| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Package Cooled | Shape | Length | Width | Diameter | Fin Height | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material | Material Finish |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
530101B00100GBOARD LEVEL HEAT SINK |
4,625 |
|
Datasheet |
- | Bulk | Active | Board Level, Vertical | TO-218, TO-247 | Square, Fins | 1.750" (44.45mm) | 0.490" (12.44mm) | - | 1.750" (44.45mm) | Bolt On and Board Mounts | 4.0W @ 30°C | 1.50°C/W @ 400 LFM | 6.30°C/W | Aluminum | Black Anodized |
|
6299BG6299BG |
2,881 |
|
- |
- | Bulk | Active | Board Level, Vertical | TO-218, TO-220 | Rectangular, Fins | 1.638" (41.60mm) | 0.992" (25.20mm) | - | 2.000" (50.80mm) | Bolt On and PC Pin | - | - | 6.70°C/W | Aluminum | Black Anodized |
|
7129DGBOARD LEVEL HEAT SINK |
4,532 |
|
Datasheet |
- | Bulk | Active | Board Level | TO-220 | Rectangular, Fins | 1.040" (26.42mm) | 0.866" (22.00mm) | - | 0.375" (9.52mm) | Clip | 3.5W @ 70°C | 7.00°C/W @ 500 LFM | 19.20°C/W | Copper | Tin |
|
374424B60023G374424B60023G |
3,017 |
|
- |
- | Bulk | Active | Top Mount | BGA, FPGA | Square, Pin Fins | 1.063" (27.00mm) | 1.063" (27.00mm) | - | 0.709" (18.00mm) | Solder Anchor | 3.0W @ 50°C | 6.50°C/W @ 200 LFM | 20.30°C/W | Aluminum | Black Anodized |
|
580200W00000GBOARD LEVEL HEAT SINK |
2,488 |
|
Datasheet |
- | Bulk | Active | Top Mount | 14-DIP and 16-DIP | Rectangular, Fins | 0.890" (22.61mm) | 0.600" (15.24mm) | - | 0.410" (10.42mm) | Press Fit and PC Pin | 1.0W @ 20°C | 12.00°C/W @ 200 LFM | 20.00°C/W | Aluminum | Black Anodized |
|
FIT0818BLACK ALUMINUM HEATSINKKIT FOR R |
4,390 |
|
- |
- | Bulk | Active | Top Mount | Raspberry Pi 4B | Rectangular, Pin Fins | - | - | - | - | Thermal Tape, Adhesive (Included) | - | - | - | Aluminum | - |
|
628-25ABT1EHEATSINK FOR 45MM BGA |
3,485 |
|
Datasheet |
628 | Bulk | Active | Top Mount | Assorted (BGA, LGA, CPU, ASIC...) | Square, Pin Fins | 1.750" (44.45mm) | 1.700" (43.18mm) | - | 0.250" (6.35mm) | Thermal Tape, Adhesive (Included) | 4.5W @ 80°C | 7.00°C/W @ 300 LFM | - | Aluminum | Black Anodized |
|
E3A-T220-25EBLACK ANODIZED HEATSINK |
2,256 |
|
Datasheet |
EX | Bulk | Active | Board Level | Bridge Rectifiers | Square, Fins | 1.000" (25.40mm) | 1.000" (25.40mm) | - | 1.000" (25.40mm) | Bolt On | - | - | 12.40°C/W | Aluminum | Black Anodized |
|
628-65ABT5HEATSINK CPU 43MM SQ BLK H=.65" |
4,827 |
|
Datasheet |
628 | Bulk | Active | Top Mount | Assorted (BGA, LGA, CPU, ASIC...) | Square, Pin Fins | 1.750" (44.45mm) | 1.700" (43.18mm) | - | 0.650" (16.51mm) | Thermal Tape, Adhesive (Included) | 3.0W @ 20°C | 2.00°C/W @ 400 LFM | - | Aluminum | Black Anodized |
