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    Heat Sinks

    制造商 Series Packaging Part Status Type Package Cooled Shape Length Width Diameter Fin Height Attachment Method Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material 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    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Package Cooled Shape Length Width Diameter Fin Height Attachment Method Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material Finish
    574602B03300G

    574602B03300G

    HEATSINK TO-220 CLIP-ON/TAB

    Boyd Laconia, LLC

    3,065
    RFQ
    574602B03300G

    Datasheet

    - Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 0.690" (17.53mm) 0.860" (21.84mm) - 0.395" (10.03mm) Clip and PC Pin 3.0W @ 60°C 6.00°C/W @ 600 LFM 21.60°C/W Aluminum Black Anodized
    V10196E1

    V10196E1

    CPU HEATSINK, CROSS CUT, AL6063,

    Assmann WSW Components

    2,100
    RFQ
    V10196E1

    Datasheet

    - Bag Active Top Mount CPU Square, Pin Fins 1.654" (42.00mm) 1.654" (42.00mm) - 0.992" (25.20mm) Thermal Tape, Adhesive (Not Included) - - 12.00°C/W Aluminum Black Anodized
    10-L4LB-11G

    10-L4LB-11G

    HEATSINK BGA W/PUSH PINS

    Boyd Laconia, LLC

    2,306
    RFQ
    10-L4LB-11G

    Datasheet

    - Bulk Active Top Mount BGA Square, Pin Fins 1.630" (41.40mm) 1.780" (45.21mm) - 0.461" (11.70mm) Push Pin 4.0W @ 60°C 4.90°C/W @ 200 LFM 14.20°C/W Aluminum Black Anodized
    642-60ABT1E

    642-60ABT1E

    HEATSINK FOR 35MM BGA

    Wakefield-Vette

    3,231
    RFQ
    642-60ABT1E

    Datasheet

    642 Bulk Active Top Mount BGA Square, Fins 1.378" (35.00mm) 1.378" (35.00mm) - 0.600" (15.24mm) Thermal Tape, Adhesive (Not Included) - 6.00°C/W @ 300 LFM - Aluminum Black Anodized
    628-40ABT4E

    628-40ABT4E

    HEATSINK FOR 45MM BGA

    Wakefield-Vette

    4,236
    RFQ
    628-40ABT4E

    Datasheet

    628 Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Square, Pin Fins 1.750" (44.45mm) 1.700" (43.18mm) - 4.000" (101.60mm) Thermal Tape, Adhesive (Included) 2.5W @ 30°C 4.00°C/W @ 300 LFM - Aluminum Black Anodized
    EH-210-H125-T411,FG,(GP)

    EH-210-H125-T411,FG,(GP)

    EH-210-H125-T411,FG,(GP)

    Boyd Laconia, LLC

    3,487
    RFQ

    -

    - Bulk Active - - - - - - - - - - - - -
    VRV-55-101E

    VRV-55-101E

    HEATSINK 55MM DEGREASED

    Ohmite

    2,726
    RFQ
    VRV-55-101E

    Datasheet

    VR Box Obsolete Board Level, Vertical TO-220, TO-247 Rectangular, Fins 2.165" (55.00mm) 1.335" (33.90mm) - 1.555" (39.50mm) Clip and PC Pin - - - Aluminum Degreased
    6399B- P2G

    6399B- P2G

    6399B- P2G

    Boyd Laconia, LLC

    4,172
    RFQ

    -

    - Bulk Active Board Level, Vertical TO-218, TO-220, TO-247 Rectangular, Fins 1.650" (41.91mm) 1.000" (25.40mm) - 2.000" (50.80mm) Bolt On and PC Pin 6.0W @ 30°C 2.00°C/W @ 300 LFM 3.30°C/W Aluminum Black Anodized
    500103B00000G

    500103B00000G

    HEATSINK TO-3 10W H=.50" BLK

    Boyd Laconia, LLC

    4,678
    RFQ
    500103B00000G

    Datasheet

    - Bag Not For New Designs Board Level TO-3 Square, Pin Fins 1.810" (45.97mm) 1.810" (45.97mm) - 0.500" (12.70mm) Bolt On 6.0W @ 50°C 2.50°C/W @ 400 LFM 7.20°C/W Aluminum Black Anodized
    508700B00000G

