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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    558-10-456M26-001101

    558-10-456M26-001101

    PGA SOLDER TAIL 1.27MM

    Preci-Dip

    		 3,191
    RFQ
    		558-10-456M26-001101

    Datasheet

         		558 Bulk Active PGA 456 (26 x 26) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    518-77-420M26-001106

    518-77-420M26-001106

    CONN SOCKET PGA 420POS GOLD

    Preci-Dip

    		 2,240
    RFQ
    		518-77-420M26-001106

    Datasheet

         		518 Bulk Active PGA 420 (26 x 26) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    249-930X-XX-2401

    249-930X-XX-2401

    CONN SOCKET BGA 49POS GOLD

    3M

    		 2,627
    RFQ

    -

    		 Textool™ - Obsolete BGA 49 (Verification Required) 0.039" (1.00mm) Gold - - Through Hole Closed Frame - - - - - - -
    558-10-432M31-001104

    558-10-432M31-001104

    BGA SURFACE MOUNT 1.27MM

    Preci-Dip

    		 4,416
    RFQ
    		558-10-432M31-001104

    Datasheet

         		558 Bulk Active BGA 432 (31 x 31) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    40-3551-16

    40-3551-16

    CONN IC DIP SOCKET ZIF 40POS

    Aries Electronics

    		 3,198
    RFQ
    		40-3551-16

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-3552-16

    40-3552-16

    CONN IC DIP SOCKET ZIF 40POS

    Aries Electronics

    		 3,742
    RFQ
    		40-3552-16

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-6551-16

    40-6551-16

    CONN IC DIP SOCKET ZIF 40POS

    Aries Electronics

    		 4,114
    RFQ
    		40-6551-16

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-6552-16

    40-6552-16

    CONN IC DIP SOCKET ZIF 40POS

    Aries Electronics

    		 4,343
    RFQ
    		40-6552-16

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-6553-16

    40-6553-16

    CONN IC DIP SOCKET ZIF 40POS

    Aries Electronics

    		 4,375
    RFQ
    		40-6553-16

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
    40-3554-16

    40-3554-16

    CONN IC DIP SOCKET ZIF 40POS

    Aries Electronics

    		 3,846
    RFQ
    		40-3554-16

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    546-83-559-22-131147

    546-83-559-22-131147

    CONN SOCKET PGA 559POS GOLD

    Preci-Dip

    		 4,103
    RFQ
    		546-83-559-22-131147

    Datasheet

         		546 Bulk Active PGA 559 (22 x 22) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    42-3570-16

    42-3570-16

    CONN IC DIP SOCKET ZIF 42POS

    Aries Electronics

    		 3,977
    RFQ
    		42-3570-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    42-3571-16

    42-3571-16

    CONN IC DIP SOCKET ZIF 42POS

    Aries Electronics

    		 2,576
    RFQ
    		42-3571-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    42-3573-16

    42-3573-16

    CONN IC DIP SOCKET ZIF 42POS

    Aries Electronics

    		 4,951
    RFQ
    		42-3573-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    42-3574-16

    42-3574-16

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    		 3,024
    RFQ
    		42-3574-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    42-3575-16

    42-3575-16

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    		 4,271
    RFQ
    		42-3575-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    42-6570-16

    42-6570-16

    CONN IC DIP SOCKET ZIF 42POS

    Aries Electronics

    		 4,281
    RFQ
    		42-6570-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    42-6572-16

    42-6572-16

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    		 3,592
    RFQ
    		42-6572-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    42-6573-16

    42-6573-16

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    		 3,115
    RFQ
    		42-6573-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    42-6575-16

    42-6575-16

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    		 2,803
    RFQ
    		42-6575-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
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