KATY Electronic Technology Co., LTD - IC Sockets - Sockets for ICs, Transistors - page 890 - Original source of goods - Electronic Components Supplier | IC Distributor

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
518-77-357M19-001105 CONN SOCKET PGA 357POS GOLD Preci-Dip	4,459	-	RFQ	Datasheet	518	Bulk	Active	PGA	357 (19 x 19)	0.050" (1.27mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.050" (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
110-33-628-41-530000 CONN IC DIP SOCKET 28POS GOLD Mill-Max Manufacturing Corp.	4,677	-	RFQ	-	110	Tube	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	-	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
210-33-628-41-101000 SOCKET IC CLOSED FRM .300 28POS Mill-Max Manufacturing Corp.	2,006	-	RFQ	-	210	Tube	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
210-33-316-41-001000 STANDRD SOLDER TAIL DIP SOCKET Mill-Max Manufacturing Corp.	3,003	-	RFQ	Datasheet	210	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	16	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Brass	Thermoplastic	-55°C ~ 125°C
110-33-316-41-001000 STANDRD SOLDER TAIL DIP SOCKET Mill-Max Manufacturing Corp.	3,997	-	RFQ	-	-	Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
36-3551-16 CONN IC DIP SOCKET ZIF 36POS Aries Electronics	2,974	-	RFQ	Datasheet	55	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	36 (2 x 18)	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
558-10-360M19-001104 BGA SURFACE MOUNT 1.27MM Preci-Dip	3,882	-	RFQ	Datasheet	558	Bulk	Active	BGA	360 (19 x 19)	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Brass	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
518-77-352M26-001106 CONN SOCKET PGA 352POS GOLD Preci-Dip	2,486	-	RFQ	Datasheet	518	Bulk	Active	PGA	352 (26 x 26)	0.050" (1.27mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.050" (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
1109042 537 ZIF TEST SCKT LIVE BUG TYPE Aries Electronics	4,785	-	RFQ	Datasheet	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
514-83-432M31-001148 CONN SOCKET BGA 432POS GOLD Preci-Dip	2,463	-	RFQ	Datasheet	514	Bulk	Active	BGA	432 (31 x 31)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
518-77-360M19-001105 CONN SOCKET PGA 360POS GOLD Preci-Dip	4,966	-	RFQ	Datasheet	518	Bulk	Active	PGA	360 (19 x 19)	0.050" (1.27mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.050" (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
514-87-560M33-001148 CONN SOCKET BGA 560POS GOLD Preci-Dip	3,438	-	RFQ	Datasheet	514	Bulk	Active	BGA	560 (33 x 33)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
210-33-320-41-001000 STANDRD SOLDER TAIL DIP SOCKET Mill-Max Manufacturing Corp.	3,291	-	RFQ	-	-	Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
518-77-356M26-001106 CONN SOCKET PGA 356POS GOLD Preci-Dip	4,144	-	RFQ	Datasheet	518	Bulk	Active	PGA	356 (26 x 26)	0.050" (1.27mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.050" (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
281-PGM18037-11 CONN SOCKET PGA GOLD Aries Electronics	2,845	-	RFQ	Datasheet	PGM	Bulk	Active	PGA	-	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
210-33-632-41-101000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2,792	-	RFQ	Datasheet	210	Tube	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
110-33-318-41-001000 STANDRD SOLDER TAIL DIP SOCKET Mill-Max Manufacturing Corp.	3,428	-	RFQ	-	-	Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
210-33-318-41-001000 STANDRD SOLDER TAIL DIP SOCKET Mill-Max Manufacturing Corp.	3,761	-	RFQ	-	-	Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
518-77-357M19-001106 CONN SOCKET PGA 357POS GOLD Preci-Dip	3,523	-	RFQ	Datasheet	518	Bulk	Active	PGA	357 (19 x 19)	0.050" (1.27mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.050" (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
558-10-388M26-001101 PGA SOLDER TAIL 1.27MM Preci-Dip	4,332	-	RFQ	Datasheet	558	Bulk	Active	PGA	388 (26 x 26)	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C

Total 19086 Record«Prev 1... 886 887 888 889890891 892 893...955 Next»