Hello! now KATY Electronic Technology Co., LTD+8618924632110（Bella)
KATY Electronic Technology Co., LTDMy Inquiry KATY Electronic Technology Co., LTDMy Account
    Login or REGISTER
    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD
    All Categories
    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    APH-0624-G-H

    APH-0624-G-H

    APH-0624-G-H

    Samtec Inc.

    		 2,166
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0224-G-H

    APH-0224-G-H

    APH-0224-G-H

    Samtec Inc.

    		 2,348
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1624-G-H

    APH-1624-G-H

    APH-1624-G-H

    Samtec Inc.

    		 3,242
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0724-G-H

    APH-0724-G-H

    APH-0724-G-H

    Samtec Inc.

    		 4,165
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1724-G-H

    APH-1724-G-H

    APH-1724-G-H

    Samtec Inc.

    		 3,096
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    40-9503-21

    40-9503-21

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    		 3,989
    RFQ
    		40-9503-21

    Datasheet

         		503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    40-9503-31

    40-9503-31

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    		 2,657
    RFQ
    		40-9503-31

    Datasheet

         		503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    510-41-144-15-082001

    510-41-144-15-082001

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    		 2,316
    RFQ
    		510-41-144-15-082001

    Datasheet

         		510 Bulk Active PGA 144 (15 x 15) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-652-61-007000

    116-43-652-61-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,612
    RFQ

    -

    		 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-652-61-007000

    116-93-652-61-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,106
    RFQ

    -

    		 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-93-964-61-001000

    111-93-964-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,701
    RFQ

    -

    		 111 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    7100265148

    7100265148

    TEXTOOLRECEPTACLES FOR DIP SOCKE

    3M

    		 4,184
    RFQ

    -

    		 - Bulk Active - - - - - - - - - - - - - - -
    116-93-648-61-008000

    116-93-648-61-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,817
    RFQ

    -

    		 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    122-13-964-41-001000

    122-13-964-41-001000

    CONN IC DIP SOCKET 64POS GOLD

    Mill-Max Manufacturing Corp.

    		 3,531
    RFQ
    		122-13-964-41-001000

    Datasheet

         		122 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    323-13-164-41-001000

    323-13-164-41-001000

    SOCKET 3 LEVEL WRAPOST SIP 64POS

    Mill-Max Manufacturing Corp.

    		 4,207
    RFQ
    		323-13-164-41-001000

    Datasheet

         		323 Tube Active SIP 64 (1 x 64) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    517-87-599-54-131111

    517-87-599-54-131111

    CONN SOCKET PGA 599POS GOLD

    Preci-Dip

    		 2,440
    RFQ
    		517-87-599-54-131111

    Datasheet

         		517 Bulk Active PGA 599 (54 x 54) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-93-642-61-001000

    116-93-642-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,580
    RFQ

    -

    		 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    40-6508-212

    40-6508-212

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    		 2,578
    RFQ
    		40-6508-212

    Datasheet

         		508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    40-6508-312

    40-6508-312

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    		 3,154
    RFQ
    		40-6508-312

    Datasheet

         		508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    116-43-950-61-003000

    116-43-950-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,035
    RFQ

    -

    		 116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 846847848849850851852853...955Next»
    Fast Shipping
    Fast Shipping Fast and convenient door to door delivery.
    Paypment Security
    Paypment Security More than 5 different secure payment methods.
    Strictly Quality Control
    Strictly Quality Control 365 days After-Sales Service and Warranty
    Simple And Professional
    Simple And Professional One-stop Electronics Procurement Solutions.
    KATY Electronic Technology Co., LTD

    HOME

     KATY Electronic Technology Co., LTD

    PRODUCT

     KATY Electronic Technology Co., LTD

    PHONE

     KATY Electronic Technology Co., LTD

    USER
    KATY Electronic Technology Co., LTD
    [email protected]