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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
4607CONN TRANSIST TO-3 3POS TIN |
2,376 |
|
Datasheet |
- | Bulk | Active | Transistor, TO-3 | 3 (Rectangular) | Tin | - | Brass | Chassis Mount | Closed Frame | - | Solder | - | - | Tin | Polyester, Glass Filled | - | Brass |
|
4609CONN TRANSIST TO-3 3POS TIN |
2,483 |
|
Datasheet |
- | Bulk | Active | Transistor, TO-3 | 3 (Rectangular) | Tin | - | Brass | Chassis Mount | Closed Frame | - | Solder | - | - | Tin | Polyester, Glass Filled | - | Brass |
|
|
822114-3CONN SOCKET PQFP 144POS TIN-LEAD |
3,284 |
|
Datasheet |
- | Tube | Obsolete | QFP | 144 (4 x 36) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | - | Tin-Lead | Liquid Crystal Polymer (LCP) | 200.0µin (5.08µm) | Phosphor Bronze |
|
|
382437-1CONN SOCKET SIP 3POS TIN |
3,971 |
|
Datasheet |
Diplomate DL | Tray | Obsolete | SIP | 3 (1 x 3) | Tin | - | Phosphor Bronze | Through Hole | - | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Thermoplastic, Glass Filled | - | Phosphor Bronze |
|
|
643644-1CONN SOCKET SIP 12POS TIN |
2,001 |
|
Datasheet |
Diplomate DL | Tray | Obsolete | SIP | 12 (1 x 12) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Thermoplastic, Glass Filled | - | Beryllium Copper |
|
|
643654-1CONN SOCKET SIP 22POS TIN |
2,094 |
|
Datasheet |
Diplomate DL | Tray | Active | SIP | 22 (1 x 22) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Thermoplastic, Glass Filled | - | Beryllium Copper |
|
|
232-1297-00-3303CONN IC DIP SOCKET ZIF 32POS GLD |
2,468 |
|
Datasheet |
OEM | Tube | Obsolete | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | 250.0µin (6.35µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Gold | Polyether Imide (PEI), Glass Filled | 250.0µin (6.35µm) | Beryllium Copper |
|
|
4618CONN TRANSIST TO-3 3POS TIN |
4,060 |
|
Datasheet |
- | Bulk | Active | Transistor, TO-3 | 3 (Rectangular) | Tin | - | Brass | Chassis Mount | Closed Frame | - | Solder | - | - | Tin | Polyester, Glass Filled | - | Brass |
|
|
101-93-314-41-560000CONN IC DIP SOCKET 14POS GOLD |
4,894 |
|
Datasheet |
101 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
101-93-640-41-560000CONN IC DIP SOCKET 40POS GOLD |
4,288 |
|
Datasheet |
101 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
518-93-391-18-096002CONN SOCKET PGA 391POS GOLD |
4,760 |
|
Datasheet |
518 | Tube | Active | PGA | 391 (18 x 18) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
518-93-447-20-116002SOCKET INTERSTITIAL 447-PGA |
2,933 |
|
Datasheet |
518 | Bulk | Active | PGA | 447 (20 x 20) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
1825093-2CONN IC DIP SOCKET 8POS GOLD |
4,388 |
|
Datasheet |
Diplomate DL | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Thermoplastic, Glass Filled | 15.0µin (0.38µm) | Phosphor Bronze |
|
|
A-CCS-044-Z-SM-RCONN SOCKET PLCC 44POS TIN |
2,139 |
|
Datasheet |
- | Tube | Obsolete | PLCC | 44 (4 x 11) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Surface Mount | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | -55°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT), Glass Filled | 150.0µin (3.81µm) | Phosphor Bronze |
|
|
A-CCS68-Z-SM-RCONN SOCKET PLCC 68POS TIN |
4,533 |
|
Datasheet |
- | Tube | Obsolete | PLCC | 68 (4 x 17) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Surface Mount | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | -55°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT), Glass Filled | 150.0µin (3.81µm) | Phosphor Bronze |
|
|
940-44-052-17-400000CONN SOCKET PLCC 52POS TIN |
2,246 |
|
Datasheet |
940 | Tube | Discontinued at Digi-Key | PLCC | 52 (4 x 13) | Tin | 150.0µin (3.81µm) | Beryllium Copper | Surface Mount | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
1-390261-9CONN IC DIP SOCKET 28POS TIN |
4,632 |
|
Datasheet |
- | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | - | 60.0µin (1.52µm) | Phosphor Bronze |
|
|
1-822473-4CONN SOCKET PLCC 44POS TIN |
2,419 |
|
Datasheet |
- | Box | Obsolete | PLCC | 44 (4 x 11) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | 0.050" (1.27mm) | Solder | 0.100" (2.54mm) | - | Tin | Thermoplastic | - | Phosphor Bronze |
|
|
1825093-3CONN IC DIP SOCKET 14POS GOLD |
2,204 |
|
Datasheet |
Diplomate DL | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Thermoplastic, Glass Filled | 15.0µin (0.38µm) | Phosphor Bronze |
|
|
1825093-4CONN IC DIP SOCKET 16POS GOLD |
4,764 |
|
Datasheet |
Diplomate DL | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Thermoplastic, Glass Filled | 15.0µin (0.38µm) | Phosphor Bronze |
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