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+8618924632110（Bella)
+8618924632110（Bella)
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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
550-10-356M26-001152BGA SOLDER TAIL |
3,544 |
|
Datasheet |
550 | Bulk | Active | BGA | 356 (26 x 26) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | -55°C ~ 125°C | Gold | FR4 Epoxy Glass | 10.0µin (0.25µm) | Brass |
|
|
546-87-528-21-121147CONN SOCKET PGA 528POS GOLD |
3,992 |
|
Datasheet |
546 | Bulk | Active | PGA | 528 (21 x 21) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.050" (1.27mm) | Press-Fit | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Bronze |
|
|
550-10-357M19-001152BGA SOLDER TAIL |
4,325 |
|
Datasheet |
550 | Bulk | Active | BGA | 357 (19 x 19) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | -55°C ~ 125°C | Gold | FR4 Epoxy Glass | 10.0µin (0.25µm) | Brass |
|
|
546-87-545-17-000147CONN SOCKET PGA 545POS GOLD |
4,650 |
|
Datasheet |
546 | Bulk | Active | PGA | 545 (17 x 17) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.050" (1.27mm) | Press-Fit | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Bronze |
|
|
32-3551-16CONN IC DIP SOCKET ZIF 32POS |
2,271 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 32 (2 x 16) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Nickel Boron | Polyphenylene Sulfide (PPS), Glass Filled | 50.0µin (1.27µm) | Beryllium Copper |
|
|
32-3552-16CONN IC DIP SOCKET ZIF 32POS |
4,410 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 32 (2 x 16) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Nickel Boron | Polyphenylene Sulfide (PPS), Glass Filled | 50.0µin (1.27µm) | Beryllium Copper |
|
|
32-3553-16CONN IC DIP SOCKET ZIF 32POS |
4,234 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 32 (2 x 16) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Nickel Boron | Polyphenylene Sulfide (PPS), Glass Filled | 50.0µin (1.27µm) | Beryllium Copper |
|
|
32-6552-16CONN IC DIP SOCKET ZIF 32POS |
2,939 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Nickel Boron | Polyphenylene Sulfide (PPS), Glass Filled | 50.0µin (1.27µm) | Beryllium Copper |
|
|
32-6553-16CONN IC DIP SOCKET ZIF 32POS |
2,995 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 250°C | Nickel Boron | Polyetheretherketone (PEEK), Glass Filled | 50.0µin (1.27µm) | Beryllium Nickel |
|
|
32-3554-16CONN IC DIP SOCKET ZIF 32POS |
4,160 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 32 (2 x 16) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Nickel Boron | Polyphenylene Sulfide (PPS), Glass Filled | 50.0µin (1.27µm) | Beryllium Copper |
|
|
550-10-360M19-001152BGA SOLDER TAIL |
3,811 |
|
Datasheet |
550 | Bulk | Active | BGA | 360 (19 x 19) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | -55°C ~ 125°C | Gold | FR4 Epoxy Glass | 10.0µin (0.25µm) | Brass |
|
|
110-88-320-41-530000CONN IC SKT DBL |
4,579 |
|
Datasheet |
110 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | - | - | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | - | Brass Alloy |
|
|
210-83-306-41-101000CONN IC SKT DBL |
3,457 |
|
Datasheet |
210 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 300.0µin (7.62µm) | Brass Alloy |
|
|
110-88-316-41-530000CONN IC SKT DBL |
4,550 |
|
Datasheet |
110 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | - | - | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | - | Brass Alloy |
|
|
42-6556-40CONN IC DIP SOCKET 42POS GOLD |
4,376 |
|
Datasheet |
6556 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder Cup | 0.100" (2.54mm) | - | Tin | Polyphenylene Sulfide (PPS), Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
550-10-520M31-001166BGA PIN ADAPTER 1.27MM SMD |
3,232 |
|
Datasheet |
550 | Bulk | Active | BGA | 520 (31 x 31) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | -55°C ~ 125°C | Gold | FR4 Epoxy Glass | 10.0µin (0.25µm) | Brass |
|
|
210-88-306-41-001000STANDRD SOLDER TAIL DIP SOCKET |
4,033 |
|
- |
- | Tube | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
514-87-500M30-001148CONN SOCKET BGA 500POS GOLD |
2,467 |
|
Datasheet |
514 | Bulk | Active | BGA | 500 (30 x 30) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
144-PGM12001-41CONN SOCKET PGA GOLD |
4,240 |
|
Datasheet |
PGM | Bulk | Active | PGA | - | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Brass |
|
|
514-83-388M26-001148CONN SOCKET BGA 388POS GOLD |
2,798 |
|
Datasheet |
514 | Bulk | Active | BGA | 388 (26 x 26) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
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