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    Heat Sinks

    制造商 Series Packaging Part Status Type Package Cooled Shape Length Width Diameter Fin Height Attachment Method Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material 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    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Package Cooled Shape Length Width Diameter Fin Height Attachment Method Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material Finish
    530101B00100G

    530101B00100G

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    4,625
    RFQ
    530101B00100G

    Datasheet

    - Bulk Active Board Level, Vertical TO-218, TO-247 Square, Fins 1.750" (44.45mm) 0.490" (12.44mm) - 1.750" (44.45mm) Bolt On and Board Mounts 4.0W @ 30°C 1.50°C/W @ 400 LFM 6.30°C/W Aluminum Black Anodized
    6299BG

    6299BG

    6299BG

    Boyd Laconia, LLC

    2,881
    RFQ

    -

    - Bulk Active Board Level, Vertical TO-218, TO-220 Rectangular, Fins 1.638" (41.60mm) 0.992" (25.20mm) - 2.000" (50.80mm) Bolt On and PC Pin - - 6.70°C/W Aluminum Black Anodized
    7129DG

    7129DG

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    4,532
    RFQ
    7129DG

    Datasheet

    - Bulk Active Board Level TO-220 Rectangular, Fins 1.040" (26.42mm) 0.866" (22.00mm) - 0.375" (9.52mm) Clip 3.5W @ 70°C 7.00°C/W @ 500 LFM 19.20°C/W Copper Tin
    374424B60023G

    374424B60023G

    374424B60023G

    Boyd Laconia, LLC

    3,017
    RFQ

    -

    - Bulk Active Top Mount BGA, FPGA Square, Pin Fins 1.063" (27.00mm) 1.063" (27.00mm) - 0.709" (18.00mm) Solder Anchor 3.0W @ 50°C 6.50°C/W @ 200 LFM 20.30°C/W Aluminum Black Anodized
    580200W00000G

    580200W00000G

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    2,488
    RFQ
    580200W00000G

    Datasheet

    - Bulk Active Top Mount 14-DIP and 16-DIP Rectangular, Fins 0.890" (22.61mm) 0.600" (15.24mm) - 0.410" (10.42mm) Press Fit and PC Pin 1.0W @ 20°C 12.00°C/W @ 200 LFM 20.00°C/W Aluminum Black Anodized
    FIT0818

    FIT0818

    BLACK ALUMINUM HEATSINKKIT FOR R

    DFRobot

    4,390
    RFQ

    -

    - Bulk Active Top Mount Raspberry Pi 4B Rectangular, Pin Fins - - - - Thermal Tape, Adhesive (Included) - - - Aluminum -
    628-25ABT1E

    628-25ABT1E

    HEATSINK FOR 45MM BGA

    Wakefield-Vette

    3,485
    RFQ
    628-25ABT1E

    Datasheet

    628 Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Square, Pin Fins 1.750" (44.45mm) 1.700" (43.18mm) - 0.250" (6.35mm) Thermal Tape, Adhesive (Included) 4.5W @ 80°C 7.00°C/W @ 300 LFM - Aluminum Black Anodized
    E3A-T220-25E

    E3A-T220-25E

    BLACK ANODIZED HEATSINK

    Ohmite

    2,256
    RFQ
    E3A-T220-25E

    Datasheet

    EX Bulk Active Board Level Bridge Rectifiers Square, Fins 1.000" (25.40mm) 1.000" (25.40mm) - 1.000" (25.40mm) Bolt On - - 12.40°C/W Aluminum Black Anodized
    628-65ABT5

    628-65ABT5

    HEATSINK CPU 43MM SQ BLK H=.65"

    Wakefield-Vette

    4,827
    RFQ
    628-65ABT5

    Datasheet

    628 Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Square, Pin Fins 1.750" (44.45mm) 1.700" (43.18mm) - 0.650" (16.51mm) Thermal Tape, Adhesive (Included) 3.0W @ 20°C 2.00°C/W @ 400 LFM - Aluminum Black Anodized
    SW25-2G

    SW25-2G

    THM,ZA3286 REV 6 SW25-2G

    Boyd Laconia, LLC

    3,365
    RFQ

    -

    - Bulk Active Board Level, Vertical TO-218, TO-220, TO-247 Rectangular, Fins 0.984" (25.00mm) 1.359" (34.50mm) - 0.492" (12.50mm) Bolt On and PC Pin 2.0W @ 30°C 6.00°C/W @ 400 LFM 13.00°C/W Aluminum Black Anodized
    KU-0334-AL-ST-1,2MM-2-A-VE/VZ-

