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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    0050395288

    0050395288

    CONN IC DIP SOCKET 28POS TINLEAD

    Molex

    3,605
    RFQ
    0050395288

    Datasheet

    - - Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin-Lead - - Through Hole Closed Frame - - - - - - -
    940-99-032-24-000000

    940-99-032-24-000000

    CONN SOCKET PLCC 32POS TIN-LEAD

    Mill-Max Manufacturing Corp.

    2,719
    RFQ
    940-99-032-24-000000

    Datasheet

    940 Tube Obsolete PLCC 32 (2 x 7, 2 x 9) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    SIP1X11-011B

    SIP1X11-011B

    SIP1X11-011B-SIP SOCKET 11 CTS

    Amphenol ICC (FCI)

    3,784
    RFQ
    SIP1X11-011B

    Datasheet

    SIP1x Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    AR 22-HGL-TT

    AR 22-HGL-TT

    SOCKET

    Assmann WSW Components

    2,759
    RFQ

    -

    AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    AR22-HZL-TT

    AR22-HZL-TT

    CONN IC DIP SOCKET 22POS TIN

    Assmann WSW Components

    3,446
    RFQ
    AR22-HZL-TT

    Datasheet

    - Bag Obsolete DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    115-83-306-41-003101

    115-83-306-41-003101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    3,953
    RFQ
    115-83-306-41-003101

    Datasheet

    115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-304-41-001101

    116-87-304-41-001101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    4,427
    RFQ
    116-87-304-41-001101

    Datasheet

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    A-CCS44-Z-SM

    A-CCS44-Z-SM

    CONN SOCKET PLCC 44POS TIN

    Assmann WSW Components

    2,274
    RFQ
    A-CCS44-Z-SM

    Datasheet

    - Bag Obsolete PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    HLS-0201-T-2

    HLS-0201-T-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,091
    RFQ
    HLS-0201-T-2

    Datasheet

    HLS Tube Active SIP 2 (2 x 1) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    940-99-044-24-000000

    940-99-044-24-000000

    CONN SOCKET PLCC 44POS TIN-LEAD

    Mill-Max Manufacturing Corp.

    4,634
    RFQ
    940-99-044-24-000000

    Datasheet

    940 Tube Obsolete PLCC 44 (4 x 11) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    940-99-020-17-400000

    940-99-020-17-400000

    CONN SOCKET PLCC 20POS TIN-LEAD

    Mill-Max Manufacturing Corp.

    2,896
    RFQ
    940-99-020-17-400000

    Datasheet

    940 Tube Obsolete PLCC 20 (4 x 5) 0.050" (1.27mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    AJ 24-LC

    AJ 24-LC

    SOCKET

    Assmann WSW Components

    4,579
    RFQ

    -

    - Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.070" (1.78mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
    123-83-304-41-001101

    123-83-304-41-001101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    3,205
    RFQ
    123-83-304-41-001101

    Datasheet

    123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    DIP318-011B

    DIP318-011B

    DIP318-011B-DIP SOCKET 18 CTS

    Amphenol ICC (FCI)

    3,288
    RFQ
    DIP318-011B

    Datasheet

    - Bag Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    04-1518-10T

    04-1518-10T

    CONN IC DIP SOCKET 4POS GOLD

    Aries Electronics

    4,827
    RFQ
    04-1518-10T

    Datasheet

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    SIP1X09-001B

    SIP1X09-001B

    SIP1X09-001B-SIP SOCKET 9 CTS

    Amphenol ICC (FCI)

    3,267
    RFQ
    SIP1X09-001B

    Datasheet

    SIP1x Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    SIP050-1X07-157B

    SIP050-1X07-157B

    1X07-157B-SIP SOCKET 7 CTS

    Amphenol ICC (FCI)

    2,854
    RFQ
    SIP050-1X07-157B

    Datasheet

    SIP050-1x Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    SIP1X13-011B

    SIP1X13-011B

    SIP1X13-011B-SIP SOCKET 13 CTS

    Amphenol ICC (FCI)

    2,473
    RFQ
    SIP1X13-011B

    Datasheet

    SIP1x Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    SIP050-1X06-160B

    SIP050-1X06-160B

    1X06-160B-SIP SOCKET 6 CTS

    Amphenol ICC (FCI)

    4,803
    RFQ
    SIP050-1X06-160B

    Datasheet

    SIP050-1x Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    AR20-HZL-TT

    AR20-HZL-TT

    CONN IC DIP SOCKET 20POS TIN

    Assmann WSW Components

    2,590
    RFQ
    AR20-HZL-TT

    Datasheet

    - Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
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