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+8618924632110（Bella)
+8618924632110（Bella)
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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
110-88-314-41-001000STANDRD SOLDER TAIL DIP SOCKET |
2,268 |
|
- |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Thermoplastic | 30.0µin (0.76µm) | Brass |
|
|
110-83-314-41-530000CONN IC DIP SOCKET 14POS GOLD |
3,950 |
|
- |
110 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 300.0µin (7.62µm) | Brass Alloy |
|
|
110-88-316-41-001000STANDRD SOLDER TAIL DIP SOCKET |
4,942 |
|
- |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Thermoplastic | 30.0µin (0.76µm) | Brass |
|
|
614-83-296-19-131144CONN SOCKET PGA 296POS GOLD |
4,859 |
|
Datasheet |
614 | Bulk | Active | PGA | 296 (19 x 19) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
546-83-419-19-111147CONN SOCKET PGA 419POS GOLD |
4,468 |
|
Datasheet |
546 | Bulk | Active | PGA | 419 (19 x 19) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | 0.050" (1.27mm) | Press-Fit | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Bronze |
|
|
210-83-306-41-001000STANDRD SOLDER TAIL DIP SOCKET |
2,762 |
|
- |
210 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Thermoplastic | 300.0µin (7.62µm) | Beryllium Copper |
|
|
514-87-504M29-001148CONN SOCKET BGA 504POS GOLD |
4,410 |
|
Datasheet |
514 | Bulk | Active | BGA | 504 (29 x 29) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
546-83-420-19-111147CONN SOCKET PGA 420POS GOLD |
2,760 |
|
Datasheet |
546 | Bulk | Active | PGA | 420 (19 x 19) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | 0.050" (1.27mm) | Press-Fit | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Bronze |
|
|
110-83-308-41-001000STANDRD SOLDER TAIL DIP SOCKET |
4,574 |
|
- |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Thermoplastic | 30.0µin (0.76µm) | Brass |
|
|
210-83-308-41-001000STANDRD SOLDER TAIL DIP SOCKET |
3,586 |
|
Datasheet |
210 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Thermoplastic | 300.0µin (7.62µm) | Brass |
|
|
510-13-209-17-081002SKT PGA SOLDRTL |
2,207 |
|
Datasheet |
510 | Bulk | Active | PGA | 209 (17 x 17) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 10.0µin (0.25µm) | Brass Alloy |
|
|
110-88-318-41-001000STANDRD SOLDER TAIL DIP SOCKET |
4,282 |
|
- |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Thermoplastic | 30.0µin (0.76µm) | Brass |
|
|
110-83-320-41-530000CONN IC SKT DBL |
3,785 |
|
Datasheet |
110 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 300.0µin (7.62µm) | Brass Alloy |
|
|
210-83-320-41-101000CONN IC SKT DBL |
4,081 |
|
Datasheet |
210 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 300.0µin (7.62µm) | Brass Alloy |
|
|
210-83-624-41-101000CONN IC SKT DBL |
4,047 |
|
Datasheet |
210 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 300.0µin (7.62µm) | Brass Alloy |
|
|
110-88-640-41-530000CONN IC SKT DBL |
2,993 |
|
Datasheet |
110 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | - | - | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | - | Brass Alloy |
|
|
110-88-624-41-001000STANDRD SOLDER TAIL DIP SOCKET |
3,827 |
|
- |
110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Thermoplastic | 30.0µin (0.76µm) | Brass |
|
|
28-536-11CONN SOCKET PLCC ZIF 28POS GOLD |
2,152 |
|
- |
536 | - | Obsolete | PLCC, ZIF (ZIP) | 28 (4 x 7) | Gold | 12.0µin (0.30µm) | - | Through Hole | Open Frame | 0.050" (1.27mm) | - | - | - | - | - | - | - |
|
|
144-PGM12001-51CONN SOCKET PGA GOLD |
3,281 |
|
Datasheet |
PGM | Bulk | Active | PGA | - | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Brass |
|
|
HLS-0420-G-12.100" SCREW MACHINE SOCKET ARRAY |
4,947 |
|
Datasheet |
HLS | Bulk | Active | SIP | 80 (4 x 20) | Gold | 30.0µin (0.76µm) | - | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 140°C | Gold | Thermoplastic | 10.0µin (0.25µm) | - |
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