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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
AR 16 HGL-TTSOCKET |
2,704 |
|
Datasheet |
AR | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Gold | Polybutylene Terephthalate (PBT), Glass Filled | Flash | Brass |
|
940-99-068-24-000000CONN SOCKET PLCC 68POS TIN-LEAD |
4,855 |
|
Datasheet |
940 | Tube | Obsolete | PLCC | 68 (4 x 17) | Tin-Lead | 100.0µin (2.54µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
612-87-308-41-001101CONN IC DIP SOCKET 8POS GOLD |
2,158 |
|
Datasheet |
612 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
DIP316-014BDIP SOCKET 16 CTS |
3,231 |
|
Datasheet |
- | Bag | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Tin-Lead | 100.0µin (2.54µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 200.0µin (5.08µm) | Brass |
|
115-87-310-41-001101CONN IC DIP SOCKET 10POS GOLD |
4,677 |
|
- |
115 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 10 (2 x 5) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
AR 36-HZL-TTSOCKET |
2,693 |
|
- |
AR | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 36 (2 x 18) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT), Glass Filled | 200.0µin (5.08µm) | Brass |
|
A-CCS52-Z-SMCONN SOCKET PLCC 52POS TIN |
3,433 |
|
Datasheet |
- | Bag | Obsolete | PLCC | 52 (4 x 13) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Surface Mount | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | -55°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT), Glass Filled | 150.0µin (3.81µm) | Phosphor Bronze |
|
940-99-028-17-400000CONN SOCKET PLCC 28POS TIN-LEAD |
4,088 |
|
Datasheet |
940 | Tube | Obsolete | PLCC | 28 (4 x 7) | Tin-Lead | 100.0µin (2.54µm) | Beryllium Copper | Surface Mount | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
A14-LCG-T-RCONN IC DIP SOCKET 14POS GOLD |
2,139 |
|
Datasheet |
- | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | - | - | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Gold | Polybutylene Terephthalate (PBT), Glass Filled | - | - |
|
|
DIP320-011BDIP320-011B-DIP SOCKET 20 CTS |
2,432 |
|
Datasheet |
- | Bag | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
540-88-032-17-400-2CONN SOCKET PLCC 32POS TIN |
3,743 |
|
Datasheet |
540 | Bulk | Obsolete | PLCC | 32 (4 x 8) | Tin | - | Phosphor Bronze | Surface Mount | Board Guide, Closed Frame | 0.050" (1.27mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyphenylene Sulfide (PPS) | - | Phosphor Bronze |
|
|
AW 127-25/Z-TSOCKET 25 CONTACTS SINGLE ROW |
3,418 |
|
Datasheet |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
822475-2CONN SOCKET PLCC 32POS TIN |
3,864 |
|
Datasheet |
- | Tape & Reel (TR) | Obsolete | PLCC | 32 (2 x 7, 2 x 9) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Surface Mount | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | - | Tin | Polyphenylene Sulfide (PPS) | 150.0µin (3.81µm) | Phosphor Bronze |
|
4842-6004-CPCONN IC DIP SOCKET 42POS TIN |
4,063 |
|
- |
4800 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | Tin | 135.0µin (3.43µm) | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -25°C ~ 85°C | Tin | Polyester, Glass Filled | 135.0µin (3.43µm) | Phosphor Bronze |
|
AR24-HZL-TTCONN IC DIP SOCKET 24POS TIN |
3,724 |
|
Datasheet |
- | Bag | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Tin | - | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Thermoplastic, Polyester | 200.0µin (5.08µm) | Beryllium Copper |
|
|
04-1518-00CONN IC DIP SOCKET 4POS GOLD |
4,430 |
|
Datasheet |
518 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 4 (2 x 2) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
02-0518-11HCONN SOCKET SIP 2POS GOLD |
2,978 |
|
Datasheet |
518 | Bulk | Active | SIP | 2 (1 x 2) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Brass |
|
|
02-1518-11HCONN IC DIP SOCKET 2POS GOLD |
2,603 |
|
Datasheet |
518 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 2 (1 x 2) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Brass |
|
|
146-83-304-41-035101CONN IC DIP SOCKET 4POS GOLD |
2,078 |
|
Datasheet |
146 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 4 (2 x 2) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Press-Fit | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
146-83-304-41-036101CONN IC DIP SOCKET 4POS GOLD |
3,585 |
|
Datasheet |
146 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 4 (2 x 2) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Press-Fit | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
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