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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
110-87-318-41-001101CONN IC DIP SOCKET 18POS GOLD |
247 |
|
Datasheet |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
08-4513-10CONN IC DIP SOCKET 8POS GOLD |
1,650 |
|
Datasheet |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 8 (2 x 4) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
08-2513-10CONN IC DIP SOCKET 8POS GOLD |
293 |
|
Datasheet |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 8 (2 x 4) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
16-3518-10CONN IC DIP SOCKET 16POS GOLD |
243 |
|
Datasheet |
518 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
110-99-320-41-001000CONN IC DIP SOCKET 20POS TINLEAD |
1,808 |
|
Datasheet |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Tin-Lead | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
917-47-103-41-005000CONN SOCKET TRANSIST TO-5 3POS |
711 |
|
Datasheet |
917 | Tube | Active | Transistor, TO-5 | 3 (Round) | Gold | Flash | Beryllium Copper | Through Hole | Closed Frame | - | Solder | - | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
110-44-320-41-001000CONN IC DIP SOCKET 20POS TIN |
489 |
|
Datasheet |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Tin | 100.0µin (2.54µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
AR 16-HZL/01-TTCONN IC DIP SOCKET 16POS GOLD |
5,069 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Thermoplastic, Polyester | 200.0µin (5.08µm) | Beryllium Copper |
|
SA286040CONN IC DIP SOCKET 28POS GOLD |
500 |
|
Datasheet |
SA | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Gold | Thermoplastic, Polyester, Glass Filled | 80.0µin (2.03µm) | Brass |
|
SA283040CONN IC DIP SOCKET 28POS GOLD |
129 |
|
Datasheet |
SA | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Gold | Thermoplastic, Polyester, Glass Filled | 80.0µin (2.03µm) | Brass |
|
SA326000CONN IC DIP SOCKET 32POS GOLD |
237 |
|
Datasheet |
SA | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Thermoplastic, Polyester, Glass Filled | 200.0µin (5.08µm) | Brass |
|
115-43-308-41-003000CONN IC DIP SOCKET 8POS GOLD |
995 |
|
Datasheet |
115 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
PLCC-84-ATPLCC 84P THROUGH HOLE |
522 |
|
Datasheet |
PLCC | Tube | Active | PLCC | 84 (4 x 21) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Through Hole | Closed Frame | 0.050" (1.27mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT), Glass Filled | 80.0µin (2.03µm) | Phosphor Bronze |
|
ICM-640-1-GT-HTMACHINE PIN SOCKET, IC, DIP, 40P |
217 |
|
Datasheet |
ICM | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polyphenylene Sulfide (PPS) | - | Beryllium Copper |
|
917-47-104-41-005000CONN SOCKET TRANSIST TO-5 4POS |
804 |
|
Datasheet |
917 | Tube | Active | Transistor, TO-5 | 4 (Round) | Gold | Flash | Beryllium Copper | Through Hole | Closed Frame | - | Solder | - | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
114-87-318-41-134161CONN IC DIP SOCKET 18POS GOLD |
495 |
|
Datasheet |
114 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
110-47-320-41-001000CONN IC DIP SOCKET 20POS GOLD |
584 |
|
Datasheet |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
111-93-308-41-001000CONN IC DIP SOCKET 8POS GOLD |
2,149 |
|
Datasheet |
111 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
D2814-42CONN IC DIP SOCKET 14POS GOLD |
16,792 |
|
Datasheet |
D2 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Plastic | 196.9µin (5.00µm) | Brass |
|
8420-11B1-RK-TPCONN SOCKET PLCC 20POS TIN |
1,048 |
|
Datasheet |
8400 | Tube | Active | PLCC | 20 (4 x 5) | Tin | 160.0µin (4.06µm) | Copper Alloy | Through Hole | Closed Frame | 0.050" (1.27mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT), Glass Filled | 160.0µin (4.06µm) | Copper Alloy |
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