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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    518-77-357M19-001105

    518-77-357M19-001105

    CONN SOCKET PGA 357POS GOLD

    Preci-Dip

    4,459
    RFQ
    518-77-357M19-001105

    Datasheet

    518 Bulk Active PGA 357 (19 x 19) Gold Flash Beryllium Copper Through Hole Open Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 125°C Gold FR4 Epoxy Glass Flash Brass
    110-33-628-41-530000

    110-33-628-41-530000

    CONN IC DIP SOCKET 28POS GOLD

    Mill-Max Manufacturing Corp.

    4,677
    RFQ

    -

    110 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
    210-33-628-41-101000

    210-33-628-41-101000

    SOCKET IC CLOSED FRM .300 28POS

    Mill-Max Manufacturing Corp.

    2,006
    RFQ

    -

    210 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 30.0µin (0.76µm) Brass Alloy
    210-33-316-41-001000

    210-33-316-41-001000

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    3,003
    RFQ
    210-33-316-41-001000

    Datasheet

    210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Thermoplastic 30.0µin (0.76µm) Brass
    110-33-316-41-001000

    110-33-316-41-001000

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    3,997
    RFQ

    -

    - Tube Active - - - - - - - - - - - - - - -
    36-3551-16

    36-3551-16

    CONN IC DIP SOCKET ZIF 36POS

    Aries Electronics

    2,974
    RFQ
    36-3551-16

    Datasheet

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Nickel Boron Polyphenylene Sulfide (PPS), Glass Filled 50.0µin (1.27µm) Beryllium Copper
    558-10-360M19-001104

    558-10-360M19-001104

    BGA SURFACE MOUNT 1.27MM

    Preci-Dip

    3,882
    RFQ
    558-10-360M19-001104

    Datasheet

    558 Bulk Active BGA 360 (19 x 19) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 125°C Gold FR4 Epoxy Glass 10.0µin (0.25µm) Brass
    518-77-352M26-001106

    518-77-352M26-001106

    CONN SOCKET PGA 352POS GOLD

    Preci-Dip

    2,486
    RFQ
    518-77-352M26-001106

    Datasheet

    518 Bulk Active PGA 352 (26 x 26) Gold Flash Beryllium Copper Surface Mount Open Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 125°C Gold FR4 Epoxy Glass Flash Brass
    1109042

    1109042

    537 ZIF TEST SCKT LIVE BUG TYPE

    Aries Electronics

    4,785
    RFQ
    1109042

    Datasheet

    - - Active - - - - - - - - - - - - - - -
    514-83-432M31-001148

    514-83-432M31-001148

    CONN SOCKET BGA 432POS GOLD

    Preci-Dip

    2,463
    RFQ
    514-83-432M31-001148

    Datasheet

    514 Bulk Active BGA 432 (31 x 31) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    518-77-360M19-001105

    518-77-360M19-001105

    CONN SOCKET PGA 360POS GOLD

    Preci-Dip

    4,966
    RFQ
    518-77-360M19-001105

    Datasheet

    518 Bulk Active PGA 360 (19 x 19) Gold Flash Beryllium Copper Through Hole Open Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 125°C Gold FR4 Epoxy Glass Flash Brass
    514-87-560M33-001148

    514-87-560M33-001148

    CONN SOCKET BGA 560POS GOLD

    Preci-Dip

    3,438
    RFQ
    514-87-560M33-001148

    Datasheet

    514 Bulk Active BGA 560 (33 x 33) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    210-33-320-41-001000

    210-33-320-41-001000

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    3,291
    RFQ

    -

    - Tube Active - - - - - - - - - - - - - - -
    518-77-356M26-001106

    518-77-356M26-001106

    CONN SOCKET PGA 356POS GOLD

    Preci-Dip

    4,144
    RFQ
    518-77-356M26-001106

    Datasheet

    518 Bulk Active PGA 356 (26 x 26) Gold Flash Beryllium Copper Surface Mount Open Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 125°C Gold FR4 Epoxy Glass Flash Brass
    281-PGM18037-11

    281-PGM18037-11

    CONN SOCKET PGA GOLD

    Aries Electronics

    2,845
    RFQ
    281-PGM18037-11

    Datasheet

    PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    210-33-632-41-101000

    210-33-632-41-101000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,792
    RFQ
    210-33-632-41-101000

    Datasheet

    210 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 30.0µin (0.76µm) Brass Alloy
    110-33-318-41-001000

    110-33-318-41-001000

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    3,428
    RFQ

    -

    - Tube Active - - - - - - - - - - - - - - -
    210-33-318-41-001000

    210-33-318-41-001000

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    3,761
    RFQ

    -

    - Tube Active - - - - - - - - - - - - - - -
    518-77-357M19-001106

    518-77-357M19-001106

    CONN SOCKET PGA 357POS GOLD

    Preci-Dip

    3,523
    RFQ
    518-77-357M19-001106

    Datasheet

    518 Bulk Active PGA 357 (19 x 19) Gold Flash Beryllium Copper Surface Mount Open Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 125°C Gold FR4 Epoxy Glass Flash Brass
    558-10-388M26-001101

    558-10-388M26-001101

    PGA SOLDER TAIL 1.27MM

    Preci-Dip

    4,332
    RFQ
    558-10-388M26-001101

    Datasheet

    558 Bulk Active PGA 388 (26 x 26) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 125°C Gold FR4 Epoxy Glass 10.0µin (0.25µm) Brass
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