    KU-0334-AL-ST-1,2MM-2-A-VE/VZ-

    KU-0334-AL-ST-1,2MM-2-A-VE/VZ-

    Boyd Laconia, LLC

    3,343
    RFQ

    -

    - Bulk Active - - - - - - - - - - - - -
    VXV-55-101E

    VXV-55-101E

    EXTRUDED HEATSINK 55MM SOT-227

    Ohmite

    4,619
    RFQ
    VXV-55-101E

    Datasheet

    VX Box Obsolete Board Level SOT-227 Rectangular, Angled Fins 1.917" (48.70mm) 2.165" (55.00mm) - 1.181" (30.00mm) Bolt On - - - Aluminum Degreased
    1542500-1

    1542500-1

    HTS795-1=HS UPLTD

    TE Connectivity AMP Connectors

    2,067
    RFQ

    -

    - Bag Active - - - - - - - - - - - - -
    DV-T268-101E-TR

    DV-T268-101E-TR

    TO-268 HEAT SINK /POLY TAPE

    Ohmite

    3,480
    RFQ
    DV-T268-101E-TR

    Datasheet

    D Tape & Reel (TR) Active Top Mount TO-268 (D³Pak) Rectangular, Fins 0.500" (12.70mm) 1.220" (30.99mm) - 0.400" (10.16mm) Solderable Feet 5.0W @ 35°C 6.00°C/W @ 600 LFM - Aluminum Degreased
    DV-T268-401E-TR

    DV-T268-401E-TR

    TO-268 SMD HEAT SINK

    Ohmite

    3,198
    RFQ
    DV-T268-401E-TR

    Datasheet

    D Tape & Reel (TR) Active Top Mount TO-268 (D³Pak) Rectangular, Fins 0.500" (12.70mm) 1.220" (30.99mm) - 0.460" (11.68mm) Solderable Feet 9.0W @ 43°C 5°C/W @ 500 LFM - Aluminum Degreased
    DV-T263-401E-TR

    DV-T263-401E-TR

    TO-263 SMD HEAT SINK

    Ohmite

    3,550
    RFQ
    DV-T263-401E-TR

    Datasheet

    D Tape & Reel (TR) Active Top Mount TO-263 (D²Pak) Rectangular, Fins 0.500" (12.70mm) 1.030" (26.16mm) - 0.460" (11.68mm) Solderable Feet 7.0W @ 45°C 7°C/W @ 500 LFM - Aluminum Degreased
    TV58G

    TV58G

    THM,ZA2102 ISS 4 TV-58G

    Boyd Laconia, LLC

    3,157
    RFQ

    -

    - Bulk Active Board Level TO-220 Rectangular, Fins 0.887" (22.53mm) 0.749" (19.03mm) - 0.433" (11.00mm) Bolt On 1.5W @ 50°C 14.00°C/W @ 400 LFM 30.00°C/W Aluminum Black Anodized
    241804B91200G

    241804B91200G

    241804B91200G

    Boyd Laconia, LLC

    3,133
    RFQ

    -

    - Bulk Active Top Mount Eighth Brick DC/DC Converter Rectangular, Fins 2.280" (57.90mm) 0.902" (22.90mm) - 0.449" (11.40mm) Bolt On - 3.00°C/W @ 500 LFM 5.50°C/W - -
    325705R00000G

    325705R00000G

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    4,194
    RFQ
    325705R00000G

    Datasheet

    - Bulk Active Board Level TO-5 Cylindrical - - 0.318" (8.07mm) ID, 0.500" (12.70mm) OD 0.250" (6.35mm) Press Fit 1.0W @ 60°C 35.00°C/W @ 200 LFM 60.00°C/W Aluminum Red Anodized
    10-5607-04G

    10-5607-04G

    10-5607-04G

    Boyd Laconia, LLC

    3,572
    RFQ

    -

    - Bulk Active Board Level BGA, FPGA Square, Fins 1.470" (37.34mm) 1.470" (37.34mm) - 0.390" (9.91mm) Push Pin, Thermal Material 3.0W @ 70°C 7.00°C/W @ 200 LFM 22.10°C/W Aluminum Black Anodized
    Total 122183 Record«Prev1... 22242225222622272228222922302231...6110Next»
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