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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    APH-1520-G-R

    APH-1520-G-R

    APH-1520-G-R

    Samtec Inc.

    		 2,105
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1120-G-R

    APH-1120-G-R

    APH-1120-G-R

    Samtec Inc.

    		 3,188
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0420-G-R

    APH-0420-G-R

    APH-0420-G-R

    Samtec Inc.

    		 4,625
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1320-G-R

    APH-1320-G-R

    APH-1320-G-R

    Samtec Inc.

    		 2,557
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    110-93-624-61-801000

    110-93-624-61-801000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,912
    RFQ

    -

    		 110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    510-13-044-08-031003

    510-13-044-08-031003

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    		 4,891
    RFQ
    		510-13-044-08-031003

    Datasheet

         		510 Bulk Active PGA 44 (8 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    48-3551-11

    48-3551-11

    CONN IC DIP SOCKET ZIF 48POS GLD

    Aries Electronics

    		 4,718
    RFQ
    		48-3551-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    48-3552-11

    48-3552-11

    CONN IC DIP SOCKET ZIF 48POS GLD

    Aries Electronics

    		 3,914
    RFQ
    		48-3552-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    48-6551-11

    48-6551-11

    CONN IC DIP SOCKET ZIF 48POS GLD

    Aries Electronics

    		 3,416
    RFQ
    		48-6551-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    48-6552-11

    48-6552-11

    CONN IC DIP SOCKET ZIF 48POS GLD

    Aries Electronics

    		 3,337
    RFQ
    		48-6552-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    48-6553-11

    48-6553-11

    CONN IC DIP SOCKET ZIF 48POS GLD

    Aries Electronics

    		 4,441
    RFQ
    		48-6553-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    48-3554-11

    48-3554-11

    CONN IC DIP SOCKET ZIF 48POS GLD

    Aries Electronics

    		 4,192
    RFQ
    		48-3554-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    116-43-642-61-001000

    116-43-642-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,636
    RFQ

    -

    		 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    127-43-764-41-003000

    127-43-764-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,605
    RFQ
    		127-43-764-41-003000

    Datasheet

         		127 Tube Active DIP, 0.75" (19.05mm) Row Spacing 64 (2 x 32) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-83-179-18-111112

    614-83-179-18-111112

    CONN SOCKET PGA 179POS GOLD

    Preci-Dip

    		 4,116
    RFQ
    		614-83-179-18-111112

    Datasheet

         		614 Bulk Active PGA 179 (18 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-83-179-18-112112

    614-83-179-18-112112

    CONN SOCKET PGA 179POS GOLD

    Preci-Dip

    		 4,766
    RFQ
    		614-83-179-18-112112

    Datasheet

         		614 Bulk Active PGA 179 (18 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-87-225-17-061112

    614-87-225-17-061112

    CONN SOCKET PGA 225POS GOLD

    Preci-Dip

    		 3,478
    RFQ
    		614-87-225-17-061112

    Datasheet

         		614 Bulk Active PGA 225 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-43-952-61-001000

    110-43-952-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,097
    RFQ

    -

    		 110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    200-6325-NUN-8100

    200-6325-NUN-8100

    CAMLEVER-STANDARD

    3M

    		 2,047
    RFQ

    -

    		 Textool™ Bulk Obsolete PGA, ZIF (ZIP) 625 (25 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
    36-6556-31

    36-6556-31

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    		 4,946
    RFQ
    		36-6556-31

    Datasheet

         		6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
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