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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    APH-1520-G-R

    APH-1520-G-R

    APH-1520-G-R

    Samtec Inc.

    		 2,105
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1120-G-R

    APH-1120-G-R

    APH-1120-G-R

    Samtec Inc.

    		 3,188
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0420-G-R

    APH-0420-G-R

    APH-0420-G-R

    Samtec Inc.

    		 4,625
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1320-G-R

    APH-1320-G-R

    APH-1320-G-R

    Samtec Inc.

    		 2,557
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    110-93-624-61-801000

    110-93-624-61-801000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,912
    RFQ

    -

    		 110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    510-13-044-08-031003

    510-13-044-08-031003

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    		 4,891
    RFQ
    		510-13-044-08-031003

    Datasheet

         		510 Bulk Active PGA 44 (8 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
    48-3551-11

    48-3551-11

    CONN IC DIP SOCKET ZIF 48POS GLD

    Aries Electronics

    		 4,718
    RFQ
    		48-3551-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) Gold - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled - Beryllium Copper
    48-3552-11

    48-3552-11

    CONN IC DIP SOCKET ZIF 48POS GLD

    Aries Electronics

    		 3,914
    RFQ
    		48-3552-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) Gold - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled - Beryllium Copper
    48-6551-11

    48-6551-11

    CONN IC DIP SOCKET ZIF 48POS GLD

    Aries Electronics

    		 3,416
    RFQ
    		48-6551-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled - Beryllium Copper
    48-6552-11

    48-6552-11

    CONN IC DIP SOCKET ZIF 48POS GLD

    Aries Electronics

    		 3,337
    RFQ
    		48-6552-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled - Beryllium Copper
    48-6553-11

    48-6553-11

    CONN IC DIP SOCKET ZIF 48POS GLD

    Aries Electronics

    		 4,441
    RFQ
    		48-6553-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled - Beryllium Copper
    48-3554-11

    48-3554-11

    CONN IC DIP SOCKET ZIF 48POS GLD

    Aries Electronics

    		 4,192
    RFQ
    		48-3554-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) Gold - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled - Beryllium Copper
    116-43-642-61-001000

    116-43-642-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,636
    RFQ

    -

    		 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    127-43-764-41-003000

    127-43-764-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,605
    RFQ
    		127-43-764-41-003000

    Datasheet

         		127 Tube Active DIP, 0.75" (19.05mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.070" (1.78mm) Wire Wrap 0.070" (1.78mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    614-83-179-18-111112

    614-83-179-18-111112

    CONN SOCKET PGA 179POS GOLD

    Preci-Dip

    		 4,116
    RFQ
    		614-83-179-18-111112

    Datasheet

         		614 Bulk Active PGA 179 (18 x 18) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    614-83-179-18-112112

    614-83-179-18-112112

    CONN SOCKET PGA 179POS GOLD

    Preci-Dip

    		 4,766
    RFQ
    		614-83-179-18-112112

    Datasheet

         		614 Bulk Active PGA 179 (18 x 18) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    614-87-225-17-061112

    614-87-225-17-061112

    CONN SOCKET PGA 225POS GOLD

    Preci-Dip

    		 3,478
    RFQ
    		614-87-225-17-061112

    Datasheet

         		614 Bulk Active PGA 225 (17 x 17) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    110-43-952-61-001000

    110-43-952-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,097
    RFQ

    -

    		 110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    200-6325-NUN-8100

    200-6325-NUN-8100

    CAMLEVER-STANDARD

    3M

    		 2,047
    RFQ

    -

    		 Textool™ Bulk Obsolete PGA, ZIF (ZIP) 625 (25 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 150°C Gold Polyethersulfone (PES) 30.0µin (0.76µm) Beryllium Copper
    36-6556-31

    36-6556-31

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    		 4,946
    RFQ
    		36-6556-31

    Datasheet

         		6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled 10.0µin (0.25µm) Brass
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