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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    32-6551-16

    32-6551-16

    CONN IC DIP SOCKET ZIF 32POS

    Aries Electronics

    		 3,090
    RFQ
    		32-6551-16

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    223-83-964-41-101000

    223-83-964-41-101000

    SKT IC CLOSED

    Mill-Max Manufacturing Corp.

    		 3,455
    RFQ
    		223-83-964-41-101000

    Datasheet

         		223 Bulk Obsolete DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) - - Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    518-77-360M19-001106

    518-77-360M19-001106

    CONN SOCKET PGA 360POS GOLD

    Preci-Dip

    		 3,005
    RFQ
    		518-77-360M19-001106

    Datasheet

         		518 Bulk Active PGA 360 (19 x 19) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    36-6572-16

    36-6572-16

    CONN IC DIP SOCKET ZIF 36POS TIN

    Aries Electronics

    		 2,662
    RFQ
    		36-6572-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    290-1294-00-3302J

    290-1294-00-3302J

    CONN IC DIP SOCKET ZIF 90POS GLD

    3M

    		 2,292
    RFQ
    		290-1294-00-3302J

    Datasheet

         		Textool™ Bulk Active DIP, ZIF (ZIP) 90 (2 x 45) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
    110-33-640-41-530000

    110-33-640-41-530000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,478
    RFQ
    		110-33-640-41-530000

    Datasheet

         		110 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-33-640-41-101000

    210-33-640-41-101000

    SOCKET IC CLOSED FRM .600 28POS

    Mill-Max Manufacturing Corp.

    		 4,512
    RFQ

    -

    		 210 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    550-10-600M35-001166

    550-10-600M35-001166

    BGA PIN ADAPTER 1.27MM SMD

    Preci-Dip

    		 4,124
    RFQ
    		550-10-600M35-001166

    Datasheet

         		550 Bulk Active BGA 600 (35 x 35) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    514-87-576M30-001148

    514-87-576M30-001148

    CONN SOCKET BGA 576POS GOLD

    Preci-Dip

    		 2,085
    RFQ
    		514-87-576M30-001148

    Datasheet

         		514 Bulk Active BGA 576 (30 x 30) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    48-6556-41

    48-6556-41

    CONN IC DIP SOCKET 48POS GOLD

    Aries Electronics

    		 2,053
    RFQ
    		48-6556-41

    Datasheet

         		6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    550-10-420M26-001152

    550-10-420M26-001152

    BGA SOLDER TAIL

    Preci-Dip

    		 2,012
    RFQ
    		550-10-420M26-001152

    Datasheet

         		550 Bulk Active BGA 420 (26 x 26) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    40-6554-16

    40-6554-16

    CONN IC DIP SOCKET ZIF 40POS

    Aries Electronics

    		 4,902
    RFQ
    		40-6554-16

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-3553-16

    40-3553-16

    CONN IC DIP SOCKET ZIF 40POS

    Aries Electronics

    		 4,471
    RFQ
    		40-3553-16

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    64-9508-21

    64-9508-21

    CONN IC DIP SOCKET 64POS GOLD

    Aries Electronics

    		 2,649
    RFQ
    		64-9508-21

    Datasheet

         		508 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    64-9508-31

    64-9508-31

    CONN IC DIP SOCKET 64POS GOLD

    Aries Electronics

    		 3,834
    RFQ
    		64-9508-31

    Datasheet

         		508 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    169-PGM13001-51

    169-PGM13001-51

    CONN SOCKET PGA GOLD

    Aries Electronics

    		 3,221
    RFQ
    		169-PGM13001-51

    Datasheet

         		PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    558-10-400M20-000101

    558-10-400M20-000101

    PGA SOLDER TAIL 1.27MM

    Preci-Dip

    		 2,604
    RFQ
    		558-10-400M20-000101

    Datasheet

         		558 Bulk Active PGA 400 (20 x 20) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    36-3570-16

    36-3570-16

    CONN IC DIP SOCKET ZIF 36POS

    Aries Electronics

    		 4,358
    RFQ
    		36-3570-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    210-33-314-41-001000

    210-33-314-41-001000

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    		 2,975
    RFQ
    		210-33-314-41-001000

    Datasheet

         		210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Thermoplastic -55°C ~ 125°C
    514-83-456M26-001148

    514-83-456M26-001148

    CONN SOCKET BGA 456POS GOLD

    Preci-Dip

    		 2,803
    RFQ
    		514-83-456M26-001148

    Datasheet

         		514 Bulk Active BGA 456 (26 x 26) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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