|
SW25-2GTHM,ZA3286 REV 6 SW25-2G |
3,365 |
|
- |
- | Bulk | Active | Board Level, Vertical | TO-218, TO-220, TO-247 | Rectangular, Fins | 0.984" (25.00mm) | 1.359" (34.50mm) | - | 0.492" (12.50mm) | Bolt On and PC Pin | 2.0W @ 30°C | 6.00°C/W @ 400 LFM | 13.00°C/W | Aluminum | Black Anodized |
|
KU-0334-AL-ST-1,2MM-2-A-VE/VZ-KU-0334-AL-ST-1,2MM-2-A-VE/VZ- |
3,343 |
|
- |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
VXV-55-101EEXTRUDED HEATSINK 55MM SOT-227 |
4,619 |
|
Datasheet |
VX | Box | Obsolete | Board Level | SOT-227 | Rectangular, Angled Fins | 1.917" (48.70mm) | 2.165" (55.00mm) | - | 1.181" (30.00mm) | Bolt On | - | - | - | Aluminum | Degreased |
|
1542500-1HTS795-1=HS UPLTD |
2,067 |
|
- |
- | Bag | Active | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
DV-T268-101E-TRTO-268 HEAT SINK /POLY TAPE |
3,480 |
|
Datasheet |
D | Tape & Reel (TR) | Active | Top Mount | TO-268 (D³Pak) | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | - | 0.400" (10.16mm) | Solderable Feet | 5.0W @ 35°C | 6.00°C/W @ 600 LFM | - | Aluminum | Degreased |
|
DV-T268-401E-TRTO-268 SMD HEAT SINK |
3,198 |
|
Datasheet |
D | Tape & Reel (TR) | Active | Top Mount | TO-268 (D³Pak) | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | - | 0.460" (11.68mm) | Solderable Feet | 9.0W @ 43°C | 5°C/W @ 500 LFM | - | Aluminum | Degreased |
|
DV-T263-401E-TRTO-263 SMD HEAT SINK |
3,550 |
|
Datasheet |
D | Tape & Reel (TR) | Active | Top Mount | TO-263 (D²Pak) | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | - | 0.460" (11.68mm) | Solderable Feet | 7.0W @ 45°C | 7°C/W @ 500 LFM | - | Aluminum | Degreased |
|
TV58GTHM,ZA2102 ISS 4 TV-58G |
3,157 |
|
- |
- | Bulk | Active | Board Level | TO-220 | Rectangular, Fins | 0.887" (22.53mm) | 0.749" (19.03mm) | - | 0.433" (11.00mm) | Bolt On | 1.5W @ 50°C | 14.00°C/W @ 400 LFM | 30.00°C/W | Aluminum | Black Anodized |
|
241804B91200G241804B91200G |
3,133 |
|
- |
- | Bulk | Active | Top Mount | Eighth Brick DC/DC Converter | Rectangular, Fins | 2.280" (57.90mm) | 0.902" (22.90mm) | - | 0.449" (11.40mm) | Bolt On | - | 3.00°C/W @ 500 LFM | 5.50°C/W | - | - |
|
325705R00000GBOARD LEVEL HEAT SINK |
4,194 |
|
Datasheet |
- | Bulk | Active | Board Level | TO-5 | Cylindrical | - | - | 0.318" (8.07mm) ID, 0.500" (12.70mm) OD | 0.250" (6.35mm) | Press Fit | 1.0W @ 60°C | 35.00°C/W @ 200 LFM | 60.00°C/W | Aluminum | Red Anodized |
|
10-5607-04G10-5607-04G |
3,572 |
|
- |
- | Bulk | Active | Board Level | BGA, FPGA | Square, Fins | 1.470" (37.34mm) | 1.470" (37.34mm) | - | 0.390" (9.91mm) | Push Pin, Thermal Material | 3.0W @ 70°C | 7.00°C/W @ 200 LFM | 22.10°C/W | Aluminum | Black Anodized |