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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
514-83-352M26-001148CONN SOCKET BGA 352POS GOLD |
2,144 |
|
Datasheet |
514 | Bulk | Active | BGA | 352 (26 x 26) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
514-87-456M26-001148CONN SOCKET BGA 456POS GOLD |
4,337 |
|
Datasheet |
514 | Bulk | Active | BGA | 456 (26 x 26) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
24-3574-16CONN IC DIP SOCKET ZIF 24POS TIN |
4,251 |
|
Datasheet |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyphenylene Sulfide (PPS), Glass Filled | 200.0µin (5.08µm) | Beryllium Copper |
|
|
550-10-478M26-131166BGA PIN ADAPTER 1.27MM SMD |
3,243 |
|
Datasheet |
550 | Bulk | Active | BGA | 478 (26 x 26) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | -55°C ~ 125°C | Gold | FR4 Epoxy Glass | 10.0µin (0.25µm) | Brass |
|
|
28-3571-16CONN IC DIP SOCKET ZIF 28POS |
4,464 |
|
Datasheet |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Nickel Boron | Polyphenylene Sulfide (PPS), Glass Filled | 50.0µin (1.27µm) | Beryllium Nickel |
|
|
28-3572-16CONN IC DIP SOCKET ZIF 28POS |
4,590 |
|
Datasheet |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Nickel Boron | Polyphenylene Sulfide (PPS), Glass Filled | 50.0µin (1.27µm) | Beryllium Nickel |
|
|
28-3573-16CONN IC DIP SOCKET ZIF 28POS |
4,557 |
|
Datasheet |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Nickel Boron | Polyphenylene Sulfide (PPS), Glass Filled | 50.0µin (1.27µm) | Beryllium Nickel |
|
|
28-3574-16CONN IC DIP SOCKET ZIF 28POS GLD |
4,014 |
|
Datasheet |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Gold | Polyphenylene Sulfide (PPS), Glass Filled | 10.0µin (0.25µm) | Beryllium Copper |
|
|
28-6572-16CONN IC DIP SOCKET ZIF 28POS TIN |
4,399 |
|
Datasheet |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyphenylene Sulfide (PPS), Glass Filled | 200.0µin (5.08µm) | Beryllium Copper |
|
|
28-6574-16CONN IC DIP SOCKET ZIF 28POS TIN |
4,954 |
|
Datasheet |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyphenylene Sulfide (PPS), Glass Filled | 200.0µin (5.08µm) | Beryllium Copper |
|
|
510-91-400-20-000001SKT PGA SOLDRTL |
3,571 |
|
Datasheet |
510 | Bulk | Active | PGA | 400 (20 x 20) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
514-83-356M26-001148CONN SOCKET BGA 356POS GOLD |
3,995 |
|
Datasheet |
514 | Bulk | Active | BGA | 356 (26 x 26) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
550-10-480M29-001166BGA PIN ADAPTER 1.27MM SMD |
4,261 |
|
Datasheet |
550 | Bulk | Active | BGA | 480 (29 x 29) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | -55°C ~ 125°C | Gold | FR4 Epoxy Glass | 10.0µin (0.25µm) | Brass |
|
|
514-83-357M19-001148CONN SOCKET BGA 357POS GOLD |
4,321 |
|
Datasheet |
514 | Bulk | Active | BGA | 357 (19 x 19) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
518-77-292M20-001106CONN SOCKET PGA 292POS GOLD |
3,822 |
|
Datasheet |
518 | Bulk | Active | PGA | 292 (20 x 20) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | -55°C ~ 125°C | Gold | FR4 Epoxy Glass | Flash | Brass |
|
|
28-3570-16CONN IC DIP SOCKET ZIF 28POS |
4,145 |
|
Datasheet |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Nickel Boron | Polyphenylene Sulfide (PPS), Glass Filled | 50.0µin (1.27µm) | Beryllium Nickel |
|
|
28-6570-16CONN IC DIP SOCKET ZIF 28POS |
4,258 |
|
Datasheet |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Nickel Boron | Polyphenylene Sulfide (PPS), Glass Filled | 50.0µin (1.27µm) | Beryllium Nickel |
|
|
28-6571-16CONN IC DIP SOCKET ZIF 28POS |
3,856 |
|
Datasheet |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Nickel Boron | Polyphenylene Sulfide (PPS), Glass Filled | 50.0µin (1.27µm) | Beryllium Nickel |
|
|
28-6573-16CONN IC DIP SOCKET ZIF 28POS TIN |
4,507 |
|
Datasheet |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyphenylene Sulfide (PPS), Glass Filled | 200.0µin (5.08µm) | Beryllium Copper |
|
|
50-9508-21CONN IC DIP SOCKET 50POS GOLD |
2,965 |
|
Datasheet |
508 | Bulk | Active | DIP, 0.9" (22.86mm) Row Spacing | 50 (2 x 25) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Brass |
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