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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    32-3572-16

    32-3572-16

    CONN IC DIP SOCKET ZIF 32POS

    Aries Electronics

    		 2,248
    RFQ
    		32-3572-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Nickel Boron Polyphenylene Sulfide (PPS), Glass Filled 50.0µin (1.27µm) Beryllium Nickel
    32-3573-16

    32-3573-16

    CONN IC DIP SOCKET ZIF 32POS

    Aries Electronics

    		 4,063
    RFQ
    		32-3573-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Nickel Boron Polyphenylene Sulfide (PPS), Glass Filled 50.0µin (1.27µm) Beryllium Nickel
    110-83-318-41-001000

    110-83-318-41-001000

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    		 2,569
    RFQ

    -

    		 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Thermoplastic 30.0µin (0.76µm) Brass
    558-10-356M26-001101

    558-10-356M26-001101

    PGA SOLDER TAIL 1.27MM

    Preci-Dip

    		 4,657
    RFQ
    		558-10-356M26-001101

    Datasheet

         		558 Bulk Active PGA 356 (26 x 26) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 125°C Gold FR4 Epoxy Glass 10.0µin (0.25µm) Brass
    210-33-306-41-001000

    210-33-306-41-001000

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    		 4,576
    RFQ

    -

    		 210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Thermoplastic 30.0µin (0.76µm) Beryllium Copper
    210-83-422-41-001000

    210-83-422-41-001000

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    		 3,909
    RFQ

    -

    		 - Tube Active - - - - - - - - - - - - - - -
    558-10-357M19-001101

    558-10-357M19-001101

    PGA SOLDER TAIL 1.27MM

    Preci-Dip

    		 3,816
    RFQ
    		558-10-357M19-001101

    Datasheet

         		558 Bulk Active PGA 357 (19 x 19) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 125°C Gold FR4 Epoxy Glass 10.0µin (0.25µm) Brass
    514-87-520M31-001148

    514-87-520M31-001148

    CONN SOCKET BGA 520POS GOLD

    Preci-Dip

    		 2,355
    RFQ
    		514-87-520M31-001148

    Datasheet

         		514 Bulk Active BGA 520 (31 x 31) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    110-83-640-41-530000

    110-83-640-41-530000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,329
    RFQ
    		110-83-640-41-530000

    Datasheet

         		110 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 300.0µin (7.62µm) Brass Alloy
    32-6570-16

    32-6570-16

    CONN IC DIP SOCKET ZIF 32POS

    Aries Electronics

    		 3,578
    RFQ
    		32-6570-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Nickel Boron Polyphenylene Sulfide (PPS), Glass Filled 50.0µin (1.27µm) Beryllium Nickel
    32-6571-16

    32-6571-16

    CONN IC DIP SOCKET ZIF 32POS

    Aries Electronics

    		 2,904
    RFQ
    		32-6571-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Nickel Boron Polyphenylene Sulfide (PPS), Glass Filled 50.0µin (1.27µm) Beryllium Nickel
    32-6572-16

    32-6572-16

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    		 4,786
    RFQ
    		32-6572-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
    32-6573-16

    32-6573-16

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    		 4,217
    RFQ
    		32-6573-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
    110-83-624-41-001000

    110-83-624-41-001000

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    		 4,725
    RFQ

    -

    		 - Tube Active - - - - - - - - - - - - - - -
    223-88-316-41-001000

    223-88-316-41-001000

    STANDARD WIRE WRAP DIP SOCKET

    Mill-Max Manufacturing Corp.

    		 2,973
    RFQ

    -

    		 223 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Thermoplastic 300.0µin (7.62µm) Beryllium Copper
    110-88-648-41-001000

    110-88-648-41-001000

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    		 4,691
    RFQ

    -

    		 - Tube Active - - - - - - - - - - - - - - -
    558-10-360M19-001101

    558-10-360M19-001101

    PGA SOLDER TAIL 1.27MM

    Preci-Dip

    		 3,536
    RFQ
    		558-10-360M19-001101

    Datasheet

         		558 Bulk Active PGA 360 (19 x 19) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 125°C Gold FR4 Epoxy Glass 10.0µin (0.25µm) Brass
    84-PGM13042-10T

    84-PGM13042-10T

    CONN SOCKET PGA TIN

    Aries Electronics

    		 4,609
    RFQ
    		84-PGM13042-10T

    Datasheet

         		PGM Bulk Active PGA - Tin 200.0µin (5.08µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    210-33-308-41-001000

    210-33-308-41-001000

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    		 4,435
    RFQ

    -

    		 210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Thermoplastic 30.0µin (0.76µm) Brass
    110-33-308-41-001000

    110-33-308-41-001000

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    		 3,346
    RFQ
    		110-33-308-41-001000

    Datasheet

         		110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Thermoplastic 30.0µin (0.76µm) Brass
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