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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    100-028-000

    100-028-000

    CONN IC DIP SOCKET 28POS GOLD

    3M

    3,015
    RFQ

    -

    100 Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    100-028-001

    100-028-001

    CONN IC DIP SOCKET 28POS GOLD

    3M

    4,469
    RFQ

    -

    100 Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Closed Frame, Seal Tape Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    100-032-000

    100-032-000

    CONN IC DIP SOCKET 32POS GOLD

    3M

    2,298
    RFQ

    -

    100 Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    100-032-001

    100-032-001

    CONN IC DIP SOCKET 32POS GOLD

    3M

    2,086
    RFQ

    -

    100 Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Closed Frame, Seal Tape Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    100-040-000

    100-040-000

    CONN IC DIP SOCKET 40POS GOLD

    3M

    4,539
    RFQ

    -

    100 Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    100-040-001

    100-040-001

    CONN IC DIP SOCKET 40POS GOLD

    3M

    2,431
    RFQ

    -

    100 Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Closed Frame, Seal Tape Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    100-042-000

    100-042-000

    CONN IC DIP SOCKET 42POS GOLD

    3M

    2,540
    RFQ

    -

    100 Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    100-048-000

    100-048-000

    CONN IC DIP SOCKET 48POS GOLD

    3M

    3,409
    RFQ

    -

    100 Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    2-382462-1

    2-382462-1

    CONN IC DIP SOCKET 8POS TIN

    TE Connectivity AMP Connectors

    4,424
    RFQ
    2-382462-1

    Datasheet

    Diplomate DL Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Thermoplastic -55°C ~ 105°C
    2-643574-4

    2-643574-4

    CONN IC DIP SOCKET 48POS GOLD

    TE Connectivity AMP Connectors

    3,893
    RFQ
    2-643574-4

    Datasheet

    Diplomate DL Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 125°C
    382437-3

    382437-3

    CONN SOCKET SIP 3POS TIN

    TE Connectivity AMP Connectors

    4,191
    RFQ
    382437-3

    Datasheet

    Diplomate DL Tray Obsolete SIP 3 (1 x 3) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 105°C
    7-1437539-2

    7-1437539-2

    CONN IC DIP SOCKET 24POS TIN

    TE Connectivity AMP Connectors

    4,275
    RFQ
    7-1437539-2

    Datasheet

    800 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) - - - Polyester -55°C ~ 105°C
    1825375-3

    1825375-3

    CONN IC DIP SOCKET 40POS GOLD

    TE Connectivity AMP Connectors

    3,803
    RFQ
    1825375-3

    Datasheet

    Diplomate DL Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 125°C
    1825375-2

    1825375-2

    CONN IC DIP SOCKET 28POS GOLD

    TE Connectivity AMP Connectors

    4,192
    RFQ
    1825375-2

    Datasheet

    Diplomate DL Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 125°C
    1-390261-1

    1-390261-1

    CONN IC DIP SOCKET 6POS TIN

    TE Connectivity AMP Connectors

    4,550
    RFQ
    1-390261-1

    Datasheet

    - Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze - -40°C ~ 105°C
    1-822473-2

    1-822473-2

    CONN SOCKET PLCC 28POS TIN

    TE Connectivity AMP Connectors

    2,171
    RFQ
    1-822473-2

    Datasheet

    - Box Obsolete PLCC 28 (4 x 7) 0.050" (1.27mm) Tin 80.0µin (2.03µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 80.0µin (2.03µm) Phosphor Bronze Thermoplastic -
    8058-1G57

    8058-1G57

    CONN TRANSIST TO-5 8POS GOLD

    TE Connectivity AMP Connectors

    4,210
    RFQ
    8058-1G57

    Datasheet

    8058 Bulk Obsolete Transistor, TO-5 8 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Brass Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
    2-1437530-9

    2-1437530-9

    CONN SOCKET SIP 12POS

    TE Connectivity AMP Connectors

    3,533
    RFQ
    2-1437530-9

    Datasheet

    500 Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) - - Beryllium Copper Through Hole - Solder 0.100" (2.54mm) - - Beryllium Copper Thermoplastic -
    816-AG10D-ES

    816-AG10D-ES

    CONN IC DIP SOCKET 16POS GOLD

    TE Connectivity AMP Connectors

    3,037
    RFQ
    816-AG10D-ES

    Datasheet

    800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Copper Alloy Polyester -55°C ~ 105°C
    816-AG11D-ESL-LF

    816-AG11D-ESL-LF

    CONN IC DIP SOCKET 16POS GOLD

    TE Connectivity AMP Connectors

    2,585
    RFQ
    816-AG11D-ESL-LF

    Datasheet

    800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
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