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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
220-2600-50-06023M TEXTOOL ZIP STRIP SOCKETS 220 |
3,065 |
|
- |
Textool™ | Box | Active | SIP, ZIF (ZIP) | 20 (1 x 20) | Gold | - | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polysulfone (PSU), Glass Filled | 30.0µin (0.76µm) | Beryllium Copper |
|
|
518-77-256M16-000105CONN SOCKET PGA 256POS GOLD |
3,085 |
|
Datasheet |
518 | Bulk | Active | PGA | 256 (16 x 16) | Gold | Flash | Beryllium Copper | Through Hole | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | -55°C ~ 125°C | Gold | FR4 Epoxy Glass | Flash | Brass |
|
|
518-77-256M20-001105CONN SOCKET PGA 256POS GOLD |
4,228 |
|
Datasheet |
518 | Bulk | Active | PGA | 256 (20 x 20) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | -55°C ~ 125°C | Gold | FR4 Epoxy Glass | Flash | Brass |
|
|
514-87-400M20-000148CONN SOCKET BGA 400POS GOLD |
3,886 |
|
Datasheet |
514 | Bulk | Active | BGA | 400 (20 x 20) | Gold | Flash | Beryllium Copper | Surface Mount | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
550-10-292M20-001152BGA SOLDER TAIL |
4,744 |
|
Datasheet |
550 | Bulk | Active | BGA | 292 (20 x 20) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | -55°C ~ 125°C | Gold | FR4 Epoxy Glass | 10.0µin (0.25µm) | Brass |
|
|
APH-1136-G-RAPH-1136-G-R |
4,062 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-1236-G-RAPH-1236-G-R |
4,077 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-1736-G-RAPH-1736-G-R |
3,198 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-1336-G-RAPH-1336-G-R |
4,760 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
550-10-420M26-001166BGA PIN ADAPTER 1.27MM SMD |
3,202 |
|
Datasheet |
550 | Bulk | Active | BGA | 420 (26 x 26) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | -55°C ~ 125°C | Gold | FR4 Epoxy Glass | 10.0µin (0.25µm) | Brass |
|
|
2100-7243-00-1807CONN SOCKET PQFP 100POS TIN-LEAD |
2,735 |
|
Datasheet |
OEM | Bulk | Obsolete | QFP | 100 (4 x 25) | Tin-Lead | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Open Frame | - | Solder | - | 0°C ~ 105°C | Tin-Lead | Polyethersulfone (PES), Glass Filled | 200.0µin (5.08µm) | Beryllium Copper |
|
|
614-87-296-19-131144CONN SOCKET PGA 296POS GOLD |
2,069 |
|
Datasheet |
614 | Bulk | Active | PGA | 296 (19 x 19) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
546-87-447-20-121147CONN SOCKET PGA 447POS GOLD |
3,139 |
|
Datasheet |
546 | Bulk | Active | PGA | 447 (20 x 20) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.050" (1.27mm) | Press-Fit | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Bronze |
|
|
518-77-255M16-001106CONN SOCKET PGA 255POS GOLD |
4,489 |
|
Datasheet |
518 | Bulk | Active | PGA | 255 (16 x 16) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | -55°C ~ 125°C | Gold | FR4 Epoxy Glass | Flash | Brass |
|
|
239-5605-02-0602CONN ZIG-ZAG 39POS GOLD |
2,027 |
|
Datasheet |
- | Bulk | Obsolete | Zig-Zag | 39 (1 x 19, 1 x 20) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 150°C | Gold | Polysulfone (PSU), Glass Filled | 30.0µin (0.76µm) | Beryllium Copper |
|
|
510-91-324-18-000001SKT PGA SOLDRTL |
3,670 |
|
Datasheet |
510 | Bulk | Active | PGA | 324 (18 x 18) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
518-77-256M16-000106CONN SOCKET PGA 256POS GOLD |
4,268 |
|
Datasheet |
518 | Bulk | Active | PGA | 256 (16 x 16) | Gold | Flash | Beryllium Copper | Surface Mount | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | -55°C ~ 125°C | Gold | FR4 Epoxy Glass | Flash | Brass |
|
|
518-77-256M20-001106CONN SOCKET PGA 256POS GOLD |
2,330 |
|
Datasheet |
518 | Bulk | Active | PGA | 256 (20 x 20) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | -55°C ~ 125°C | Gold | FR4 Epoxy Glass | Flash | Brass |
|
|
64-9503-21CONN IC DIP SOCKET 64POS GOLD |
2,849 |
|
Datasheet |
503 | Bulk | Active | DIP, 0.9" (22.86mm) Row Spacing | 64 (2 x 32) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Phosphor Bronze |
|
|
64-9503-31CONN IC DIP SOCKET 64POS GOLD |
2,253 |
|
Datasheet |
503 | Bulk | Active | DIP, 0.9" (22.86mm) Row Spacing | 64 (2 x 32) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Phosphor Bronze |
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