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+8618924632110（Bella)
+8618924632110（Bella)
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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
7010321946TEXTOOLTEST & BURN-IN BALL GRID |
4,039 |
|
- |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
558-10-420M26-001101PGA SOLDER TAIL 1.27MM |
2,816 |
|
Datasheet |
558 | Bulk | Active | PGA | 420 (26 x 26) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | -55°C ~ 125°C | Gold | FR4 Epoxy Glass | 10.0µin (0.25µm) | Brass |
|
|
42-6556-41CONN IC DIP SOCKET 42POS GOLD |
2,965 |
|
Datasheet |
6556 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder Cup | 0.100" (2.54mm) | - | Gold | Polyphenylene Sulfide (PPS), Glass Filled | 10.0µin (0.25µm) | Brass |
|
|
518-77-388M26-001106CONN SOCKET PGA 388POS GOLD |
4,378 |
|
Datasheet |
518 | Bulk | Active | PGA | 388 (26 x 26) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | -55°C ~ 125°C | Gold | FR4 Epoxy Glass | Flash | Brass |
|
|
514-83-478M26-131148CONN SOCKET BGA 478POS GOLD |
4,990 |
|
Datasheet |
514 | Bulk | Active | BGA | 478 (26 x 26) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
558-10-400M20-000104BGA SURFACE MOUNT 1.27MM |
3,818 |
|
Datasheet |
558 | Bulk | Active | BGA | 400 (20 x 20) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | -55°C ~ 125°C | Gold | FR4 Epoxy Glass | 10.0µin (0.25µm) | Brass |
|
|
223-33-320-41-001000STANDARD WIRE WRAP DIP SOCKET |
2,119 |
|
- |
- | Tube | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
514-83-480M29-001148CONN SOCKET BGA 480POS GOLD |
3,143 |
|
Datasheet |
514 | Bulk | Active | BGA | 480 (29 x 29) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
518-77-400M20-000105CONN SOCKET PGA 400POS GOLD |
4,358 |
|
Datasheet |
518 | Bulk | Active | PGA | 400 (20 x 20) | Gold | Flash | Beryllium Copper | Through Hole | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | -55°C ~ 125°C | Gold | FR4 Epoxy Glass | Flash | Brass |
|
|
110-33-640-41-001000STANDRD SOLDER TAIL DIP SOCKET |
4,359 |
|
- |
110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Thermoplastic | 30.0µin (0.76µm) | Brass |
|
|
210-33-640-41-001000STANDRD SOLDER TAIL DIP SOCKET |
3,720 |
|
Datasheet |
210 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Thermoplastic | 30.0µin (0.76µm) | Brass |
|
|
65-PRS10008-12CONN SOCKET PGA ZIF GOLD |
3,524 |
|
Datasheet |
PRS | Bulk | Active | PGA, ZIF (ZIP) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Tin | Polyphenylene Sulfide (PPS) | 200.0µin (5.08µm) | Beryllium Copper |
|
|
550-10-652M35-001166BGA PIN ADAPTER 1.27MM SMD |
4,460 |
|
Datasheet |
550 | Bulk | Active | BGA | 652 (35 x 35) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | FR4 Epoxy Glass | 10.0µin (0.25µm) | Brass |
|
|
66-PLS11054-12CONN SOCKET PGA ZIF GOLD |
3,726 |
|
Datasheet |
PLS | Bulk | Active | PGA, ZIF (ZIP) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Tin | Polyphenylene Sulfide (PPS) | 200.0µin (5.08µm) | Beryllium Copper |
|
|
550-10-456M26-001152BGA SOLDER TAIL |
3,251 |
|
Datasheet |
550 | Bulk | Active | BGA | 456 (26 x 26) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | -55°C ~ 125°C | Gold | FR4 Epoxy Glass | 10.0µin (0.25µm) | Brass |
|
|
546-83-528-21-121147CONN SOCKET PGA 528POS GOLD |
3,076 |
|
Datasheet |
546 | Bulk | Active | PGA | 528 (21 x 21) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | 0.050" (1.27mm) | Press-Fit | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Bronze |
|
|
558-10-432M31-001101PGA SOLDER TAIL 1.27MM |
3,630 |
|
Datasheet |
558 | Bulk | Active | PGA | 432 (31 x 31) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | -55°C ~ 125°C | Gold | FR4 Epoxy Glass | 10.0µin (0.25µm) | Brass |
|
|
68-PLS11033-12CONN SOCKET PGA ZIF GOLD |
3,920 |
|
Datasheet |
PLS | Bulk | Active | PGA, ZIF (ZIP) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Tin | Polyphenylene Sulfide (PPS) | 200.0µin (5.08µm) | Beryllium Copper |
|
|
546-83-529-21-121147CONN SOCKET PGA 529POS GOLD |
3,710 |
|
Datasheet |
546 | Bulk | Active | PGA | 529 (21 x 21) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | 0.050" (1.27mm) | Press-Fit | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Bronze |
|
|
42-3554-16CONN IC DIP SOCKET ZIF 42POS |
4,791 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 42 (2 x 21) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Nickel Boron | Polyphenylene Sulfide (PPS), Glass Filled | 50.0µin (1.27µm) | Beryllium Copper |
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