    508700B00000G

    HEATSINK 40-PIN DIP GLUE-ON BLK

    Boyd Laconia, LLC

    2,876
    RFQ
    508700B00000G

    Datasheet

    - Bag Active Top Mount 40-DIP Rectangular, Fins 2.000" (50.80mm) 0.530" (13.46mm) - 0.190" (4.83mm) Thermal Tape, Adhesive (Not Included) 1.0W @ 30°C 16.00°C/W @ 300 LFM 27.20°C/W Aluminum Black Anodized
    HSB22-606010

    HSB22-606010

    HEAT SINK, BGA, 60 X 60 X 10 MM

    Same Sky (Formerly CUI Devices)

    4,345
    RFQ
    HSB22-606010

    Datasheet

    HSB Box Active Top Mount BGA Square, Pin Fins 2.362" (60.00mm) 2.362" (60.00mm) - 0.394" (10.00mm) Adhesive (Not Included) 9.8W @ 75°C 2.60°C/W @ 200 LFM 7.62°C/W Aluminum Black Anodized
    7148DG

    7148DG

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    2,098
    RFQ
    7148DG

    Datasheet

    - Bulk Active Board Level, Vertical Multiwatt, SIP Rectangular, Fins 0.795" (20.19mm) 0.915" (23.24mm) - 0.380" (9.65mm) Clip and PC Pin 1.0W @ 30°C 6.00°C/W @ 600 LFM 16.00°C/W Copper Tin
    110070016

    110070016

    RPI HEAT SINK KIT COPPER/ALUM

    Seeed Technology Co., Ltd

    4,455
    RFQ
    110070016

    Datasheet

    - Bulk Obsolete Heat Spreader Kit, Top Mount Raspberry Pi Square - - - - - - - - Aluminum, Copper -
    628-65ABT4E

    628-65ABT4E

    HEATSINK FOR 45MM BGA

    Wakefield-Vette

    4,982
    RFQ
    628-65ABT4E

    Datasheet

    628 Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Square, Pin Fins 1.750" (44.45mm) 1.700" (43.18mm) - 0.650" (16.51mm) Thermal Tape, Adhesive (Included) 3.0W @ 20°C 2.00°C/W @ 400 LFM - Aluminum Black Anodized
    642-60ABT5

    642-60ABT5

    HEATSINK FOR 35MM BGA

    Wakefield-Vette

    3,541
    RFQ
    642-60ABT5

    Datasheet

    642 Bulk Active Top Mount BGA Square, Fins 1.378" (35.00mm) 1.378" (35.00mm) - 0.600" (15.24mm) Thermal Tape, Adhesive (Not Included) - 6.00°C/W @ 300 LFM - Aluminum Black Anodized
    579003B00000G

    579003B00000G

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    3,761
    RFQ
    579003B00000G

    Datasheet

    - Bulk Active Board Level TO-3 Rhombus 1.830" (46.48mm) 1.830" (46.48mm) - 1.000" (25.40mm) Bolt On 4.0W @ 30°C 3.50°C/W @ 200 LFM 6.00°C/W Aluminum Black Anodized
    547-24AB

    547-24AB

    HEATSINK DC/DC QUARTER BRICK

    Wakefield-Vette

    3,182
    RFQ
    547-24AB

    Datasheet

    547 Bulk Active Board Level, Vertical Quarter Brick DC/DC Converter Rectangular, Fins 1.450" (36.83mm) 2.280" (57.91mm) - 0.240" (6.10mm) Bolt On, Thermal Material - 3.50°C/W @ 300 LFM - Aluminum Black Anodized
    7020B-TC12-MTG

    7020B-TC12-MTG

    7020B-TC12-MTG

    Boyd Laconia, LLC

    2,628
    RFQ

    -

    - Bulk Active Board Level TO-220 Rectangular, Fins 1.255" (31.88mm) 0.470" (11.94mm) - 1.450" (36.83mm) Bolt On and PC Pin 4.0W @ 40°C 4.00°C/W @ 300 LFM - Aluminum Black Anodized
    628-40ABT5

    628-40ABT5

    HEATSINK FOR 45MM BGA

    Wakefield-Vette

    4,593
    RFQ
    628-40ABT5

    Datasheet

    628 Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Square, Pin Fins 1.750" (44.45mm) 1.700" (43.18mm) - 4.000" (101.60mm) Thermal Tape, Adhesive (Included) 2.5W @ 30°C 4.00°C/W @ 300 LFM - Aluminum Black Anodized
    MBH33051-23W/2.6

    MBH33051-23W/2.6

    AL HEAT SINK 33X33X23MM

    Malico Inc.

    4,081
    RFQ

    -

    - Active - - - - - - - - - - - - -
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