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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    110-13-952-61-001000

    110-13-952-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,488
    RFQ

    -

    110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    42-6556-31

    42-6556-31

    CONN IC DIP SOCKET 42POS GOLD

    Aries Electronics

    3,381
    RFQ
    42-6556-31

    Datasheet

    6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    42-6556-21

    42-6556-21

    CONN IC DIP SOCKET 42POS GOLD

    Aries Electronics

    4,442
    RFQ
    42-6556-21

    Datasheet

    6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    714-43-262-31-018000

    714-43-262-31-018000

    CONN IC DIP SOCKET 62POS GOLD

    Mill-Max Manufacturing Corp.

    4,065
    RFQ
    714-43-262-31-018000

    Datasheet

    714 Bulk Active DIP, 0.1" (2.54mm) Row Spacing 62 (2 x 31) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APA-648-G-C

    APA-648-G-C

    ADAPTER PLUG

    Samtec Inc.

    4,999
    RFQ
    APA-648-G-C

    Datasheet

    APA Bulk Active - 48 (2 x 24) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    APH-0432-G-H

    APH-0432-G-H

    APH-0432-G-H

    Samtec Inc.

    4,799
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0532-G-H

    APH-0532-G-H

    APH-0532-G-H

    Samtec Inc.

    3,997
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0632-G-H

    APH-0632-G-H

    APH-0632-G-H

    Samtec Inc.

    3,589
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0232-G-H

    APH-0232-G-H

    APH-0232-G-H

    Samtec Inc.

    3,956
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1332-G-H

    APH-1332-G-H

    APH-1332-G-H

    Samtec Inc.

    4,013
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0732-G-H

    APH-0732-G-H

    APH-0732-G-H

    Samtec Inc.

    3,193
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1132-G-H

    APH-1132-G-H

    APH-1132-G-H

    Samtec Inc.

    4,931
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1232-G-H

    APH-1232-G-H

    APH-1232-G-H

    Samtec Inc.

    4,073
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1732-G-H

    APH-1732-G-H

    APH-1732-G-H

    Samtec Inc.

    3,572
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1632-G-H

    APH-1632-G-H

    APH-1632-G-H

    Samtec Inc.

    3,640
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    117-93-764-61-005000

    117-93-764-61-005000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,485
    RFQ

    -

    117 Tube Active DIP, 0.75" (19.05mm) Row Spacing 64 (2 x 32) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    510-13-064-08-000001

    510-13-064-08-000001

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    2,507
    RFQ
    510-13-064-08-000001

    Datasheet

    510 Bulk Active PGA 64 (8 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APO-640-G-H

    APO-640-G-H

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,080
    RFQ
    APO-640-G-H

    Datasheet

    APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    APH-1024-G-H

    APH-1024-G-H

    APH-1024-G-H

    Samtec Inc.

    2,881
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1124-G-H

    APH-1124-G-H

    APH-1124-G-H

    Samtec Inc.

    3,162
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
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