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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    44-6556-40

    44-6556-40

    CONN IC DIP SOCKET 44POS GOLD

    Aries Electronics

    		 3,089
    RFQ
    		44-6556-40

    Datasheet

         		6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 44 (2 x 22) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder Cup 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Brass
    40-6556-41

    40-6556-41

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    		 2,035
    RFQ
    		40-6556-41

    Datasheet

         		6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder Cup 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled 10.0µin (0.25µm) Brass
    110-33-628-41-001000

    110-33-628-41-001000

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    		 4,910
    RFQ

    -

    		 110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Thermoplastic 30.0µin (0.76µm) Brass
    210-33-628-41-001000

    210-33-628-41-001000

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    		 4,444
    RFQ
    		210-33-628-41-001000

    Datasheet

         		210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Thermoplastic 30.0µin (0.76µm) Brass
    550-10-432M31-001152

    550-10-432M31-001152

    BGA SOLDER TAIL

    Preci-Dip

    		 2,488
    RFQ
    		550-10-432M31-001152

    Datasheet

         		550 Bulk Active BGA 432 (31 x 31) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 125°C Gold FR4 Epoxy Glass 10.0µin (0.25µm) Brass
    32-3575-16

    32-3575-16

    CONN IC DIP SOCKET ZIF 32POS

    Aries Electronics

    		 3,113
    RFQ
    		32-3575-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Nickel Boron Polyphenylene Sulfide (PPS), Glass Filled 50.0µin (1.27µm) Beryllium Nickel
    179-PGM15011-10H

    179-PGM15011-10H

    CONN SOCKET PGA GOLD

    Aries Electronics

    		 3,097
    RFQ
    		179-PGM15011-10H

    Datasheet

         		PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    558-10-388M26-001104

    558-10-388M26-001104

    BGA SURFACE MOUNT 1.27MM

    Preci-Dip

    		 4,148
    RFQ
    		558-10-388M26-001104

    Datasheet

         		558 Bulk Active BGA 388 (26 x 26) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 125°C Gold FR4 Epoxy Glass 10.0µin (0.25µm) Brass
    514-87-600M35-001148

    514-87-600M35-001148

    CONN SOCKET BGA 600POS GOLD

    Preci-Dip

    		 3,448
    RFQ
    		514-87-600M35-001148

    Datasheet

         		514 Bulk Active BGA 600 (35 x 35) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    518-77-388M26-001105

    518-77-388M26-001105

    CONN SOCKET PGA 388POS GOLD

    Preci-Dip

    		 2,796
    RFQ
    		518-77-388M26-001105

    Datasheet

         		518 Bulk Active PGA 388 (26 x 26) Gold Flash Beryllium Copper Through Hole Open Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 125°C Gold FR4 Epoxy Glass Flash Brass
    32-6575-16

    32-6575-16

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    		 4,636
    RFQ
    		32-6575-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
    HLS-1012-G-10

    HLS-1012-G-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 3,792
    RFQ
    		HLS-1012-G-10

    Datasheet

         		HLS Bulk Active SIP 120 (10 x 12) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
    210-33-632-41-001000

    210-33-632-41-001000

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    		 3,049
    RFQ
    		210-33-632-41-001000

    Datasheet

         		210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Thermoplastic 30.0µin (0.76µm) Brass
    48-6556-40

    48-6556-40

    CONN IC DIP SOCKET 48POS GOLD

    Aries Electronics

    		 4,874
    RFQ
    		48-6556-40

    Datasheet

         		6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder Cup 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Brass
    546-83-503-22-131147

    546-83-503-22-131147

    CONN SOCKET PGA 503POS GOLD

    Preci-Dip

    		 4,221
    RFQ
    		546-83-503-22-131147

    Datasheet

         		546 Bulk Active PGA 503 (22 x 22) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.050" (1.27mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Bronze
    40-6570-16

    40-6570-16

    CONN IC DIP SOCKET ZIF 40POS

    Aries Electronics

    		 4,482
    RFQ
    		40-6570-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Nickel Boron Polyphenylene Sulfide (PPS), Glass Filled 50.0µin (1.27µm) Beryllium Nickel
    40-6571-16

    40-6571-16

    CONN IC DIP SOCKET ZIF 40POS

    Aries Electronics

    		 4,747
    RFQ
    		40-6571-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Nickel Boron Polyphenylene Sulfide (PPS), Glass Filled 50.0µin (1.27µm) Beryllium Nickel
    40-6572-16

    40-6572-16

    CONN IC DIP SOCKET ZIF 40POS TIN

    Aries Electronics

    		 2,287
    RFQ
    		40-6572-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
    40-6573-16

    40-6573-16

    CONN IC DIP SOCKET ZIF 40POS TIN

    Aries Electronics

    		 4,198
    RFQ
    		40-6573-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
    40-6575-16

    40-6575-16

    CONN IC DIP SOCKET ZIF 40POS TIN

    Aries Electronics

    		 3,126
    RFQ
    		40-6575-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
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