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+8618924632110（Bella)
+8618924632110（Bella)
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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
2-210735-5CONN SOCKET SIP 25POS TIN-LEAD |
4,815 |
|
- |
- | Bulk | Obsolete | SIP | 25 (1 x 25) | Tin-Lead | - | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin-Lead | Thermoplastic | - | - |
|
|
8080-1G45CONN TRANSIST TO-3 3POS TIN |
2,316 |
|
- |
8060 | Bulk | Obsolete | Transistor, TO-3 | 3 (Oval) | Tin | - | Beryllium Copper | Chassis Mount | Closed Frame | - | Solder | - | -55°C ~ 125°C | Tin | Polytetrafluoroethylene (PTFE) | - | Beryllium Copper |
|
|
820-AG10D-ESCONN IC DIP SOCKET 20POS GOLD |
4,140 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | - | Polyester | - | - |
|
|
5-1437542-2CONN IC DIP SOCKET 28POS GOLD |
2,750 |
|
Datasheet |
700 | - | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole | Carrier, Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Aluminum Alloy | 20.0µin (0.51µm) | Beryllium Copper |
|
|
643647-6CONN SOCKET SIP 15POS TIN |
2,333 |
|
Datasheet |
Diplomate DL | Tray | Active | SIP | 15 (1 x 15) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Thermoplastic, Glass Filled | - | Beryllium Copper |
|
|
9-1437530-4CONN SOCKET SIP 11POS |
4,415 |
|
Datasheet |
500 | Bulk | Obsolete | SIP | 11 (1 x 11) | - | - | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | - | Thermoplastic | - | Beryllium Copper |
|
|
824-AG32DCONN IC DIP SOCKET 24POS TINLEAD |
4,073 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Tin-Lead | 80.0µin (2.03µm) | Copper Alloy | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin-Lead | Polyester | - | Copper Alloy |
|
|
1-390261-5CONN IC DIP SOCKET 18POS TIN |
2,122 |
|
Datasheet |
- | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | - | 60.0µin (1.52µm) | Phosphor Bronze |
|
|
8080-1G17CONN TRANSIST TO-3 3POS TIN |
2,392 |
|
Datasheet |
8060 | Bulk | Obsolete | Transistor, TO-3 | 3 (Oval) | Tin | - | Beryllium Copper | Chassis Mount | Closed Frame | - | Solder | - | -55°C ~ 125°C | Tin | Polytetrafluoroethylene (PTFE) | - | Beryllium Copper |
|
|
8080-1G25CONN TRANSIST TO-3 3POS GOLD |
3,593 |
|
Datasheet |
8060 | Bulk | Obsolete | Transistor, TO-3 | 3 (Oval) | Gold | - | Beryllium Copper | Chassis Mount | Closed Frame | - | Solder | - | -55°C ~ 125°C | Gold | Polytetrafluoroethylene (PTFE) | - | Beryllium Copper |
|
|
8059-2G8CONN TRANSIST TO-5 8POS GOLD |
2,787 |
|
- |
8058 | Bulk | Obsolete | Transistor, TO-5 | 8 (Round) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | - | Solder | - | -55°C ~ 125°C | Gold | Polytetrafluoroethylene (PTFE) | - | Brass |
|
|
1825094-4CONN IC DIP SOCKET 16POS GOLD |
4,160 |
|
Datasheet |
Diplomate DL | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Thermoplastic, Glass Filled | 15.0µin (0.38µm) | Phosphor Bronze |
|
|
1825109-3CONN IC DIP SOCKET 40POS GOLD |
4,435 |
|
- |
Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Thermoplastic, Glass Filled | 15.0µin (0.38µm) | Phosphor Bronze |
|
|
1825276-2CONN IC DIP SOCKET 32POS GOLD |
4,696 |
|
Datasheet |
Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Thermoplastic, Glass Filled | 15.0µin (0.38µm) | Phosphor Bronze |
|
|
2-821949-4CONN SOCKET PQFP 100POS TIN-LEAD |
2,173 |
|
Datasheet |
- | Tube | Obsolete | QFP | 100 (4 x 25) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | - | Tin-Lead | Liquid Crystal Polymer (LCP) | 200.0µin (5.08µm) | Phosphor Bronze |
|
|
SIP1X06-014BLFCONN SOCKET SIP 6POS TIN |
3,779 |
|
Datasheet |
SIP1x | Bulk | Obsolete | SIP | 6 (1 x 6) | Tin | 150.0µin (3.81µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyphenylene Sulfide (PPS), Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
SIP1X05-014BLFCONN SOCKET SIP 5POS TIN |
4,378 |
|
Datasheet |
SIP1x | Bulk | Obsolete | SIP | 5 (1 x 5) | Tin | 150.0µin (3.81µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyphenylene Sulfide (PPS), Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
SIP1X08-011BLFCONN SOCKET SIP 8POS GOLD |
2,548 |
|
Datasheet |
SIP1x | Bulk | Obsolete | SIP | 8 (1 x 8) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyphenylene Sulfide (PPS), Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
SIP1X07-014BLFCONN SOCKET SIP 7POS TIN |
3,609 |
|
Datasheet |
SIP1x | Bulk | Obsolete | SIP | 7 (1 x 7) | Tin | 150.0µin (3.81µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyphenylene Sulfide (PPS), Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
SIP1X06-011BLFCONN SOCKET SIP 6POS GOLD |
2,398 |
|
Datasheet |
SIP1x | Bulk | Obsolete | SIP | 6 (1 x 6) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyphenylene Sulfide (PPS), Glass Filled | 200.0µin (5.08µm) | Brass |
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