| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
382444-2CONN SOCKET SIP 8POS TIN-LEAD |
4,157 |
|
Datasheet |
- | Tube | Obsolete | SIP | 8 (1 x 8) | Tin-Lead | 150.0µin (3.81µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin-Lead | Fluoropolymer (FP) | 150.0µin (3.81µm) | Beryllium Copper |
|
382444-3CONN SOCKET SIP 10POS TIN-LEAD |
4,793 |
|
Datasheet |
- | Tube | Active | SIP | 10 (1 x 10) | Tin-Lead | 150.0µin (3.81µm) | Phosphor Bronze | Through Hole | Closed Frame | 0.100" (2.54mm) | Press-Fit | 0.100" (2.54mm) | -55°C ~ 105°C | Tin-Lead | Liquid Crystal Polymer (LCP) | 150.0µin (3.81µm) | Phosphor Bronze |
|
643641-6CONN SOCKET SIP 9POS TIN |
3,494 |
|
Datasheet |
Diplomate DL | Tray | Obsolete | SIP | 9 (1 x 9) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Thermoplastic, Glass Filled | - | Beryllium Copper |
|
643644-3CONN SOCKET SIP 12POS TIN |
4,093 |
|
Datasheet |
Diplomate DL | Tray | Obsolete | SIP | 12 (1 x 12) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Thermoplastic, Glass Filled | - | Phosphor Bronze |
|
643646-1CONN SOCKET SIP 14POS TIN |
4,983 |
|
Datasheet |
Diplomate DL | Tray | Obsolete | SIP | 14 (1 x 14) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Thermoplastic, Glass Filled | - | Beryllium Copper |
|
643646-3CONN SOCKET SIP 14POS TIN |
4,635 |
|
Datasheet |
Diplomate DL | Tray | Obsolete | SIP | 14 (1 x 14) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Thermoplastic, Glass Filled | - | Phosphor Bronze |
|
643646-6CONN SOCKET SIP 14POS TIN |
3,226 |
|
Datasheet |
Diplomate DL | Tray | Active | SIP | 14 (1 x 14) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Thermoplastic, Glass Filled | - | Beryllium Copper |
|
643650-1CONN SOCKET SIP 18POS TIN |
3,227 |
|
Datasheet |
Diplomate DL | Tray | Obsolete | SIP | 18 (1 x 18) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Thermoplastic, Glass Filled | - | Beryllium Copper |
|
643652-1CONN SOCKET SIP 20POS TIN |
4,456 |
|
Datasheet |
Diplomate DL | Tray | Obsolete | SIP | 20 (1 x 20) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Thermoplastic, Glass Filled | - | Beryllium Copper |
|
643652-6CONN SOCKET SIP 20POS TIN |
4,599 |
|
Datasheet |
Diplomate DL | Tray | Obsolete | SIP | 20 (1 x 20) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Thermoplastic, Glass Filled | - | Beryllium Copper |
|
643657-1CONN SOCKET SIP 25POS TIN |
4,624 |
|
Datasheet |
Diplomate DL | Tray | Obsolete | SIP | 25 (1 x 25) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Thermoplastic, Glass Filled | - | Beryllium Copper |
|
643640-1CONN SOCKET SIP 8POS TIN |
4,325 |
|
Datasheet |
Diplomate DL | Tray | Obsolete | SIP | 8 (1 x 8) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Thermoplastic, Glass Filled | - | Beryllium Copper |
|
643642-1CONN SOCKET SIP 10POS TIN |
2,750 |
|
Datasheet |
Diplomate DL | Tray | Obsolete | SIP | 10 (1 x 10) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Thermoplastic, Glass Filled | - | Beryllium Copper |
|
821949-4CONN SOCKET PQFP 100POS TIN-LEAD |
4,780 |
|
Datasheet |
- | Tube | Obsolete | QFP | 100 (4 x 25) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | - | Tin-Lead | Liquid Crystal Polymer (LCP) | 200.0µin (5.08µm) | Phosphor Bronze |
|
822114-4CONN SOCKET PQFP 160POS TIN-LEAD |
4,648 |
|
Datasheet |
- | Tube | Obsolete | QFP | 160 (4 x 40) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | - | Tin-Lead | Liquid Crystal Polymer (LCP) | 200.0µin (5.08µm) | Phosphor Bronze |
|
2-644018-2CONN IC DIP SOCKET 32POS GOLD |
3,898 |
|
Datasheet |
Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Thermoplastic | 30.0µin (0.76µm) | Beryllium Copper |
|
2-641932-4CONN IC DIP SOCKET 24POS GOLD |
3,545 |
|
Datasheet |
Diplomate DL | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Thermoplastic | 15.0µin (0.38µm) | Phosphor Bronze |
|
2-641933-1CONN IC DIP SOCKET 24POS TIN |
4,034 |
|
Datasheet |
Diplomate DL | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Tin | - | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Thermoplastic | - | Beryllium Copper |
|
2-644018-4CONN IC DIP SOCKET 32POS GOLD |
4,536 |
|
Datasheet |
Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Thermoplastic | 15.0µin (0.38µm) | Phosphor Bronze |
|
2-641615-3CONN IC DIP SOCKET 28POS TIN |
2,573 |
|
Datasheet |
Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Thermoplastic, Glass Filled | - | Phosphor Bronze |