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Solder
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Composition | Diameter | Melting Point | Flux Type | Wire Gauge | Mesh Type | Process | Form | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NCSWLF.015 4OZLF SOLDER WIRE 96.5/3/0.5 TIN/SI Chip Quik Inc. |
14 |
|
Datasheet |
CHIPQUIK® | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.015" (0.38mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | - | - | Spool, 4 oz (113.40g) | - | - | - |
|
SMD4300AX250T4SLDR PST WATR SOL 63/37 T4 250G Chip Quik Inc. |
10 |
|
Datasheet |
CHIPQUIK® SMD4300 | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean, Water Soluble | - | 4 | Leaded | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
BARSN42BI57AG1SOLDER BAR SN42/BI57/AG1 1LB SUP Chip Quik Inc. |
17 |
|
Datasheet |
Super Low Dross™ | Bulk | Active | Bar Solder | Bi57Sn42Ag1 (57/42/1) | - | 280°F (138°C) | - | - | - | Lead Free | Bar, 1 lb (454g) | - | - | - |
|
TS391AX250THERMALLY STABLE SOLDER PASTE NO Chip Quik Inc. |
2 |
|
Datasheet |
- | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 4 | Leaded | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) |
|
SMD4300SNL250T3SOLDER PASTE SAC305 250G T3 Chip Quik Inc. |
5 |
|
Datasheet |
CHIPQUIK® SMD4300 | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | 3 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SMDSWLF.031 8OZLF SOLDER WIRE 96.5/3/0.5 TIN/SI Chip Quik Inc. |
10 |
|
Datasheet |
- | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | - | Lead Free | Spool, 8 oz (227g), 1/2 lb | - | - | - |
|
RASWLF.031 8OZLF SOLDER WIRE 96.5/3/0.5 TIN/SI Chip Quik Inc. |
5 |
|
Datasheet |
- | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | 21 AWG, 20 SWG | - | Lead Free | Spool, 8 oz (227g), 1/2 lb | - | - | - |
|
SMDSWLF.020 8OZLF SOLDER WIRE 96.5/3/0.5 TIN/SI Chip Quik Inc. |
9 |
|
Datasheet |
- | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020" (0.51mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | - | Lead Free | Spool, 8 oz (227g), 1/2 lb | - | - | - |
|
NC191SNL250SMOOTH FLOW LEAD-FREE SOLDER PAS Chip Quik Inc. |
6 |
|
Datasheet |
Smooth Flow™ | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 422 ~ 428°F (217 ~ 220°C) | No-Clean | - | 4 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
NC191LT250SMOOTH FLOW LOW TEMP SOLDER PAST Chip Quik Inc. |
3 |
|
Datasheet |
Smooth Flow™ | Bulk | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 280°F (138°C) | No-Clean | - | 4 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
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