Hello! now KATY Electronic Technology Co., LTD+8618924632110（Bella)
KATY Electronic Technology Co., LTDMy Inquiry KATY Electronic Technology Co., LTDMy Account
    Login or REGISTER
    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD
    All Categories
    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    550-10-356M26-001152

    550-10-356M26-001152

    BGA SOLDER TAIL

    Preci-Dip

    		 3,544
    RFQ
    		550-10-356M26-001152

    Datasheet

         		550 Bulk Active BGA 356 (26 x 26) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    546-87-528-21-121147

    546-87-528-21-121147

    CONN SOCKET PGA 528POS GOLD

    Preci-Dip

    		 3,992
    RFQ
    		546-87-528-21-121147

    Datasheet

         		546 Bulk Active PGA 528 (21 x 21) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    550-10-357M19-001152

    550-10-357M19-001152

    BGA SOLDER TAIL

    Preci-Dip

    		 4,325
    RFQ
    		550-10-357M19-001152

    Datasheet

         		550 Bulk Active BGA 357 (19 x 19) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    546-87-545-17-000147

    546-87-545-17-000147

    CONN SOCKET PGA 545POS GOLD

    Preci-Dip

    		 4,650
    RFQ
    		546-87-545-17-000147

    Datasheet

         		546 Bulk Active PGA 545 (17 x 17) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    32-3551-16

    32-3551-16

    CONN IC DIP SOCKET ZIF 32POS

    Aries Electronics

    		 2,271
    RFQ
    		32-3551-16

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    32-3552-16

    32-3552-16

    CONN IC DIP SOCKET ZIF 32POS

    Aries Electronics

    		 4,410
    RFQ
    		32-3552-16

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    32-3553-16

    32-3553-16

    CONN IC DIP SOCKET ZIF 32POS

    Aries Electronics

    		 4,234
    RFQ
    		32-3553-16

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    32-6552-16

    32-6552-16

    CONN IC DIP SOCKET ZIF 32POS

    Aries Electronics

    		 2,939
    RFQ
    		32-6552-16

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    32-6553-16

    32-6553-16

    CONN IC DIP SOCKET ZIF 32POS

    Aries Electronics

    		 2,995
    RFQ
    		32-6553-16

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
    32-3554-16

    32-3554-16

    CONN IC DIP SOCKET ZIF 32POS

    Aries Electronics

    		 4,160
    RFQ
    		32-3554-16

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    550-10-360M19-001152

    550-10-360M19-001152

    BGA SOLDER TAIL

    Preci-Dip

    		 3,811
    RFQ
    		550-10-360M19-001152

    Datasheet

         		550 Bulk Active BGA 360 (19 x 19) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    110-88-320-41-530000

    110-88-320-41-530000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,579
    RFQ
    		110-88-320-41-530000

    Datasheet

         		110 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-83-306-41-101000

    210-83-306-41-101000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,457
    RFQ
    		210-83-306-41-101000

    Datasheet

         		210 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 300.0µin (7.62µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-88-316-41-530000

    110-88-316-41-530000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,550
    RFQ
    		110-88-316-41-530000

    Datasheet

         		110 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    42-6556-40

    42-6556-40

    CONN IC DIP SOCKET 42POS GOLD

    Aries Electronics

    		 4,376
    RFQ
    		42-6556-40

    Datasheet

         		6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    550-10-520M31-001166

    550-10-520M31-001166

    BGA PIN ADAPTER 1.27MM SMD

    Preci-Dip

    		 3,232
    RFQ
    		550-10-520M31-001166

    Datasheet

         		550 Bulk Active BGA 520 (31 x 31) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    210-88-306-41-001000

    210-88-306-41-001000

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    		 4,033
    RFQ

    -

    		 - Tube Active - - - - - - - - - - - - - - -
    514-87-500M30-001148

    514-87-500M30-001148

    CONN SOCKET BGA 500POS GOLD

    Preci-Dip

    		 2,467
    RFQ
    		514-87-500M30-001148

    Datasheet

         		514 Bulk Active BGA 500 (30 x 30) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    144-PGM12001-41

    144-PGM12001-41

    CONN SOCKET PGA GOLD

    Aries Electronics

    		 4,240
    RFQ
    		144-PGM12001-41

    Datasheet

         		PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    514-83-388M26-001148

    514-83-388M26-001148

    CONN SOCKET BGA 388POS GOLD

    Preci-Dip

    		 2,798
    RFQ
    		514-83-388M26-001148

    Datasheet

         		514 Bulk Active BGA 388 (26 x 26) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    Total 19086 Record«Prev1... 880881882883884885886887...955Next»
    Fast Shipping
    Fast Shipping Fast and convenient door to door delivery.
    Paypment Security
    Paypment Security More than 5 different secure payment methods.
    Strictly Quality Control
    Strictly Quality Control 365 days After-Sales Service and Warranty
    Simple And Professional
    Simple And Professional One-stop Electronics Procurement Solutions.
    KATY Electronic Technology Co., LTD

    HOME

     KATY Electronic Technology Co., LTD

    PRODUCT

     KATY Electronic Technology Co., LTD

    PHONE

     KATY Electronic Technology Co., LTD

    USER
    KATY Electronic Technology Co., LTD
    [email protected]