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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
AR06-HZL/01-TTCONN IC DIP SOCKET 6POS GOLD |
2,621 |
|
Datasheet |
- | Bag | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Thermoplastic, Polyester | 200.0µin (5.08µm) | Beryllium Copper |
|
|
AW 127-11/Z-TSOCKET 11 CONTACTS SINGLE ROW |
3,264 |
|
Datasheet |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
SIP1X06-011BSIP1X06-011B-SIP SOCKET 6 CTS |
3,456 |
|
Datasheet |
SIP1x | Bulk | Active | SIP | 6 (1 x 6) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin-Lead | Polyphenylene Sulfide (PPS), Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
01-0518-11CONN SOCKET SIP 1POS GOLD |
2,486 |
|
Datasheet |
518 | Bulk | Active | SIP | 1 (1 x 1) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Brass |
|
|
HLS-2001-TT-12.100" SCREW MACHINE SOCKET ARRAY |
3,063 |
|
Datasheet |
HLS | Bulk | Active | SIP | 20 (20 x 1) | Tin | - | - | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 140°C | Tin | Thermoplastic | - | - |
|
|
01-0518-10HCONN SOCKET SIP 1POS GOLD |
2,856 |
|
Datasheet |
518 | Bulk | Active | SIP | 1 (1 x 1) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
AW 127-12/Z-TSOCKET 12 CONTACTS SINGLE ROW |
3,093 |
|
Datasheet |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
1825093-1CONN IC DIP SOCKET 6POS GOLD |
4,897 |
|
Datasheet |
Diplomate DL | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Thermoplastic, Glass Filled | 15.0µin (0.38µm) | Phosphor Bronze |
|
110-87-306-41-005101CONN IC DIP SOCKET 6POS GOLD |
4,205 |
|
Datasheet |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
110-87-306-41-605101CONN IC DIP SOCKET 6POS GOLD |
4,333 |
|
Datasheet |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
614-87-304-41-001101CONN IC DIP SOCKET 321POS GOLD |
4,051 |
|
Datasheet |
614 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 321 (21 x 21) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
DIP308-001BDIP SOCKET 8 CTS |
2,255 |
|
Datasheet |
- | Bag | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 200.0µin (5.08µm) | Brass |
|
110-87-304-41-105101CONN IC DIP SOCKET 4POS GOLD |
3,123 |
|
Datasheet |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 4 (2 x 2) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
SIP050-1X03-160B1X03-160B-SIP SOCKET 3 CTS |
3,848 |
|
Datasheet |
SIP050-1x | Bulk | Active | SIP | 3 (1 x 3) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 200.0µin (5.08µm) | Brass |
|
A14-LCGCONN IC DIP SOCKET 14POS GOLD |
4,874 |
|
- |
- | - | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | - | - | Through Hole | Open Frame | 0.100" (2.54mm) | - | 0.100" (2.54mm) | - | Gold | - | - | - |
|
1-390262-3CONN IC DIP SOCKET 32POS TIN |
4,822 |
|
Datasheet |
- | Tape & Reel (TR) | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | - | - | Phosphor Bronze |
|
612-87-304-41-001101CONN IC DIP SOCKET 4POS GOLD |
4,489 |
|
Datasheet |
612 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 4 (2 x 2) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
AR 08 HGL-TTSOCKET |
2,979 |
|
Datasheet |
AR | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Gold | Polybutylene Terephthalate (PBT), Glass Filled | Flash | Brass |
|
|
01-0518-10TCONN SOCKET SIP 1POS GOLD |
2,431 |
|
Datasheet |
518 | Bulk | Active | SIP | 1 (1 x 1) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
110-83-304-41-001101CONN IC DIP SOCKET 4POS GOLD |
4,218 |
|
Datasheet |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 4 (2 x 2) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
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