    Datasheet

         		714 Bulk Active DIP, 0.1" (2.54mm) Row Spacing 54 (2 x 27) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-432-61-007000

    116-43-432-61-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,662
    RFQ

    -

    		 116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-41-964-41-003000

    126-41-964-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,567
    RFQ
    		126-41-964-41-003000

    Datasheet

         		126 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-91-964-41-003000

    126-91-964-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,849
    RFQ
    		126-91-964-41-003000

    Datasheet

         		126 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    32-C212-21

    32-C212-21

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    		 3,546
    RFQ
    		32-C212-21

    Datasheet

         		EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    614-83-175-16-072112

    614-83-175-16-072112

    CONN SOCKET PGA 175POS GOLD

    Preci-Dip

    		 4,180
    RFQ
    		614-83-175-16-072112

    Datasheet

         		614 Bulk Active PGA 175 (16 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    APH-1420-G-R

    APH-1420-G-R

    APH-1420-G-R

    Samtec Inc.

    		 2,264
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0520-G-R

    APH-0520-G-R

    APH-0520-G-R

    Samtec Inc.

    		 2,779
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
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