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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    APH-1140-G-H

    APH-1140-G-H

    APH-1140-G-H

    Samtec Inc.

    		 4,474
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    24-6570-16

    24-6570-16

    CONN IC DIP SOCKET ZIF 24POS

    Aries Electronics

    		 3,649
    RFQ
    		24-6570-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    24-6571-16

    24-6571-16

    CONN IC DIP SOCKET ZIF 24POS

    Aries Electronics

    		 2,823
    RFQ
    		24-6571-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    24-6573-16

    24-6573-16

    CONN IC DIP SOCKET ZIF 24POS

    Aries Electronics

    		 4,170
    RFQ
    		24-6573-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    546-83-364-17-091147

    546-83-364-17-091147

    CONN SOCKET PGA 364POS GOLD

    Preci-Dip

    		 4,378
    RFQ
    		546-83-364-17-091147

    Datasheet

         		546 Bulk Active PGA 364 (17 x 17) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    24-3575-16

    24-3575-16

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    		 4,381
    RFQ
    		24-3575-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    24-6575-16

    24-6575-16

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    		 3,769
    RFQ
    		24-6575-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    HLS-0420-G-19

    HLS-0420-G-19

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 3,705
    RFQ
    		HLS-0420-G-19

    Datasheet

         		HLS Bulk Active SIP 80 (4 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    510-93-299-20-096002

    510-93-299-20-096002

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    		 2,216
    RFQ
    		510-93-299-20-096002

    Datasheet

         		510 Tube Active PGA 299 (20 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    518-77-272M20-001106

    518-77-272M20-001106

    CONN SOCKET PGA 272POS GOLD

    Preci-Dip

    		 3,966
    RFQ
    		518-77-272M20-001106

    Datasheet

         		518 Bulk Active PGA 272 (20 x 20) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    546-83-365-14-000147

    546-83-365-14-000147

    CONN SOCKET PGA 365POS GOLD

    Preci-Dip

    		 2,180
    RFQ
    		546-83-365-14-000147

    Datasheet

         		546 Bulk Active PGA 365 (14 x 14) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    546-83-365-17-091147

    546-83-365-17-091147

    CONN SOCKET PGA 365POS GOLD

    Preci-Dip

    		 3,003
    RFQ
    		546-83-365-17-091147

    Datasheet

         		546 Bulk Active PGA 365 (17 x 17) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    514-87-432M31-001148

    514-87-432M31-001148

    CONN SOCKET BGA 432POS GOLD

    Preci-Dip

    		 3,477
    RFQ
    		514-87-432M31-001148

    Datasheet

         		514 Bulk Active BGA 432 (31 x 31) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    48-6508-21

    48-6508-21

    CONN IC DIP SOCKET 48POS GOLD

    Aries Electronics

    		 3,373
    RFQ
    		48-6508-21

    Datasheet

         		508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    48-6508-31

    48-6508-31

    CONN IC DIP SOCKET 48POS GOLD

    Aries Electronics

    		 4,436
    RFQ
    		48-6508-31

    Datasheet

         		508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    24-3551-16

    24-3551-16

    CONN IC DIP SOCKET ZIF 24POS

    Aries Electronics

    		 4,059
    RFQ
    		24-3551-16

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    24-3552-16

    24-3552-16

    CONN IC DIP SOCKET ZIF 24POS

    Aries Electronics

    		 4,989
    RFQ
    		24-3552-16

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    24-6551-16

    24-6551-16

    CONN IC DIP SOCKET ZIF 24POS

    Aries Electronics

    		 4,765
    RFQ
    		24-6551-16

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    24-6552-16

    24-6552-16

    CONN IC DIP SOCKET ZIF 24POS

    Aries Electronics

    		 3,856
    RFQ
    		24-6552-16

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    24-3553-16

    24-3553-16

    CONN IC DIP SOCKET ZIF 24POS

    Aries Electronics

    		 2,988
    RFQ
    		24-3553-16

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
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