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Solder
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Composition | Diameter | Melting Point | Flux Type | Wire Gauge | Mesh Type | Process | Form | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SMDSW.031 1LBSOLDER WIRE 63/37 TIN/LEAD NO-CL Chip Quik Inc. |
20 |
|
Datasheet |
- | Bulk | Active | Wire Solder | Sn63Pb37 (63/37) | 0.031" (0.79mm) | 361°F (183°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | - |
|
NCSW.031 1LBSOLDER WIRE 63/37 TIN/LEAD NO-CL Chip Quik Inc. |
11 |
|
Datasheet |
- | Bulk | Active | Wire Solder | Sn63Pb37 (63/37) | 0.031" (0.79mm) | 361°F (183°C) | No-Clean | 20 AWG, 21 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | - |
|
SMDLTLFP60T4SN42/BI57.6/AG0.4 2-PART MIX 60G Chip Quik Inc. |
6 |
|
Datasheet |
- | Bulk | Active | Solder Paste, Two Part Mix | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 4 | Lead Free | Jar, 2.12 oz (60g) | 24 Months | Date of Manufacture | 37°F ~ 77°F (3°C ~ 25°C) |
|
WS991LT35T4THERMALLY STABLE SOLDER PASTE WS Chip Quik Inc. |
6 |
|
Datasheet |
CHIPQUIK® | Bulk | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 280°F (138°C) | Water Soluble | - | 4 | - | Syringe, 1.23 oz (34.869g) | 12 Months | Date of Manufacture | 37°F ~ 77°F (3°C ~ 25°C) |
|
NCSW.020 1LBSOLDER WIRE 63/37 TIN/LEAD NO-CL Chip Quik Inc. |
13 |
|
Datasheet |
- | Bulk | Active | Wire Solder | Sn63Pb37 (63/37) | 0.020" (0.51mm) | 361°F (183°C) | No-Clean | 24 AWG, 25 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | - |
|
SMD2SWLT.047 4OZSOLDER WIRE SN42/BI57.6/AG0.4 .0 Chip Quik Inc. |
8 |
|
Datasheet |
SMD2 | Bulk | Active | Wire Solder | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | 0.047" (1.19mm) | 280°F (138°C) | - | - | - | Lead Free | Spool, 4 oz (113.40g) | - | - | - |
|
SMD4300AX250T3SOLDER PASTE SN63/PB37 250G Chip Quik Inc. |
9 |
|
Datasheet |
CHIPQUIK® SMD4300 | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean, Water Soluble | - | 3 | Leaded | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SMD2SWLF.012 100GLF SOLDER WIRE 99.3/0.7 TIN/COPP Chip Quik Inc. |
17 |
|
Datasheet |
SMD2 | Bulk | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.012" (0.31mm) | 441°F (227°C) | No-Clean, Water Soluble | 28 AWG, 30 SWG | - | Lead Free | Spool, 3.53 oz (100g) | - | - | - |
|
REM4.5-ULTRA-NLULTRA LOW TEMP FLUX CORED CHIP R Chip Quik Inc. |
13 |
|
Datasheet |
CHIPQUIK® | Bulk | Active | - | - | - | 144°F (62°C) | No-Clean, Water Soluble | - | - | Lead Free | - | - | - | - |
|
EXB-SN62PB36AG2SOLDER BAR SN62/PB36/AG2 1LB (45 Chip Quik Inc. |
16 |
|
Datasheet |
Super Low Dross™ | Bulk | Active | Bar Solder | Sn62Pb36Ag2 (62/36/2) | - | 354°F (179°C) | - | - | - | Leaded | Bar, 1 lb (454g) | - | - | - |
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