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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    02-1518-10H

    02-1518-10H

    CONN IC DIP SOCKET 2POS GOLD

    Aries Electronics

    0
    RFQ
    02-1518-10H

    Datasheet

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    02-1518-10T

    02-1518-10T

    CONN IC DIP SOCKET 2POS GOLD

    Aries Electronics

    0
    RFQ
    02-1518-10T

    Datasheet

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    AR 10 HGL-TT

    AR 10 HGL-TT

    SOCKET

    Assmann WSW Components

    0
    RFQ
    AR 10 HGL-TT

    Datasheet

    AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    AR14-HZL-TT

    AR14-HZL-TT

    CONN IC DIP SOCKET 14POS TIN

    Assmann WSW Components

    0
    RFQ
    AR14-HZL-TT

    Datasheet

    - Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    232-44

    232-44

    CONN SOCKET PLCC 44POS TIN

    CNC Tech

    0
    RFQ
    232-44

    Datasheet

    - Tube Obsolete PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Polyphenylene Sulfide (PPS), Glass Filled -55°C ~ 105°C
    110-87-308-41-005101

    110-87-308-41-005101

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    0
    RFQ
    110-87-308-41-005101

    Datasheet

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    SIP050-1X04-160B

    SIP050-1X04-160B

    1X04-160B-SIP SOCKET 4 CTS

    Amphenol ICC (FCI)

    0
    RFQ
    SIP050-1X04-160B

    Datasheet

    SIP050-1x Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    AW 127-17/Z-T

    AW 127-17/Z-T

    SOCKET 17 CONTACTS SINGLE ROW

    Assmann WSW Components

    0
    RFQ
    AW 127-17/Z-T

    Datasheet

    - - Active - - - - - - - - - - - - - - -
    AR14-HZL/07-TT

    AR14-HZL/07-TT

    CONN IC DIP SOCKET 14POS GOLD

    Assmann WSW Components

    0
    RFQ
    AR14-HZL/07-TT

    Datasheet

    - Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    A22-LC-TT

    A22-LC-TT

    CONN IC DIP SOCKET 6POS TIN

    Assmann WSW Components

    0
    RFQ
    A22-LC-TT

    Datasheet

    - Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
    115-87-306-41-003101

    115-87-306-41-003101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    0
    RFQ
    115-87-306-41-003101

    Datasheet

    115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    1-1825093-1

    1-1825093-1

    CONN IC DIP SOCKET 6POS GOLD

    TE Connectivity AMP Connectors

    0
    RFQ
    1-1825093-1

    Datasheet

    Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 125°C
    01-0513-10H

    01-0513-10H

    CONN SOCKET SIP 1POS GOLD

    Aries Electronics

    0
    RFQ
    01-0513-10H

    Datasheet

    0513 Bulk Active SIP 1 (1 x 1) - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    02-0513-10

    02-0513-10

    CONN SOCKET SIP 2POS GOLD

    Aries Electronics

    0
    RFQ
    02-0513-10

    Datasheet

    0513 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    116-87-304-41-012101

    116-87-304-41-012101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    0
    RFQ
    116-87-304-41-012101

    Datasheet

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    A28-LC-7-TT-R

    A28-LC-7-TT-R

    CONN IC DIP SOCKET 28POS TIN

    Assmann WSW Components

    0
    RFQ
    A28-LC-7-TT-R

    Datasheet

    - Box Obsolete DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
    HLS-2001-TT-11

    HLS-2001-TT-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    0
    RFQ
    HLS-2001-TT-11

    Datasheet

    HLS Bulk Active SIP 20 (20 x 1) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
    4-1814655-7

    4-1814655-7

    CONN SOCKET SIP 5POS GOLD

    TE Connectivity AMP Connectors

    0
    RFQ
    4-1814655-7

    Datasheet

    - Bulk Obsolete SIP 5 (1 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Thermoplastic, Polyester -55°C ~ 125°C
    AW 127-18/Z-T

    AW 127-18/Z-T

    SOCKET 18 CONTACTS SINGLE ROW

    Assmann WSW Components

    0
    RFQ
    AW 127-18/Z-T

    Datasheet

    - - Active - - - - - - - - - - - - - - -
    SIP050-1X05-157B

    SIP050-1X05-157B

    1X05-157B-SIP SOCKET 5 CTS

    Amphenol ICC (FCI)

    0
    RFQ
    SIP050-1X05-157B

    Datasheet

    SIP050-1x Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
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